{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:31:22Z","timestamp":1750221082240,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":8,"publisher":"ACM","license":[{"start":{"date-parts":[[2018,9,8]],"date-time":"2018-09-08T00:00:00Z","timestamp":1536364800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"Department of Science and Technology of Shaanxi Province, China","award":["2017ZDCXL-GY-11-02-02"],"award-info":[{"award-number":["2017ZDCXL-GY-11-02-02"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2018,9,8]]},"DOI":"10.1145\/3277104.3278309","type":"proceedings-article","created":{"date-parts":[[2018,11,27]],"date-time":"2018-11-27T13:19:22Z","timestamp":1543324762000},"page":"38-42","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Database Construction and SPC Technology for Solder Paste Defect Inspection"],"prefix":"10.1145","author":[{"given":"Min","family":"Qi","sequence":"first","affiliation":[{"name":"School of Electronics and Information, Northwestern Polytechnical University, Changan District, Xi'an, Shaanxi, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xin","family":"Chang","sequence":"additional","affiliation":[{"name":"School of Electronics and Information, Northwestern Polytechnical University, Changan District, Xi'an, Shaanxi, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuelei","family":"Xu","sequence":"additional","affiliation":[{"name":"Unmanned system research institute, Northwestern Polytechnical University, Youyi District, Xi'an, Shaanxi, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lechi","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Electronics and Information, Northwestern Polytechnical University, Changan District, Xi'an, Shaanxi, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2018,9,8]]},"reference":[{"issue":"1","key":"e_1_3_2_1_1_1","first-page":"3","volume":"3","author":"Jim Hunt. Mining for Informational Gold in the National Trade Data Bank {J}.","year":"2008","unstructured":"Jim Hunt. Mining for Informational Gold in the National Trade Data Bank {J}. Journal of Business & Finance Librarianship , 2008 , 3 ( 1 ): 3 -- 26 . Jim Hunt. Mining for Informational Gold in the National Trade Data Bank {J}. Journal of Business & Finance Librarianship, 2008, 3(1): 3--26.","journal-title":"Journal of Business & Finance Librarianship"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/LADC.2009.21"},{"key":"e_1_3_2_1_3_1","volume-title":"US 20020179695 A1 {P}.","author":"Sakai H","year":"2002","unstructured":"Sakai H , Suzuki M , Igarashi M , Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed: US , US 20020179695 A1 {P}. 2002 . Sakai H, Suzuki M, Igarashi M, et al. Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed: US, US 20020179695 A1 {P}. 2002."},{"key":"e_1_3_2_1_4_1","volume-title":"Gabler","author":"Caulcutt R.","year":"1996","unstructured":"Caulcutt R. Statistical Process Control (SPC) {M}. Produktions management . Gabler , 1996 . Caulcutt R. Statistical Process Control (SPC) {M}. Produktions management. Gabler, 1996."},{"key":"e_1_3_2_1_5_1","volume-title":"Microsoft SQL Server 2008 R2 Master Data Services {M}","author":"Kashel J","year":"2011","unstructured":"Kashel J , Bullerwell M , Kent T. Microsoft SQL Server 2008 R2 Master Data Services {M} . Packt Publishing , 2011 . Kashel J, Bullerwell M, Kent T. Microsoft SQL Server 2008 R2 Master Data Services {M}. Packt Publishing, 2011."},{"key":"e_1_3_2_1_6_1","unstructured":"Cameron S. Microsoft\u00ae SQL Server\u00ae 2008 Analysis Services Step by Step {J}. 2016(7).   Cameron S. Microsoft\u00ae SQL Server\u00ae 2008 Analysis Services Step by Step {J}. 2016(7)."},{"key":"e_1_3_2_1_7_1","volume-title":"EP2790473 {P}.","author":"Greer M","year":"2014","unstructured":"Greer M , Gray R. Optimizing parameters for printing solder paste onto a PCB: EP , EP2790473 {P}. 2014 . Greer M, Gray R. Optimizing parameters for printing solder paste onto a PCB: EP, EP2790473 {P}. 2014."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1515\/aut-2017-0034"}],"event":{"name":"ICCBD '18: 2018 International Conference on Computing and Big Data","acronym":"ICCBD '18","location":"Charleston SC USA"},"container-title":["Proceedings of the 2018 International Conference on Computing and Big Data"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3277104.3278309","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3277104.3278309","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T00:57:42Z","timestamp":1750208262000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3277104.3278309"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,9,8]]},"references-count":8,"alternative-id":["10.1145\/3277104.3278309","10.1145\/3277104"],"URL":"https:\/\/doi.org\/10.1145\/3277104.3278309","relation":{},"subject":[],"published":{"date-parts":[[2018,9,8]]},"assertion":[{"value":"2018-09-08","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}