{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:11:39Z","timestamp":1750306299260,"version":"3.41.0"},"reference-count":22,"publisher":"Association for Computing Machinery (ACM)","issue":"3","license":[{"start":{"date-parts":[[2016,5,16]],"date-time":"2016-05-16T00:00:00Z","timestamp":1463356800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["ACM Trans. Des. Autom. Electron. Syst."],"published-print":{"date-parts":[[2016,7,26]]},"abstract":"<jats:p>RC and single-inverter-based rail clamps are widely used in semiconductor products for electrostatic discharge (ESD) protection. We propose a technology-node-independent design methodology for these rail clamp circuits that takes process, voltage, and temperature variations into consideration. The methodology can be used as a cookbook by the designer or be used to automate the entire design process. Tradeoffs between various design metrics such as ESD performance (Human Body Model), leakage, and area are considered. Simplified circuit models for the rail clamp are presented to gain insights into its working and to size the circuit components. A rail clamp for core power domain is designed using the proposed approach in 40nm low-power process and performance results of the design are also presented. The effectiveness of the design methodology is proven in three different technology nodes by comparing the obtained design with the best design from among 250,000 designs obtained by randomly sampling from the design space.<\/jats:p>","DOI":"10.1145\/2851490","type":"journal-article","created":{"date-parts":[[2016,5,17]],"date-time":"2016-05-17T15:58:00Z","timestamp":1463500680000},"page":"1-19","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Process Independent Design Methodology for the Active RC and Single-Inverter-Based Rail Clamp"],"prefix":"10.1145","volume":"21","author":[{"given":"Ramachandran","family":"Venkatasubramanian","sequence":"first","affiliation":[{"name":"Broadcom Corporation"}]},{"given":"Robert","family":"Elio","sequence":"additional","affiliation":[{"name":"Broadcom Corporation"}]},{"given":"Sule","family":"Ozev","sequence":"additional","affiliation":[{"name":"Arizona State University, Tempe, AZ"}]}],"member":"320","published-online":{"date-parts":[[2016,5,16]]},"reference":[{"volume-title":"Proceedings of the Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201904)","author":"Ashton R. A.","key":"e_1_2_1_1_1"},{"volume-title":"Proceedings of the 1999 IEEE International Symposium on Circuits and Systems (ISCAS\u201999)","author":"Bernier J. C.","key":"e_1_2_1_2_1"},{"volume-title":"Proceedings of the 2011 33rd Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201911)","year":"2011","author":"Chih-Ting Yeh","key":"e_1_2_1_3_1"},{"key":"e_1_2_1_4_1","unstructured":"ESD Association Standard. April 2012. Electrostatic discharge sensitivity testing-human body model (HBM)-component level.  ESD Association Standard. April 2012. Electrostatic discharge sensitivity testing-human body model (HBM)-component level."},{"volume-title":"Proceedings of the 2011 33rd Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201911)","author":"Gerdemann A.","key":"e_1_2_1_5_1"},{"volume-title":"Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems (APCCAS\u201908)","author":"Hsueh K. K.","key":"e_1_2_1_6_1"},{"volume-title":"Proceedings of the Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201904)","author":"Junjun Li","key":"e_1_2_1_7_1"},{"volume-title":"Proceedings of the Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201906)","author":"Junjun Li","key":"e_1_2_1_8_1"},{"volume-title":"Proceedings of the 2009 31st EOS\/ESD Symposium. IEEE, 1--10","year":"2009","author":"Lin Lin","key":"e_1_2_1_9_1"},{"volume-title":"Proceedings of the 2010 32nd Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201910)","author":"Malobabic S.","key":"e_1_2_1_10_1"},{"volume-title":"Proceedings of the Electrical Overstress\/Electrostatic Discharge Symposium. 70--77","author":"Maloney T. J.","key":"e_1_2_1_11_1"},{"volume-title":"Proceedings of the Electrical Overstress\/Electrostatic Discharge Symposium. IEEE, 233--237","year":"1993","author":"Merrill R.","key":"e_1_2_1_12_1"},{"key":"e_1_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/16.737457"},{"key":"e_1_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(03)00123-9"},{"key":"e_1_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2003.818140"},{"volume-title":"Proceedings of the 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT\u201912)","year":"2012","author":"Rui Zhu","key":"e_1_2_1_16_1"},{"key":"e_1_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2007.891251"},{"volume-title":"Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems (ICECS\u201908)","year":"2008","author":"Shih-Hung Chen","key":"e_1_2_1_18_1"},{"volume-title":"Proceedings of the Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201903)","author":"Stockinger M.","key":"e_1_2_1_19_1"},{"volume-title":"Proceedings of the 30th Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201908)","author":"Thijs S.","key":"e_1_2_1_20_1"},{"volume-title":"Proceedings of the Electrical Overstress\/Electrostatic Discharge Symposium (EOS\/ESD\u201901)","author":"Torres C. A.","key":"e_1_2_1_21_1"},{"key":"e_1_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2446460"}],"container-title":["ACM Transactions on Design Automation of Electronic Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2851490","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2851490","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:39:15Z","timestamp":1750221555000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2851490"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,5,16]]},"references-count":22,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2016,7,26]]}},"alternative-id":["10.1145\/2851490"],"URL":"https:\/\/doi.org\/10.1145\/2851490","relation":{},"ISSN":["1084-4309","1557-7309"],"issn-type":[{"type":"print","value":"1084-4309"},{"type":"electronic","value":"1557-7309"}],"subject":[],"published":{"date-parts":[[2016,5,16]]},"assertion":[{"value":"2015-07-01","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2015-11-01","order":1,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2016-05-16","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}