{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:36:01Z","timestamp":1750221361019,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":27,"publisher":"ACM","license":[{"start":{"date-parts":[[2017,10,19]],"date-time":"2017-10-19T00:00:00Z","timestamp":1508371200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2017,10,19]]},"DOI":"10.1145\/3130218.3130224","type":"proceedings-article","created":{"date-parts":[[2017,9,20]],"date-time":"2017-09-20T12:36:22Z","timestamp":1505910982000},"page":"1-8","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":9,"title":["Energy and Area Efficient Near Field Inductive Coupling"],"prefix":"10.1145","author":[{"given":"Srinivasan","family":"Gopal","sequence":"first","affiliation":[{"name":"School of EECS, Washington State University, Pullman, WA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sourav","family":"Das","sequence":"additional","affiliation":[{"name":"School of EECS, Washington State University, Pullman, WA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Deukhyoun","family":"Heo","sequence":"additional","affiliation":[{"name":"School of EECS, Washington State University, Pullman, WA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Partha Pratim","family":"Pande","sequence":"additional","affiliation":[{"name":"School of EECS, Washington State University, Pullman, WA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2017,10,19]]},"reference":[{"issue":"4","key":"e_1_3_2_1_1_1","first-page":"5","article-title":"Three-dimensional integrated circuits","volume":"50","author":"Topol W.","year":"2006","journal-title":"IBM Journal of Research and Dev."},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2008.15"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"e_1_3_2_1_5_1","first-page":"705","volume-title":"ICCAD","author":"Energy Efficiency S.","year":"2015"},{"volume-title":"Proc. of DATE","year":"2014","author":"Matsutani H.","key":"e_1_3_2_1_6_1"},{"key":"e_1_3_2_1_7_1","unstructured":"D. Ditzel T. Kuroda and S. Lee \"Low-cost 3D chip stacking with ThruChip wireless connections \" in Proc. of IEEE Hot Chips Aug. 2014.  D. Ditzel T. Kuroda and S. Lee \"Low-cost 3D chip stacking with ThruChip wireless connections \" in Proc. of IEEE Hot Chips Aug. 2014."},{"issue":"3","key":"e_1_3_2_1_8_1","first-page":"524","article-title":"5--10 Gb\/s 70 mW Burst Mode AC Coupled Receiver in 90-nm CMOS","volume":"45","author":"Hossain M.","year":"2010","journal-title":"IEEE JSSC"},{"issue":"2","key":"e_1_3_2_1_9_1","first-page":"493","article-title":"Efficient 3-D bus architectures for inductive-coupling thruchip interfaces","volume":"24","author":"Kagami T.","year":"2016","journal-title":"IEEE TVLSI"},{"key":"e_1_3_2_1_10_1","first-page":"C22","article-title":"A 0.9 pJ\/bit, 12.8 GByte\/s WideIO memory interface in a 3D-IC NoC-based MPSoC","author":"Dutoit D.","year":"2013","journal-title":"Symposium on VLSIT"},{"issue":"1","key":"e_1_3_2_1_11_1","first-page":"293","article-title":"Plas et. al., \"Design issues and considerations for low-cost 3-D TSV IC technology","volume":"46","author":"G. V.","year":"2011","journal-title":"IEEE JSSC"},{"volume-title":"ISSCC","year":"2012","author":"Liu Y.","key":"e_1_3_2_1_12_1"},{"key":"e_1_3_2_1_13_1","first-page":"448","article-title":"Two 10 Gb\/s\/pin low-power interconnect methods for 3-D ICs","author":"Gu Q.","year":"2007","journal-title":"IEEE ISSCC Dig. Tech. Papers"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2012.249"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.142"},{"key":"e_1_3_2_1_16_1","first-page":"1","article-title":"\"Current Reuse Triple-Band Signal Source for Multi-Band Wireless Network-on-Chip\" in IEEE MTT-S IMS, Honolulu","author":"J.","year":"2017","journal-title":"HI"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2012.278"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1145\/309847.310112"},{"key":"e_1_3_2_1_19_1","first-page":"314","article-title":"al. \"Optimization-based framework for simultaneous circuit-and-system design-space exploration: A high speed link example","author":"Sredojevic R.","year":"2008","journal-title":"ICCAD"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2211628"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2006.12"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1145\/225830.223990"},{"key":"e_1_3_2_1_23_1","unstructured":"C. Bienia \"Benchmarking modern multiprocessors \" Ph.D. Dissertation Princeton Univ. Princeton NJ Jan. 2011.   C. Bienia \"Benchmarking modern multiprocessors \" Ph.D. Dissertation Princeton Univ. Princeton NJ Jan. 2011."},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2015.2498550"},{"key":"e_1_3_2_1_25_1","first-page":"1291","article-title":"Thermal-aware TSV repair for electromigration in 3D ICs","author":"Wang S.","year":"2016","journal-title":"Proc. of DATE"},{"key":"e_1_3_2_1_26_1","first-page":"326","article-title":"Electromigration behavior of 3D-IC TSV interconnects","author":"Frank T.","year":"2012","journal-title":"ECTC"},{"key":"e_1_3_2_1_27_1","first-page":"1","article-title":"Monolithic 3D IC vs. TSV-based 3D IC in 14nm FinFET technology","author":"Samal S. K.","year":"2016","journal-title":"S3S"}],"event":{"name":"NOCS '17: International Symposium on Networks-on-Chip","sponsor":["SIGBED ACM Special Interest Group on Embedded Systems","SIGDA ACM Special Interest Group on Design Automation","IEEE CAS","IEEE CEDA","SIGARCH ACM Special Interest Group on Computer Architecture"],"location":"Seoul Republic of Korea","acronym":"NOCS '17"},"container-title":["Proceedings of the Eleventh IEEE\/ACM International Symposium on Networks-on-Chip"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3130218.3130224","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3130218.3130224","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T02:26:16Z","timestamp":1750213576000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3130218.3130224"}},"subtitle":["A Case Study on 3D NoC"],"short-title":[],"issued":{"date-parts":[[2017,10,19]]},"references-count":27,"alternative-id":["10.1145\/3130218.3130224","10.1145\/3130218"],"URL":"https:\/\/doi.org\/10.1145\/3130218.3130224","relation":{},"subject":[],"published":{"date-parts":[[2017,10,19]]},"assertion":[{"value":"2017-10-19","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}