{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:10:30Z","timestamp":1750306230855,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":12,"publisher":"ACM","license":[{"start":{"date-parts":[[2016,11,7]],"date-time":"2016-11-07T00:00:00Z","timestamp":1478476800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2016,11,7]]},"DOI":"10.1145\/2966986.2980094","type":"proceedings-article","created":{"date-parts":[[2016,10,18]],"date-time":"2016-10-18T12:23:59Z","timestamp":1476793439000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["Power delivery in 3D packages"],"prefix":"10.1145","author":[{"given":"Sukeshwar","family":"Kannan","sequence":"first","affiliation":[{"name":"GLOBALFOUNDRIES US Inc."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mehdi","family":"Sadi","sequence":"additional","affiliation":[{"name":"GLOBALFOUNDRIES US Inc."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Luke","family":"England","sequence":"additional","affiliation":[{"name":"GLOBALFOUNDRIES US Inc."}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2016,11,7]]},"reference":[{"doi-asserted-by":"publisher","key":"e_1_3_2_1_1_1","DOI":"10.1109\/EPEP.2007.4387161"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_2_1","DOI":"10.1109\/ISCA.2008.15"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_3_1","DOI":"10.1109\/JPROC.2008.2007458"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_4_1","DOI":"10.1109\/LED.2011.2158511"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_5_1","DOI":"10.1109\/TCPMT.2010.2101693"},{"key":"e_1_3_2_1_6_1","first-page":"678","volume-title":"Development of an optimized power delivery system for 3D IC integration with TSV silicon interposer,\" in 2012 IEEE 62nd Electronic Components and Technology Conference","author":"Li H.","year":"2012","unstructured":"Z. Li, H. Shi, J. Xie and A. Rahman, \"Development of an optimized power delivery system for 3D IC integration with TSV silicon interposer,\" in 2012 IEEE 62nd Electronic Components and Technology Conference, pp. 678--682, 2012."},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_7_1","DOI":"10.5555\/2422902"},{"key":"e_1_3_2_1_8_1","first-page":"1","volume-title":"IEEE International Conference on","author":"Khan S. M.","year":"2009","unstructured":"N. H. Khan, S. M. Alam and S. Hassoun, \"System-level comparison of power delivery design for 2D and 3D ICs,\" in 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, pp. 1--7, 2009."},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_9_1","DOI":"10.1109\/TVLSI.2015.2491263"},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_10_1","DOI":"10.1109\/TVLSI.2012.2230035"},{"key":"e_1_3_2_1_11_1","first-page":"432","volume-title":"FIVR - Fully integrated voltage regulators on 4th generation Intel\u00c2\u0151 Core\u00e2\u010e\u0107 SoCs,\" in 2014 IEEE Applied Power Electronics Conference and Exposition - APEC","author":"Burton G.","year":"2014","unstructured":"E. A. Burton, G. Schrom, F. Paillet, J. Douglas, W. J. Lambert, K. Radhakrishnan and M. J. Hill, \"FIVR - Fully integrated voltage regulators on 4th generation Intel\u00c2\u0151 Core\u00e2\u010e\u0107 SoCs,\" in 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014, pp. 432--439, 2014."},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_12_1","DOI":"10.1109\/JSSC.2012.2221237"}],"event":{"sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CAS","IEEE CS","IEEE-EDS Electronic Devices Society"],"acronym":"ICCAD '16","name":"ICCAD '16: IEEE\/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN","location":"Austin Texas"},"container-title":["Proceedings of the 35th International Conference on Computer-Aided Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2966986.2980094","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/2966986.2980094","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:23:12Z","timestamp":1750220592000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/2966986.2980094"}},"subtitle":["current crowding effects, dynamic IR drop and compensation network using sensors (invited paper)"],"short-title":[],"issued":{"date-parts":[[2016,11,7]]},"references-count":12,"alternative-id":["10.1145\/2966986.2980094","10.1145\/2966986"],"URL":"https:\/\/doi.org\/10.1145\/2966986.2980094","relation":{},"subject":[],"published":{"date-parts":[[2016,11,7]]},"assertion":[{"value":"2016-11-07","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}