{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:17:42Z","timestamp":1750306662473,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":19,"publisher":"ACM","license":[{"start":{"date-parts":[[2015,5,20]],"date-time":"2015-05-20T00:00:00Z","timestamp":1432080000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"National Natural Science Foundation of China (NSFC)","award":["61306049","61402031","61204027"],"award-info":[{"award-number":["61306049","61402031","61204027"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2015,5,20]]},"DOI":"10.1145\/2742060.2742071","type":"proceedings-article","created":{"date-parts":[[2015,5,19]],"date-time":"2015-05-19T13:49:03Z","timestamp":1432043343000},"page":"21-26","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["An Effective TSV Self-Repair Scheme for 3D-Stacked ICs"],"prefix":"10.1145","author":[{"given":"Songwei","family":"Pei","sequence":"first","affiliation":[{"name":"College of Information and Technology, Beijing University of Chemical Technology, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jingdong","family":"Zhang","sequence":"additional","affiliation":[{"name":"College of Information and Technology, Beijing University of Chemical Technology, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu","family":"Jin","sequence":"additional","affiliation":[{"name":"College of Information and Technology, Beijing University of Chemical Technology, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Song","family":"Jin","sequence":"additional","affiliation":[{"name":"Department of Electronic and Communication Engineering, School of Electrical and Electronic Engineering, North China Electric Power University, Baoding, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Computer and Information, Hefei University of Technology, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weizhi","family":"Xu","sequence":"additional","affiliation":[{"name":"Tsinghua University, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2015,5,20]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/1148015.1148016"},{"key":"e_1_3_2_1_2_1","first-page":"476","article-title":"Chip scale camera module (CSCM) using through-silicon-via (TSV)","author":"Yoshikawa H.","year":"2009","journal-title":"Proceedings of IEEE International Solid- State Circuits Conference"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"e_1_3_2_1_5_1","first-page":"1","article-title":"A 3D packaging technology for 4 Gbit stacked DRAM with 3Gbps data transfer","author":"Kawano M.","year":"2006","journal-title":"Proceedings of IEEE International Electron Devices Meeting"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.5555\/1502129"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2010.2068572"},{"volume-title":"Electrical tests for three-dimensional ICs(3DICs) with TSVs,\" International Test Conference 3D-test Workshop","year":"2010","author":"Peng C.-N","key":"e_1_3_2_1_8_1"},{"key":"e_1_3_2_1_9_1","first-page":"682","article-title":"Performance and reliability analysis of 3D-integration structures employing through silicon via (TSV)","author":"Karmarkar A.","year":"2009","journal-title":"Proceedings of IEEE International Reliability Physics Symposium"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488824"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"volume-title":"Architecture and design issures in 3-D IC,\" Proceedings of IEEE\/ACM Design, Automation, and Test in Europe (DATE), pp: 166--171","year":"2010","author":"Hwang A.-C.","key":"e_1_3_2_1_12_1"},{"key":"e_1_3_2_1_13_1","first-page":"598","volume-title":"Proceedings of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)","author":"Loi I.","year":"2008"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2011.37"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2228742"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2012.6313847"},{"key":"e_1_3_2_1_17_1","first-page":"1","article-title":"Testing 3D Chips Containing Through-Silicon Vias","author":"Marinissen E. J.","year":"2009","journal-title":"Proceedings of International Test Conference (ITC)"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.5555\/1870926.1871336"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/DFTVS.2005.28"}],"event":{"name":"GLSVLSI '15: Great Lakes Symposium on VLSI 2015","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CEDA","IEEE CASS"],"location":"Pittsburgh Pennsylvania USA","acronym":"GLSVLSI '15"},"container-title":["Proceedings of the 25th edition on Great Lakes Symposium on VLSI"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2742060.2742071","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2742060.2742071","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T07:00:32Z","timestamp":1750230032000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2742060.2742071"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,5,20]]},"references-count":19,"alternative-id":["10.1145\/2742060.2742071","10.1145\/2742060"],"URL":"https:\/\/doi.org\/10.1145\/2742060.2742071","relation":{},"subject":[],"published":{"date-parts":[[2015,5,20]]},"assertion":[{"value":"2015-05-20","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}