{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:15:48Z","timestamp":1750306548506,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":16,"publisher":"ACM","license":[{"start":{"date-parts":[[2015,5,20]],"date-time":"2015-05-20T00:00:00Z","timestamp":1432080000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2015,5,20]]},"DOI":"10.1145\/2742060.2742064","type":"proceedings-article","created":{"date-parts":[[2015,5,19]],"date-time":"2015-05-19T13:49:03Z","timestamp":1432043343000},"page":"3-8","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Efficient Test Application for Rapid Multi-Temperature Testing"],"prefix":"10.1145","author":[{"given":"Nima","family":"Aghaee","sequence":"first","affiliation":[{"name":"Linkoping University, Link\u00f6ping, Sweden"}]},{"given":"Zebo","family":"Peng","sequence":"additional","affiliation":[{"name":"Linkoping University, Link\u00f6ping, Sweden"}]},{"given":"Petru","family":"Eles","sequence":"additional","affiliation":[{"name":"Linkoping University, Link\u00f6ping, Sweden"}]}],"member":"320","published-online":{"date-parts":[[2015,5,20]]},"reference":[{"volume-title":"High","author":"Needham W.","key":"e_1_3_2_1_1_1"},{"volume-title":"Parametric failures in CMOS ICs - a defect-based analysis,\" ITC","year":"2002","author":"Segura J.","key":"e_1_3_2_1_2_1"},{"volume-title":"Multi-temperature testing for core-based system-on-chip,\" DATE","year":"2010","author":"He Z.","key":"e_1_3_2_1_3_1"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2011.26"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSID.2014.13"},{"issue":"4","key":"e_1_3_2_1_6_1","first-page":"5","article-title":"Physical failure analysis in semiconductor industry - challenges of the copper interconnect process","volume":"5","author":"Zschech E.","year":"2002","journal-title":"Mater. Sci. Semicond. Process."},{"volume-title":"Cold delay defect screening,\" VTS","year":"2000","author":"Tseng C.-W.","key":"e_1_3_2_1_7_1"},{"key":"e_1_3_2_1_8_1","unstructured":"J. C. Li C.-W. Tseng and E. J. McCluskey \"Testing for resistive opens and stuck opens \" ITC 2001.   J. C. Li C.-W. Tseng and E. J. McCluskey \"Testing for resistive opens and stuck opens \" ITC 2001."},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/43.736572"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.802256"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2006679"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2009.36"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-013-5374-z"},{"volume-title":"An efficient temperature-gradient based burn-in technique for 3D stacked ICs,\" DATE","year":"2014","author":"Aghaee N.","key":"e_1_3_2_1_15_1"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1007\/s11721-007-0002-0"}],"event":{"name":"GLSVLSI '15: Great Lakes Symposium on VLSI 2015","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CEDA","IEEE CASS"],"location":"Pittsburgh Pennsylvania USA","acronym":"GLSVLSI '15"},"container-title":["Proceedings of the 25th edition on Great Lakes Symposium on VLSI"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2742060.2742064","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2742060.2742064","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T06:12:38Z","timestamp":1750227158000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2742060.2742064"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,5,20]]},"references-count":16,"alternative-id":["10.1145\/2742060.2742064","10.1145\/2742060"],"URL":"https:\/\/doi.org\/10.1145\/2742060.2742064","relation":{},"subject":[],"published":{"date-parts":[[2015,5,20]]},"assertion":[{"value":"2015-05-20","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}