{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,15]],"date-time":"2025-12-15T19:42:09Z","timestamp":1765827729769,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":24,"publisher":"ACM","license":[{"start":{"date-parts":[[2018,11,5]],"date-time":"2018-11-05T00:00:00Z","timestamp":1541376000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2018,11,5]]},"DOI":"10.1145\/3240765.3240769","type":"proceedings-article","created":{"date-parts":[[2018,11,6]],"date-time":"2018-11-06T13:36:57Z","timestamp":1541511417000},"page":"1-8","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":16,"title":["A fast thermal-aware fixed-outline floorplanning methodology based on analytical models"],"prefix":"10.1145","author":[{"given":"Jai-Ming","family":"Lin","sequence":"first","affiliation":[{"name":"National Cheng Kung University, Tainan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tai-Ting","family":"Chen","sequence":"additional","affiliation":[{"name":"National Cheng Kung University, Tainan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yen-Fu","family":"Chang","sequence":"additional","affiliation":[{"name":"National Cheng Kung University, Tainan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei-Yi","family":"Chang","sequence":"additional","affiliation":[{"name":"National Cheng Kung University, Tainan, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ya-Ting","family":"Shyu","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yeong-Jar","family":"Chang","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Juin-Ming","family":"Lu","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2018,11,5]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/640000.640018"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.923063"},{"key":"e_1_3_2_1_3_1","first-page":"780","volume-title":"ASP-DAC","author":"Cong J.","year":"2007","unstructured":"J. Cong, G-J. Luo, J Wei, and Y. Zhang, \"Thermal-aware 3D IC placement via transformation,\" in Proc. ASP-DAC, pp. 780--785, Jan. 2007."},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.5555\/996070.1009873"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2006043"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.77"},{"key":"e_1_3_2_1_7_1","first-page":"71","volume-title":"ICCAD","author":"Kahng A. B.","year":"2007","unstructured":"A. B. Kahng, S. M. Kang, W. Li, and B. Liu, \"Analytical thermal placement for VLSI lifetime improvement and minimum performance-variation,\" in Proc. ICCAD, pp. 71--77, Oct. 2007."},{"issue":"11","key":"e_1_3_2_1_8_1","first-page":"1808","article-title":"Planning massive interconnects in 3-d chips","volume":"34","author":"Knechtel J.","year":"2015","unstructured":"J. Knechtel, E. Young, J. Lienig, \"Planning massive interconnects in 3-d chips,\" IEEE TCAD, vol. 34, no. 11, pp. 1808--1821, Nov. 2015.","journal-title":"IEEE TCAD"},{"key":"e_1_3_2_1_9_1","first-page":"115","volume-title":"SASIMI","author":"Kuwano M.","year":"2010","unstructured":"M. Kuwano and Y. Takashima, \"Stable-LSE based analytical placement with overlap removable length,\" in Proc. SASIMI, pp. 115--120, 2010."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1093\/ietfec\/e89-a.4.989"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967071"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/1055137.1055179"},{"issue":"6","key":"e_1_3_2_1_13_1","first-page":"1041","article-title":"Fast thermal aware placement with accurate thermal analysis based on green function","volume":"22","author":"Liu S. S.-Y.","year":"2014","unstructured":"S. S.-Y. Liu, R.-G. Luo, S. Aroonsantidecha, C.-Y. Chin, and H.-M. Chen, \"Fast thermal aware placement with accurate thermal analysis based on green function,\" IEEE. TVLSI, vol.22, no.6, 1041--1415, Jun. 2014.","journal-title":"IEEE. TVLSI"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2232708"},{"key":"e_1_3_2_1_15_1","first-page":"693","article-title":"Non-Linear optimization system and method for wire length and delay optimization for an automatic electric circuit placer","volume":"6","author":"Donelly W.C.","year":"2001","unstructured":"W.C. Naylor R. Donelly, and L. Sha, \"Non-Linear optimization system and method for wire length and delay optimization for an automatic electric circuit placer,\" U.S. Patent 6 301 693, 2001.","journal-title":"U.S. Patent"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.5555\/1015090.1015125"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/43.828554"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.883919"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.5555\/1899721.1899855"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.5555\/1326073.1326196"},{"issue":"11","key":"e_1_3_2_1_21_1","first-page":"2366","article-title":"Power Blurring: fast static and transient thermal analysis method for packaged integrated circuits and power devices","volume":"22","author":"Ziabari A.","year":"2014","unstructured":"A. Ziabari, J.-H. Park, E. Ardestani, J. Renau, S.-M. Kang, and A. Shakouri, \"Power Blurring: fast static and transient thermal analysis method for packaged integrated circuits and power devices,\" IEEE TVLSI, vol. 22, no. 11, pp. 2366--2379, Nov. 2014.","journal-title":"IEEE TVLSI"},{"key":"e_1_3_2_1_22_1","volume-title":"IBM-HB+ Benchmarks. {Online}. Available : http:\/\/vlsicad.eecs.umich.edu\/BK\/ISPD06bench\/","author":"Ng A. N.","year":"2006","unstructured":"A. N. Ng, R. Aggralwal, V. Ramachandran, and I. Markov, (2006), IBM-HB+ Benchmarks. {Online}. Available : http:\/\/vlsicad.eecs.umich.edu\/BK\/ISPD06bench\/."},{"key":"e_1_3_2_1_23_1","volume-title":"GSRC Benchmarks. {Online}. Available :http:\/\/vlsicad.eecs.umich.edu\/BK\/GSRCbench","author":"Dai W.","year":"2000","unstructured":"W. Dai, L. Wu, and S. Zhang, (2000). GSRC Benchmarks. {Online}. Available :http:\/\/vlsicad.eecs.umich.edu\/BK\/GSRCbench."},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1145\/996566.996800"}],"event":{"name":"ICCAD '18: IEEE\/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN","sponsor":["IEEE-EDS Electronic Devices Society","IEEE CAS","IEEE CEDA"],"location":"San Diego California","acronym":"ICCAD '18"},"container-title":["Proceedings of the International Conference on Computer-Aided Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3240765.3240769","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3240765.3240769","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T00:43:34Z","timestamp":1750207414000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3240765.3240769"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,11,5]]},"references-count":24,"alternative-id":["10.1145\/3240765.3240769","10.1145\/3240765"],"URL":"https:\/\/doi.org\/10.1145\/3240765.3240769","relation":{},"subject":[],"published":{"date-parts":[[2018,11,5]]},"assertion":[{"value":"2018-11-05","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}