{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,28]],"date-time":"2026-03-28T08:47:43Z","timestamp":1774687663440,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":26,"publisher":"ACM","license":[{"start":{"date-parts":[[2016,4,3]],"date-time":"2016-04-03T00:00:00Z","timestamp":1459641600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-sa\/4.0\/"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2016,4,3]]},"DOI":"10.1145\/2872334.2872355","type":"proceedings-article","created":{"date-parts":[[2016,4,1]],"date-time":"2016-04-01T15:38:32Z","timestamp":1459525112000},"page":"99-106","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":13,"title":["Load-Aware Redundant Via Insertion for Electromigration Avoidance"],"prefix":"10.1145","author":[{"given":"Steve","family":"Bigalke","sequence":"first","affiliation":[{"name":"Institute of Electromechanical and Electronic Design (IFTE), Dresden, Germany"}]},{"given":"Jens","family":"Lienig","sequence":"additional","affiliation":[{"name":"Institute of Electromechanical and Electronic Design (IFTE), Dresden, Germany"}]}],"member":"320","published-online":{"date-parts":[[2016,4,3]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2004.835727"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"e_1_3_2_1_3_1","unstructured":"boost. C++ libraries 2015  boost. C++ libraries 2015"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2011.50"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.917597"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1007\/BF01386390"},{"key":"e_1_3_2_1_7_1","unstructured":"Gurobi. Optimization 6.0 2015.  Gurobi. Optimization 6.0 2015."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2003.10.020"},{"key":"e_1_3_2_1_9_1","unstructured":"International Technology Roadmap for Semiconductors (ITRS). Interconnect 2011 edition.  International Technology Roadmap for Semiconductors (ITRS). Interconnect 2011 edition."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.2006151"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2035559"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1145\/1118299.1118376"},{"key":"e_1_3_2_1_14_1","first-page":"633","volume-title":"Proc. of IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)","author":"Lee K.-Y.","year":"2006"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2035581"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796524"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1145\/1123008.1123017"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1145\/2451916.2451925"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2010.5419806"},{"key":"e_1_3_2_1_20_1","unstructured":"NanGate. 45nm Open Cell Library 2011.  NanGate. 45nm Open Cell Library 2011."},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2015.7059063"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2011.5770794"},{"key":"e_1_3_2_1_23_1","unstructured":"Si2. LEF\/DEF Parser 2015.  Si2. LEF\/DEF Parser 2015."},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1145\/1120725.1120927"},{"key":"e_1_3_2_1_25_1","first-page":"1126","volume-title":"Proc. of IEEE Northeast Workshop on Circuits and Systems (NEWCAS)","author":"Yan J.-T.","year":"2007"},{"key":"e_1_3_2_1_26_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2006.881822"}],"event":{"name":"ISPD'16: International Symposium on Physical Design","location":"Santa Rosa California USA","acronym":"ISPD'16","sponsor":["SIGDA ACM Special Interest Group on Design Automation"]},"container-title":["Proceedings of the 2016 on International Symposium on Physical Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2872334.2872355","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2872334.2872355","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:39:16Z","timestamp":1750221556000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2872334.2872355"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,4,3]]},"references-count":26,"alternative-id":["10.1145\/2872334.2872355","10.1145\/2872334"],"URL":"https:\/\/doi.org\/10.1145\/2872334.2872355","relation":{},"subject":[],"published":{"date-parts":[[2016,4,3]]},"assertion":[{"value":"2016-04-03","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}