{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:08:42Z","timestamp":1750306122712,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":12,"publisher":"ACM","license":[{"start":{"date-parts":[[2017,4,21]],"date-time":"2017-04-21T00:00:00Z","timestamp":1492732800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2017,4,21]]},"DOI":"10.1145\/3077829.3077837","type":"proceedings-article","created":{"date-parts":[[2017,5,31]],"date-time":"2017-05-31T19:31:40Z","timestamp":1496259100000},"page":"45-49","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["Active contour model combining local and global information dynamically with application to segment brain MR images"],"prefix":"10.1145","author":[{"given":"Yunyun","family":"Yang","sequence":"first","affiliation":[{"name":"Harbin Institute of Technology, Shenzhen, China"}]},{"given":"Xiu","family":"Shu","sequence":"additional","affiliation":[{"name":"Harbin Institute of Technology, Shenzhen, China"}]},{"given":"Shenghua","family":"Zhong","sequence":"additional","affiliation":[{"name":"Shenzhen University, Shenzhen, China"}]}],"member":"320","published-online":{"date-parts":[[2017,4,21]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2011.2146190"},{"key":"e_1_3_2_1_2_1","first-page":"218","article-title":"A robust parametric method for bias field estimation and segmentation of MR images","author":"Li C.","year":"2009","journal-title":"CVPR"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.compmedimag.2009.04.010"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-540-85990-1_130"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/83.902291"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2008.2002304"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2010.2069690"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmaa.2011.11.073"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1137\/080725891"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1137\/070703983"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.5555\/1940006.1940020"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1117\/1.JEI.21.1.013015"}],"event":{"name":"ICBEA '17: 2017 International Conference on Biometrics Engineering and Application","acronym":"ICBEA '17","location":"Hong Kong Hong Kong"},"container-title":["Proceedings of the 2017 International Conference on Biometrics Engineering and Application"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3077829.3077837","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3077829.3077837","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T03:36:50Z","timestamp":1750217810000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3077829.3077837"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,4,21]]},"references-count":12,"alternative-id":["10.1145\/3077829.3077837","10.1145\/3077829"],"URL":"https:\/\/doi.org\/10.1145\/3077829.3077837","relation":{},"subject":[],"published":{"date-parts":[[2017,4,21]]},"assertion":[{"value":"2017-04-21","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}