{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T06:40:09Z","timestamp":1750228809051,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":8,"publisher":"ACM","license":[{"start":{"date-parts":[[2015,6,7]],"date-time":"2015-06-07T00:00:00Z","timestamp":1433635200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2015,6,7]]},"DOI":"10.1145\/2744769.2744917","type":"proceedings-article","created":{"date-parts":[[2015,6,2]],"date-time":"2015-06-02T05:35:02Z","timestamp":1433223302000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":7,"title":["Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications"],"prefix":"10.1145","author":[{"given":"Shreepad","family":"Panth","sequence":"first","affiliation":[{"name":"Georgia Institute of Technology, Atlanta, GA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kambiz","family":"Samadi","sequence":"additional","affiliation":[{"name":"Qualcomm Research, San Diego, CA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yang","family":"Du","sequence":"additional","affiliation":[{"name":"Qualcomm Research, San Diego, CA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sung Kyu","family":"Lim","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology, Atlanta, GA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2015,6,7]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424352"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2004.1382591"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488863"},{"volume-title":"Proc. Asia and South Pacific Design Automation Conf.","year":"2012","author":"Li Z.","key":"e_1_3_2_1_4_1"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/2627369.2627642"},{"key":"e_1_3_2_1_6_1","unstructured":"Personal communication with industry partner.  Personal communication with industry partner."},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593140"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.5555\/2691365.2691477"}],"event":{"name":"DAC '15: The 52nd Annual Design Automation Conference 2015","sponsor":["SIGDA ACM Special Interest Group on Design Automation"],"location":"San Francisco California","acronym":"DAC '15"},"container-title":["Proceedings of the 52nd Annual Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2744769.2744917","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2744769.2744917","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T06:12:36Z","timestamp":1750227156000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2744769.2744917"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,6,7]]},"references-count":8,"alternative-id":["10.1145\/2744769.2744917","10.1145\/2744769"],"URL":"https:\/\/doi.org\/10.1145\/2744769.2744917","relation":{},"subject":[],"published":{"date-parts":[[2015,6,7]]},"assertion":[{"value":"2015-06-07","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}