{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,21]],"date-time":"2026-02-21T18:33:01Z","timestamp":1771698781658,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":0,"publisher":"ACM","license":[{"start":{"date-parts":[[2017,10,14]],"date-time":"2017-10-14T00:00:00Z","timestamp":1507939200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100004663","name":"Ministry of Science and Technology, Taiwan","doi-asserted-by":"publisher","award":["106-2221-E-110-077"],"award-info":[{"award-number":["106-2221-E-110-077"]}],"id":[{"id":"10.13039\/501100004663","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2017,10,14]]},"DOI":"10.1145\/3139540.3139549","type":"proceedings-article","created":{"date-parts":[[2017,10,26]],"date-time":"2017-10-26T14:19:37Z","timestamp":1509027577000},"page":"1-2","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["Thermal\/Traffic Mutual-Coupling Co-simulation Platform for 3D Network-on-Chip (NoC) Designs"],"prefix":"10.1145","author":[{"given":"An-Yeu Andy","family":"Wu","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, National Taiwan University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kun-Chih Jimmy","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Engineering, National Sun Yat-Sen University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chih-Hao","family":"Chao","sequence":"additional","affiliation":[{"name":"MediaTek Inc."}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2017,10,14]]},"event":{"name":"MICRO-50: The 50th Annual IEEE\/ACM International Symposium on Microarchitecture","location":"Cambridge MA USA","acronym":"MICRO-50","sponsor":["SIGMICRO ACM Special Interest Group on Microarchitectural Research and Processing","IEEE CS"]},"container-title":["Proceedings of the 10th International Workshop on Network on Chip Architectures"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3139540.3139549","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3139540.3139549","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T02:14:01Z","timestamp":1750212841000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3139540.3139549"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,10,14]]},"references-count":0,"alternative-id":["10.1145\/3139540.3139549","10.1145\/3139540"],"URL":"https:\/\/doi.org\/10.1145\/3139540.3139549","relation":{},"subject":[],"published":{"date-parts":[[2017,10,14]]},"assertion":[{"value":"2017-10-14","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}