{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:14:27Z","timestamp":1750306467517,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":22,"publisher":"ACM","license":[{"start":{"date-parts":[[2016,2,14]],"date-time":"2016-02-14T00:00:00Z","timestamp":1455408000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100003621","name":"Ministry of Science, ICT and Future Planning","doi-asserted-by":"publisher","award":["B0101-15-1292"],"award-info":[{"award-number":["B0101-15-1292"]}],"id":[{"id":"10.13039\/501100003621","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002347","name":"Bundesministerium f\u00fcr Bildung und Forschung","doi-asserted-by":"publisher","award":["01IS12054"],"award-info":[{"award-number":["01IS12054"]}],"id":[{"id":"10.13039\/501100002347","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2016,2,14]]},"DOI":"10.1145\/2839462.2854105","type":"proceedings-article","created":{"date-parts":[[2016,2,22]],"date-time":"2016-02-22T13:19:02Z","timestamp":1456147142000},"page":"705-708","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":4,"title":["Exploring 3D Printed Interaction"],"prefix":"10.1145","author":[{"given":"Martin","family":"Schmitz","sequence":"first","affiliation":[{"name":"Technische Universit\u00e4t Darmstadt, Hochschulstra\u00dfe 10, 64289 Darmstadt"}]}],"member":"320","published-online":{"date-parts":[[2016,2,14]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2013.6697669"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/2501988.2502027"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-014-5717-7"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/2556288.2557173"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/2559206.2581137"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1145\/2556288.2557338"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/2556288.2557046"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1145\/2493432.2493486"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1145\/2148131.2148142"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1108\/13552541211212113"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1145\/2501988.2502048"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/2501988.2501989"},{"key":"e_1_3_2_1_13_1","volume-title":"Proc. Solid Freeform Fabrication Symposium. 503--512","author":"Periard Daniel","year":"2007","unstructured":"Daniel Periard , Evan Malone , and Hod Lipson . 2007 . Printing embedded circuits . In Proc. Solid Freeform Fabrication Symposium. 503--512 . Daniel Periard, Evan Malone, and Hod Lipson. 2007. Printing embedded circuits. In Proc. Solid Freeform Fabrication Symposium. 503--512."},{"key":"e_1_3_2_1_14_1","volume-title":"Proc. TEI '12","author":"Sarik John","year":"2012","unstructured":"John Sarik , Alex Butler , Nicolas Villar , and others. 2012 . Combining 3D printing and printable electronics . In Proc. TEI '12 . 1--5. John Sarik, Alex Butler, Nicolas Villar, and others. 2012. Combining 3D printing and printable electronics. In Proc. TEI '12. 1--5."},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1145\/2207676.2207743"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1145\/2501988.2501992"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1145\/2642918.2647374"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1145\/2380116.2380189"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1145\/2807442.2807503"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1145\/2470654.2470688"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1145\/2380116.2380190"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1145\/1936652.1936665"}],"event":{"name":"TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction","sponsor":["SIGCHI ACM Special Interest Group on Computer-Human Interaction"],"location":"Eindhoven Netherlands","acronym":"TEI '16"},"container-title":["Proceedings of the TEI '16: Tenth International Conference on Tangible, Embedded, and Embodied Interaction"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2839462.2854105","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2839462.2854105","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T05:43:45Z","timestamp":1750225425000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2839462.2854105"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,2,14]]},"references-count":22,"alternative-id":["10.1145\/2839462.2854105","10.1145\/2839462"],"URL":"https:\/\/doi.org\/10.1145\/2839462.2854105","relation":{},"subject":[],"published":{"date-parts":[[2016,2,14]]},"assertion":[{"value":"2016-02-14","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}