{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,9]],"date-time":"2026-06-09T15:17:11Z","timestamp":1781018231562,"version":"3.54.1"},"reference-count":76,"publisher":"Association for Computing Machinery (ACM)","issue":"1","license":[{"start":{"date-parts":[[2017,8,31]],"date-time":"2017-08-31T00:00:00Z","timestamp":1504137600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["ACM Trans. Des. Autom. Electron. Syst."],"published-print":{"date-parts":[[2018,1,31]]},"abstract":"<jats:p>The emergence of 3D network-on-chip (NoC) has revolutionized the design of high-performance and energy-efficient manycore chips. However, the anticipated performance gain can be compromised due to the degradation and failure of vertical links (VLs). The Through-Silicon-Via (TSV)-enabled VLs may fail due to workload-induced stress; the failure of a VL can affect the neighboring VLs, thereby causing a cascade of failures and reducing the lifetime of the chip. To enhance the reliability of 3D NoC-enabled manycore chips, we propose to incorporate a voltage-frequency island (VFI)-based power management strategy that helps to reduce the energy consumption and hence, the workload-induced stress of the highly utilized VLs. The adopted power-management strategy relies on control decisions about the voltage\/frequency (V\/F) levels on VLs. We demonstrate that compared to the well-known spare TSV allocation and adaptive routing strategies, power management is more effective in enhancing the reliability of a 3D NoC. VFI-based power management improves the reliability of the 3D NoC by one order of magnitude compared to both adaptive routing and spare allocation while running popular SPLASH-2 and PARSEC benchmarks. The principal benefit of power management is that it is capable of reducing the operating temperature of the system, which in turn enhances the Mean-Time-To-Failure (MTTF) of the VLs and reliability of the overall 3D NoC.<\/jats:p>","DOI":"10.1145\/3092843","type":"journal-article","created":{"date-parts":[[2017,9,1]],"date-time":"2017-09-01T12:27:42Z","timestamp":1504268862000},"page":"1-26","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["VFI-Based Power Management to Enhance the Lifetime of High-Performance 3D NoCs"],"prefix":"10.1145","volume":"23","author":[{"given":"Sourav","family":"Das","sequence":"first","affiliation":[{"name":"Washington State University, Pullman, WA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dongjin","family":"Lee","sequence":"additional","affiliation":[{"name":"Washington State University, Pullman, WA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wonje","family":"Choi","sequence":"additional","affiliation":[{"name":"Washington State University, Pullman, WA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Janardhan Rao","family":"Doppa","sequence":"additional","affiliation":[{"name":"Washington State University, Pullman, WA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Partha Pratim","family":"Pande","sequence":"additional","affiliation":[{"name":"Washington State University, Pullman, WA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Krishnendu","family":"Chakrabarty","sequence":"additional","affiliation":[{"name":"Duke University, Durham, NC"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2017,8,31]]},"reference":[{"key":"e_1_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"e_1_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISOCC.2012.6407095"},{"key":"e_1_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1147\/rd.504.0491"},{"key":"e_1_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2015.7357092"},{"key":"e_1_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2006.18"},{"key":"e_1_2_1_6_1","article-title":"Networks-on-chip in a three-dimensional environment: A performance evaluation","author":"Feero B. 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