{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,23]],"date-time":"2025-12-23T15:43:51Z","timestamp":1766504631090,"version":"3.41.0"},"publisher-location":"New York, New York, USA","reference-count":9,"publisher":"ACM Press","license":[{"start":{"date-parts":[[2015,1,1]],"date-time":"2015-01-01T00:00:00Z","timestamp":1420070400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015]]},"DOI":"10.1145\/2800835.2800936","type":"proceedings-article","created":{"date-parts":[[2015,10,6]],"date-time":"2015-10-06T15:22:12Z","timestamp":1444144932000},"page":"245-248","source":"Crossref","is-referenced-by-count":19,"title":["Weaving electronic circuit into two-layer fabric"],"prefix":"10.1145","author":[{"given":"Jussi","family":"Mikkonen","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Emmi","family":"Pouta","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","reference":[{"key":"key-10.1145\/2800835.2800936-1","doi-asserted-by":"crossref","unstructured":"Buechley, L., Eisenberg, M., Catchen, J., &#38; Crockett, A. The LilyPad Arduino: using computational textiles to investigate engagement, aesthetics, and diversity in computer science education.In Proc. CHI 2008, ACM Press.","DOI":"10.1145\/1357054.1357123"},{"key":"key-10.1145\/2800835.2800936-2","doi-asserted-by":"crossref","unstructured":"Gowrishankar R. And Mikkonen J. Pattern resistors: exploring resistive motifs as components for e-embroidery.In Proc. ISWC 2013, ACM Press, 137--138.","DOI":"10.1145\/2493988.2494341"},{"key":"key-10.1145\/2800835.2800936-3","doi-asserted-by":"crossref","unstructured":"Linz T., Kallmayer, C., Aschenbrenner, R., Reichl, H. Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric,in Proc. ISWC 2005, 86--89.","DOI":"10.1109\/ISWC.2005.19"},{"key":"key-10.1145\/2800835.2800936-4","unstructured":"Mahiar H. Organic electronics on micro and nano fibers from e-textiles to biomolecular nanoelectronics, Serie: Link&#246;ping studies in science and technology. Dissertations, No. 1224, Link&#246;ping, Sweden 2008 ISBN: 978-91-7393-763-4"},{"key":"key-10.1145\/2800835.2800936-5","doi-asserted-by":"crossref","unstructured":"Pacelli, M., Loriga, G., Taccini, N., Paradiso, R. Sensing Fabrics for Monitoring Physiological and Biomechanical Variables: E-textile solutions, Medical Devices and Biosensors, 3rd IEEE\/EMBS International Summer School on, vol., no., pp. 1,4, 4--6 Sept. 2006","DOI":"10.1109\/ISSMDBS.2006.360082"},{"key":"key-10.1145\/2800835.2800936-6","doi-asserted-by":"crossref","unstructured":"Perner-Wilson, H., Buechley, L., &#38; Satomi, M. (2011). Handcrafting textile interfaces from a kit-of-no-parts.In Proc. TEI 2011, ACM Press.","DOI":"10.1145\/1935701.1935715"},{"key":"key-10.1145\/2800835.2800936-7","doi-asserted-by":"crossref","unstructured":"Post, E. R., Orth, M., Russo, P., Gershenfeld, N. E-broidery: Design and Fabrication of Textile-based Computing, IBM Systems Journal, v. 39, (2000), 840--860","DOI":"10.1147\/sj.393.0840"},{"key":"key-10.1145\/2800835.2800936-8","doi-asserted-by":"crossref","unstructured":"Stoppa, M., Chiolerio, A. Wearable Electronics and Smart Textiles: A Critical Review. Sensors 2014, 14, 11957--11992.","DOI":"10.3390\/s140711957"},{"key":"key-10.1145\/2800835.2800936-9","unstructured":"The Crying Dress URL: http:\/\/www.kobakant.at\/?p=222"}],"event":{"number":"2015","sponsor":["Google Inc.","Telef\u00f3nica","SIGCHI, ACM Special Interest Group on Computer-Human Interaction","SIGMOBILE, ACM Special Interest Group on Mobility of Systems, Users, Data and Computing","FX Palo Alto Laboratory, Inc.","ISTC-PC, Intel Science and Technology Center for Pervasive Computing","Panasonic, Panasonic Corporation","Microsoft","Rakuten Institute of Technology"],"acronym":"UbiComp '15","name":"the 2015 ACM International Joint Conference","start":{"date-parts":[[2015,9,7]]},"location":"Osaka, Japan","end":{"date-parts":[[2015,9,11]]}},"container-title":["Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2015 ACM International Symposium on Wearable Computers - UbiComp '15"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2800835.2800936","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/dl.acm.org\/ft_gateway.cfm?id=2800936&amp;ftid=1628823&amp;dwn=1","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T05:43:11Z","timestamp":1750225391000},"score":1,"resource":{"primary":{"URL":"http:\/\/dl.acm.org\/citation.cfm?doid=2800835.2800936"}},"subtitle":[],"proceedings-subject":"Pervasive and Ubiquitous Computing and Proceedings of the 2015 ACM International Symposium on Wearable Computers","short-title":[],"issued":{"date-parts":[[2015]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1145\/2800835.2800936","relation":{},"subject":[],"published":{"date-parts":[[2015]]}}}