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Syst."],"published-print":{"date-parts":[[2018,3,31]]},"abstract":"<jats:p>Space processing applications deployed on SRAM-based Field Programmable Gate Arrays (FPGAs) are vulnerable to radiation-induced Single Event Upsets (SEUs). Compared with the well-known SEU mitigation solution\u2014Triple Modular Redundancy (TMR) with configuration memory scrubbing\u2014TMR with module-based error recovery (MER) is notably more energy efficient and responsive in repairing soft-errors in the system. Unfortunately, TMR-MER systems also need to resort to scrubbing when errors occur between sub-components, such as in interconnection nets, which are not recovered by MER. This article addresses this problem by proposing a fine-grained module-based error recovery technique, which can localize and correct errors that classic MER fails to do without additional system hardware. We evaluate our proposal via fault-injection campaigns on three types of circuits implemented in Xilinx 7-Series devices. With respect to scrubbing, we observed reductions in the mean time to repair configuration memory errors of between 48.5% and 89.4%, while reductions in energy used recovering from configuration memory errors were estimated at between 77.4% and 96.1%. These improvements result in higher reliability for systems employing TMR with fine-grained reconfiguration than equivalent systems relying on scrubbing for configuration error recovery.<\/jats:p>","DOI":"10.1145\/3173549","type":"journal-article","created":{"date-parts":[[2018,1,26]],"date-time":"2018-01-26T13:05:50Z","timestamp":1516971950000},"page":"1-23","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":8,"title":["Fine-Grained Module-Based Error Recovery in FPGA-Based TMR Systems"],"prefix":"10.1145","volume":"11","author":[{"given":"Zhuoran","family":"Zhao","sequence":"first","affiliation":[{"name":"UNSW Sydney and \u2020Macquarie University, NSW, Australia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Nguyen T. 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