{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,27]],"date-time":"2026-02-27T03:47:21Z","timestamp":1772164041474,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":43,"publisher":"ACM","license":[{"start":{"date-parts":[[2015,6,13]],"date-time":"2015-06-13T00:00:00Z","timestamp":1434153600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2015,6,13]]},"DOI":"10.1145\/2749469.2749474","type":"proceedings-article","created":{"date-parts":[[2015,5,26]],"date-time":"2015-05-26T10:36:25Z","timestamp":1432636585000},"page":"439-449","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":39,"title":["Thermal time shifting"],"prefix":"10.1145","author":[{"given":"Matt","family":"Skach","sequence":"first","affiliation":[{"name":"University of Michigan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Manish","family":"Arora","sequence":"additional","affiliation":[{"name":"Advanced Micro Devices, Inc. and University of California, San Diego"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chang-Hong","family":"Hsu","sequence":"additional","affiliation":[{"name":"University of Michigan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qi","family":"Li","sequence":"additional","affiliation":[{"name":"University of California, San Diego"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dean","family":"Tullsen","sequence":"additional","affiliation":[{"name":"University of California, San Diego"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lingjia","family":"Tang","sequence":"additional","affiliation":[{"name":"University of Michigan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jason","family":"Mars","sequence":"additional","affiliation":[{"name":"University of Michigan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2015,6,13]]},"reference":[{"key":"e_1_3_2_1_1_1","volume-title":"The datacenter as a computer: An introduction to the design of warehouse-scale machines,\" Synthesis lectures on computer architecture","author":"Barroso L. A.","unstructured":"L. A. Barroso and U. H\u00f6lzle , \" The datacenter as a computer: An introduction to the design of warehouse-scale machines,\" Synthesis lectures on computer architecture , vol. 4 , no. 1, pp. 1--108, 2009. L. A. Barroso and U. H\u00f6lzle, \"The datacenter as a computer: An introduction to the design of warehouse-scale machines,\" Synthesis lectures on computer architecture, vol. 4, no. 1, pp. 1--108, 2009."},{"key":"e_1_3_2_1_2_1","volume-title":"Energy Efficiency & Renewable Energy","author":"Burdick A.","year":"2011","unstructured":"A. Burdick , Strategy Guideline: Accurate Heating and Cooling Load Calculations. US Department of Energy , Energy Efficiency & Renewable Energy , Building Technologies Program , 2011 . A. Burdick, Strategy Guideline: Accurate Heating and Cooling Load Calculations. US Department of Energy, Energy Efficiency & Renewable Energy, Building Technologies Program, 2011."},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/1273440.1250665"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICAC.2005.17"},{"key":"e_1_3_2_1_5_1","unstructured":"\"Fusion-io products \" http:\/\/www.fusionio.com\/products\/ 2014 Online; accessed 1-August-2014.  \"Fusion-io products \" http:\/\/www.fusionio.com\/products\/ 2014 Online; accessed 1-August-2014."},{"key":"e_1_3_2_1_6_1","volume-title":"Thermal storage system provides emergency data center cooling,\" White Paper Intel Information Technology","author":"Garday D.","year":"2007","unstructured":"D. Garday and J. Housley , \" Thermal storage system provides emergency data center cooling,\" White Paper Intel Information Technology , Intel Corporation , 2007 . D. Garday and J. Housley, \"Thermal storage system provides emergency data center cooling,\" White Paper Intel Information Technology, Intel Corporation, 2007."},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/2490301.2451123"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1145\/2000064.2000105"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1145\/2189750.2150985"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1145\/2427631.2427633"},{"key":"e_1_3_2_1_11_1","unstructured":"D. Hale M. Hoover and M. ONeill \"Phase-change materials handbook \" 1972.  D. Hale M. Hoover and M. ONeill \"Phase-change materials handbook \" 1972."},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.rser.2007.01.023"},{"key":"e_1_3_2_1_13_1","first-page":"40","article-title":"Tradeoffs between power management and tail latency in warehouse-scale applications","volume":"20","author":"Kanev S.","year":"2014","unstructured":"S. Kanev , K. Hazelwood , G.-Y. Wei , and D. Brooks , \" Tradeoffs between power management and tail latency in warehouse-scale applications ,\" Power , vol. 20 , p. 40 , 2014 . S. Kanev, K. Hazelwood, G.-Y. Wei, and D. Brooks, \"Tradeoffs between power management and tail latency in warehouse-scale applications,\" Power, vol. 20, p. 40, 2014.","journal-title":"Power"},{"key":"e_1_3_2_1_14_1","first-page":"488","volume-title":"2012 39th Annual International Symposium on. IEEE","author":"Kontorinis V.","year":"2012","unstructured":"V. Kontorinis , L. E. Zhang , B. Aksanli , J. Sampson , H. Homayoun , E. Pettis , D. M. Tullsen , and T. Simunic Rosing , \" Managing distributed ups energy for effective power capping in data centers,\" in Computer Architecture (ISCA) , 2012 39th Annual International Symposium on. IEEE , 2012 , pp. 488 -- 499 . V. Kontorinis, L. E. Zhang, B. Aksanli, J. Sampson, H. Homayoun, E. Pettis, D. M. Tullsen, and T. Simunic Rosing, \"Managing distributed ups energy for effective power capping in data centers,\" in Computer Architecture (ISCA), 2012 39th Annual International Symposium on. IEEE, 2012, pp. 488--499."},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2014.21"},{"key":"e_1_3_2_1_16_1","volume-title":"Intel motherboard hardware v2.0.\" Open Compute Project","author":"Li H.","year":"2011","unstructured":"H. Li and A. Michael , \" Intel motherboard hardware v2.0.\" Open Compute Project , 2011 . H. Li and A. Michael, \"Intel motherboard hardware v2.0.\" Open Compute Project, 2011."},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1145\/2318857.2254779"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1145\/2160803.2160862"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1145\/1993744.1993767"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.peva.2013.08.014"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1145\/2155620.2155650"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1145\/2000064.2000103"},{"key":"e_1_3_2_1_23_1","doi-asserted-by":"publisher","DOI":"10.1145\/1840845.1840911"},{"key":"e_1_3_2_1_24_1","volume-title":"online","year":"2014","unstructured":"\"Paraffin wax listings on alibaba,\" http:\/\/www.alibaba.com\/ , online ; accessed 22- July - 2014 . \"Paraffin wax listings on alibaba,\" http:\/\/www.alibaba.com\/, online; accessed 22-July-2014."},{"key":"e_1_3_2_1_25_1","first-page":"767","volume-title":"ITHERM 2002. The Eighth Intersociety Conference on. IEEE","author":"Patel C. D.","year":"2002","unstructured":"C. D. Patel , R. Sharma , C. E. Bash , and A. Beitelmal , \" Thermal considerations in cooling large scale high compute density data centers,\" in Thermal and Thermomechanical Phenomena in Electronic Systems, 2002 . ITHERM 2002. The Eighth Intersociety Conference on. IEEE , 2002 , pp. 767 -- 776 . C. D. Patel, R. Sharma, C. E. Bash, and A. Beitelmal, \"Thermal considerations in cooling large scale high compute density data centers,\" in Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. IEEE, 2002, pp. 767--776."},{"key":"e_1_3_2_1_26_1","unstructured":"S. Pelley D. Meisner T. F. Wenisch and J. W. VanGilder \"Understanding and abstracting total data center power \" in Workshop on Energy-Efficient Design 2009.  S. Pelley D. Meisner T. F. Wenisch and J. W. VanGilder \"Understanding and abstracting total data center power \" in Workshop on Energy-Efficient Design 2009."},{"key":"e_1_3_2_1_27_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.pmatsci.2014.03.005"},{"key":"e_1_3_2_1_28_1","first-page":"13","volume-title":"2014 ACM\/IEEE 41st International Symposium on. IEEE","author":"Putnam A.","year":"2014","unstructured":"A. Putnam , A. M. Caulfield , E. S. Chung , D. Chiou , K. Constantinides , J. Demme , H. Esmaeilzadeh , J. Fowers , G. P. Gopal , J. Gray et al., \"A reconfigurable fabric for accelerating large-scale datacenter services,\" in Computer Architecture (ISCA) , 2014 ACM\/IEEE 41st International Symposium on. IEEE , 2014 , pp. 13 -- 24 . A. Putnam, A. M. Caulfield, E. S. Chung, D. Chiou, K. Constantinides, J. Demme, H. Esmaeilzadeh, J. Fowers, G. P. Gopal, J. Gray et al., \"A reconfigurable fabric for accelerating large-scale datacenter services,\" in Computer Architecture (ISCA), 2014 ACM\/IEEE 41st International Symposium on. IEEE, 2014, pp. 13--24."},{"key":"e_1_3_2_1_29_1","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2013.76"},{"key":"e_1_3_2_1_30_1","doi-asserted-by":"publisher","DOI":"10.1145\/2490301.2451135"},{"key":"e_1_3_2_1_31_1","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2012.6169031"},{"issue":"9","key":"e_1_3_2_1_32_1","first-page":"94","article-title":"Cool thermal energy storage","volume":"48","author":"Roth K.","year":"2006","unstructured":"K. Roth , R. Zogg , and J. Brodrick , \" Cool thermal energy storage ,\" ASHRAE journal , vol. 48 , no. 9 , pp. 94 -- 96 , 2006 . K. Roth, R. Zogg, and J. Brodrick, \"Cool thermal energy storage,\" ASHRAE journal, vol. 48, no. 9, pp. 94--96, 2006.","journal-title":"ASHRAE journal"},{"key":"e_1_3_2_1_33_1","first-page":"318","article-title":"Review on thermal energy storage with phase change materials and applications,\" vol. 13, no. 2","author":"Sharma A.","year":"2009","unstructured":"A. Sharma , V. Tyagi , C. Chen , and D. Buddhi , \" Review on thermal energy storage with phase change materials and applications,\" vol. 13, no. 2 . Elsevier , 2009 , pp. 318 -- 345 . A. Sharma, V. Tyagi, C. Chen, and D. Buddhi, \"Review on thermal energy storage with phase change materials and applications,\" vol. 13, no. 2. Elsevier, 2009, pp. 318--345.","journal-title":"Elsevier"},{"key":"e_1_3_2_1_34_1","volume-title":"Open cloudserver blade specification v1.0.\" Open Compute Project","author":"Shaw M.","year":"2014","unstructured":"M. Shaw and M. Goldstein , \" Open cloudserver blade specification v1.0.\" Open Compute Project , 2014 . M. Shaw and M. Goldstein, \"Open cloudserver blade specification v1.0.\" Open Compute Project, 2014."},{"key":"e_1_3_2_1_35_1","volume-title":"Open cloudserver chassis specification v1.0.\" Open Compute Project","author":"Shaw M.","year":"2014","unstructured":"M. Shaw and M. Goldstein , \" Open cloudserver chassis specification v1.0.\" Open Compute Project , 2014 . M. Shaw and M. Goldstein, \"Open cloudserver chassis specification v1.0.\" Open Compute Project, 2014."},{"key":"e_1_3_2_1_36_1","unstructured":"\"Google Transparency Report \" http:\/\/www.google.com\/transparencyreport\/traffic\/ 2011 Online; accessed 2011.  \"Google Transparency Report \" http:\/\/www.google.com\/transparencyreport\/traffic\/ 2011 Online; accessed 2011."},{"key":"e_1_3_2_1_37_1","doi-asserted-by":"publisher","DOI":"10.1145\/1993744.1993766"},{"key":"e_1_3_2_1_38_1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2040632"},{"key":"e_1_3_2_1_39_1","doi-asserted-by":"publisher","DOI":"10.1145\/2508148.2485974"},{"key":"e_1_3_2_1_40_1","volume-title":"USENIX","author":"Zhang J.","year":"2014","unstructured":"J. Zhang , M. Shihab , and M. Jung , \" Power, energy and thermal considerations in ssd-based i\/o acceleration,\" in Advanced Computing Systems Association: HotStorage 2014 . USENIX , 2014 . J. Zhang, M. Shihab, and M. Jung, \"Power, energy and thermal considerations in ssd-based i\/o acceleration,\" in Advanced Computing Systems Association: HotStorage 2014. USENIX, 2014."},{"key":"e_1_3_2_1_41_1","first-page":"19","volume-title":"Testore: exploiting thermal and energy storage to cut the electricity bill for datacenter cooling,\" in Proceedings of the 8th International Conference on Network and Service Management","author":"Zhang Y.","year":"2012","unstructured":"Y. Zhang , Y. Wang , and X. Wang , \" Testore: exploiting thermal and energy storage to cut the electricity bill for datacenter cooling,\" in Proceedings of the 8th International Conference on Network and Service Management . International Federation for Information Processing , 2012 , pp. 19 -- 27 . Y. Zhang, Y. Wang, and X. Wang, \"Testore: exploiting thermal and energy storage to cut the electricity bill for datacenter cooling,\" in Proceedings of the 8th International Conference on Network and Service Management. International Federation for Information Processing, 2012, pp. 19--27."},{"key":"e_1_3_2_1_42_1","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2014.53"},{"key":"e_1_3_2_1_43_1","first-page":"132","volume-title":"IEEE","author":"Zheng W.","year":"2014","unstructured":"W. Zheng , K. Ma , and X. Wang , \" Exploiting thermal energy storage to reduce data center capital and operating expenses,\" in Proceedings of the IEEE 19th International Symposium on High-Performance Computer Architecture . IEEE , 2014 , pp. 132 -- 141 . W. Zheng, K. Ma, and X. Wang, \"Exploiting thermal energy storage to reduce data center capital and operating expenses,\" in Proceedings of the IEEE 19th International Symposium on High-Performance Computer Architecture. IEEE, 2014, pp. 132--141."}],"event":{"name":"ISCA '15: The 42nd Annual International Symposium on Computer Architecture","location":"Portland Oregon","acronym":"ISCA '15","sponsor":["IEEE TCCA IEEE Computer Society Technical Committee on Computer Architecture","SIGARCH ACM Special Interest Group on Computer Architecture"]},"container-title":["Proceedings of the 42nd Annual International Symposium on Computer Architecture"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2749469.2749474","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2749469.2749474","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T15:04:04Z","timestamp":1750259044000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2749469.2749474"}},"subtitle":["leveraging phase change materials to reduce cooling costs in warehouse-scale computers"],"short-title":[],"issued":{"date-parts":[[2015,6,13]]},"references-count":43,"alternative-id":["10.1145\/2749469.2749474","10.1145\/2749469"],"URL":"https:\/\/doi.org\/10.1145\/2749469.2749474","relation":{"is-identical-to":[{"id-type":"doi","id":"10.1145\/2872887.2749474","asserted-by":"object"}]},"subject":[],"published":{"date-parts":[[2015,6,13]]},"assertion":[{"value":"2015-06-13","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}