{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,28]],"date-time":"2025-10-28T15:04:26Z","timestamp":1761663866897,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":10,"publisher":"ACM","license":[{"start":{"date-parts":[[2019,1,21]],"date-time":"2019-01-21T00:00:00Z","timestamp":1548028800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2019,1,21]]},"DOI":"10.1145\/3287624.3287632","type":"proceedings-article","created":{"date-parts":[[2019,1,18]],"date-time":"2019-01-18T21:45:18Z","timestamp":1547847918000},"page":"538-543","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":5,"title":["Phone-nomenon"],"prefix":"10.1145","author":[{"given":"Hong-Wen","family":"Chiou","sequence":"first","affiliation":[{"name":"National Chiao Tung University, Taiwan and National Chiao Tung University, Taiwan"}]},{"given":"Yu-Min","family":"Lee","sequence":"additional","affiliation":[{"name":"National Chiao Tung University, Taiwan and National Chiao Tung University, Taiwan"}]},{"given":"Shin-Yu","family":"Shiau","sequence":"additional","affiliation":[{"name":"National Chiao Tung University, Taiwan"}]},{"given":"Chi-Wen","family":"Pan","sequence":"additional","affiliation":[{"name":"Mediatek Inc., Taiwan"}]},{"given":"Tai-Yu","family":"Chen","sequence":"additional","affiliation":[{"name":"Mediatek Inc., Taiwan"}]}],"member":"320","published-online":{"date-parts":[[2019,1,21]]},"reference":[{"volume-title":"John Wiley & Sons","year":"2013","author":"Incropera F. P.","key":"e_1_3_2_1_1_1"},{"key":"e_1_3_2_1_2_1","first-page":"1515","volume-title":"DATE","author":"Pagani S.","year":"2015"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/2627369.2627641"},{"key":"e_1_3_2_1_4_1","unstructured":"ANSYS Icepak 17.0. ANSYS Inc. 2017. ANSYS Icepak 17.0. ANSYS Inc. 2017."},{"volume-title":"Springer","year":"2000","author":"Cheng Y. K.","key":"e_1_3_2_1_5_1"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1021\/je60036a017"},{"key":"e_1_3_2_1_7_1","unstructured":"SuperLU http:\/\/crd-legacy.lbl.gov\/xiaoye\/SuperLU\/.  SuperLU http:\/\/crd-legacy.lbl.gov\/xiaoye\/SuperLU\/."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2008.4509367"},{"key":"e_1_3_2_1_9_1","unstructured":"EIA\/JEDEC standard JESD51-2a integrated circuits thermal test method environmental conditions - natural convection. In Electronic Industries Association JC15 committee 1995.  EIA\/JEDEC standard JESD51-2a integrated circuits thermal test method environmental conditions - natural convection. In Electronic Industries Association JC15 committee 1995."},{"key":"e_1_3_2_1_10_1","unstructured":"Therminator http:\/\/sportlab.usc.edu\/downloads\/packages\/.  Therminator http:\/\/sportlab.usc.edu\/downloads\/packages\/."}],"event":{"name":"ASPDAC '19: 24th Asia and South Pacific Design Automation Conference","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEICE ESS Institute of Electronics, Information and Communication Engineers, Engineering Sciences Society","IEEE CAS","IEEE CEDA","IPSJ SIG-SLDM Information Processing Society of Japan, SIG System LSI Design Methodology"],"location":"Tokyo Japan","acronym":"ASPDAC '19"},"container-title":["Proceedings of the 24th Asia and South Pacific Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3287624.3287632","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3287624.3287632","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T01:08:04Z","timestamp":1750208884000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3287624.3287632"}},"subtitle":["a system-level thermal simulator for handheld devices"],"short-title":[],"issued":{"date-parts":[[2019,1,21]]},"references-count":10,"alternative-id":["10.1145\/3287624.3287632","10.1145\/3287624"],"URL":"https:\/\/doi.org\/10.1145\/3287624.3287632","relation":{},"subject":[],"published":{"date-parts":[[2019,1,21]]},"assertion":[{"value":"2019-01-21","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}