{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,28]],"date-time":"2025-10-28T10:43:38Z","timestamp":1761648218728,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":20,"publisher":"ACM","license":[{"start":{"date-parts":[[2014,10,12]],"date-time":"2014-10-12T00:00:00Z","timestamp":1413072000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2014,10,12]]},"DOI":"10.1145\/2656075.2656103","type":"proceedings-article","created":{"date-parts":[[2014,10,7]],"date-time":"2014-10-07T12:57:59Z","timestamp":1412686679000},"page":"1-10","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":80,"title":["TSP: thermal safe power"],"prefix":"10.1145","author":[{"given":"Santiago","family":"Pagani","sequence":"first","affiliation":[{"name":"Karlsruhe Institute of Technology (KIT), Germany"}]},{"given":"Heba","family":"Khdr","sequence":"additional","affiliation":[{"name":"Karlsruhe Institute of Technology (KIT), Germany"}]},{"given":"Waqaas","family":"Munawar","sequence":"additional","affiliation":[{"name":"Karlsruhe Institute of Technology (KIT), Germany"}]},{"given":"Jian-Jia","family":"Chen","sequence":"additional","affiliation":[{"name":"TU Dortmund University, Germany"}]},{"given":"Muhammad","family":"Shafique","sequence":"additional","affiliation":[{"name":"Karlsruhe Institute of Technology (KIT), Germany"}]},{"given":"Minming","family":"Li","sequence":"additional","affiliation":[{"name":"City University of Hong Kong, China"}]},{"given":"J\u00f6rg","family":"Henkel","sequence":"additional","affiliation":[{"name":"Chair for Embedded Systems (CES) Karlsruhe Institute of Technology (KIT), Germany"}]}],"member":"320","published-online":{"date-parts":[[2014,10,12]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/1454115.1454128"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/2024716.2024718"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593117"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/SC.Companion.2012.93"},{"key":"e_1_3_2_1_5_1","volume-title":"Linear Programming 2: Theory and Extensions","author":"Dantzig G.","year":"2003","unstructured":"G. Dantzig and M. Thapa . Linear Programming 2: Theory and Extensions . Springer-Verlag , 2003 . G. Dantzig and M. Thapa. Linear Programming 2: Theory and Extensions. Springer-Verlag, 2003."},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1145\/2039370.2039401"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/2000064.2000108"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757358"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"e_1_3_2_1_10_1","volume-title":"Dual-core intel xeon processor 5100 series datasheet, revision","author":"Intel Corporation","year":"2007","unstructured":"Intel Corporation . Dual-core intel xeon processor 5100 series datasheet, revision 003, August 2007 . Intel Corporation. Dual-core intel xeon processor 5100 series datasheet, revision 003, August 2007."},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593094"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/2380445.2380487"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1629926"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488949"},{"key":"e_1_3_2_1_16_1","volume-title":"Hot Chips","author":"Nussbaum S.","year":"2012","unstructured":"S. Nussbaum . AMD trinity APU . In Hot Chips , 2012 . S. Nussbaum. AMD trinity APU. In Hot Chips, 2012."},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1145\/2656075.2656091"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.5555\/2485288.2485301"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2012.12"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593229"}],"event":{"name":"ESWEEK'14: TENTH EMBEDDED SYSTEM WEEK","sponsor":["SIGBED ACM Special Interest Group on Embedded Systems","SIGDA ACM Special Interest Group on Design Automation","IEEE CAS","IEEE Council on Electronic Design Automation (CEDA)","SIGMICRO ACM Special Interest Group on Microarchitectural Research and Processing"],"location":"New Delhi India","acronym":"ESWEEK'14"},"container-title":["Proceedings of the 2014 International Conference on Hardware\/Software Codesign and System Synthesis"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2656075.2656103","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2656075.2656103","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T07:19:35Z","timestamp":1750231175000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2656075.2656103"}},"subtitle":["efficient power budgeting for many-core systems in dark silicon"],"short-title":[],"issued":{"date-parts":[[2014,10,12]]},"references-count":20,"alternative-id":["10.1145\/2656075.2656103","10.1145\/2656075"],"URL":"https:\/\/doi.org\/10.1145\/2656075.2656103","relation":{},"subject":[],"published":{"date-parts":[[2014,10,12]]},"assertion":[{"value":"2014-10-12","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}