{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,3]],"date-time":"2026-03-03T05:18:34Z","timestamp":1772515114716,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":10,"publisher":"ACM","license":[{"start":{"date-parts":[[2019,1,21]],"date-time":"2019-01-21T00:00:00Z","timestamp":1548028800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2019,1,21]]},"DOI":"10.1145\/3287624.3287666","type":"proceedings-article","created":{"date-parts":[[2019,1,18]],"date-time":"2019-01-18T21:45:18Z","timestamp":1547847918000},"page":"70-75","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":2,"title":["Multi-angle bended heat pipe design using x-architecture routing with dynamic thermal weight on mobile devices"],"prefix":"10.1145","author":[{"given":"Hsuan-Hsuan","family":"Hsiao","sequence":"first","affiliation":[{"name":"National Chiao Tung University, Taiwan"}]},{"given":"Hong-Wen","family":"Chiou","sequence":"additional","affiliation":[{"name":"National Chiao Tung University, Taiwan and Industrial Technology Research Institute, Taiwan"}]},{"given":"Yu-Min","family":"Lee","sequence":"additional","affiliation":[{"name":"National Chiao Tung University, Taiwan"}]}],"member":"320","published-online":{"date-parts":[[2019,1,21]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"crossref","unstructured":"A. Faghri \"Heat pipes: review opportunities and challenges \" Frontiers in Heat Pipes (FHP) vol. 5 no. 1 2014.  A. Faghri \"Heat pipes: review opportunities and challenges \" Frontiers in Heat Pipes (FHP) vol. 5 no. 1 2014.","DOI":"10.5098\/fhp.5.1"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"crossref","unstructured":"H. W. Chiou Y. M. Lee H. H. Hsiao and L. C. Cheng \"Thermal modeling and design on smartphones with heat pipe cooling technique \" in ICCAD pp. 482--489 2017.   H. W. Chiou Y. M. Lee H. H. Hsiao and L. C. Cheng \"Thermal modeling and design on smartphones with heat pipe cooling technique \" in ICCAD pp. 482--489 2017.","DOI":"10.1109\/ICCAD.2017.8203816"},{"key":"e_1_3_2_1_3_1","first-page":"570","volume-title":"10th Intersoc. Conf. Therm. Thermomech. Phenom. Electron. Syst.","author":"Odhekar D. D.","year":"2006"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1007\/s11771-011-0734-2"},{"key":"e_1_3_2_1_5_1","unstructured":"ANSYS \"Fluent user guide..\" {Online}. Available: http:\/\/storage.ansys.com\/doc_assets\/release_notes\/Release_Notes_181.pdf. {Accessed July 4 2017}.  ANSYS \"Fluent user guide..\" {Online}. Available: http:\/\/storage.ansys.com\/doc_assets\/release_notes\/Release_Notes_181.pdf. {Accessed July 4 2017}."},{"key":"e_1_3_2_1_6_1","volume-title":"John Wiley & Sons","author":"Bergman T. L.","year":"2011"},{"key":"e_1_3_2_1_7_1","unstructured":"Celsia \"Heat pipe - technology performance and shape.\" {Online}. Available: https:\/\/celsiainc.com 2006.  Celsia \"Heat pipe - technology performance and shape.\" {Online}. Available: https:\/\/celsiainc.com 2006."},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/TSSC.1968.300136"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"crossref","unstructured":"M. J. Dousti M. Ghasemi-Gol M. Nazemi and M. Pedram \"ThermTap: An online power analyzer and thermal simulator for Android devices \" in ISLPED pp. 341--346 2015.  M. J. Dousti M. Ghasemi-Gol M. Nazemi and M. Pedram \"ThermTap: An online power analyzer and thermal simulator for Android devices \" in ISLPED pp. 341--346 2015.","DOI":"10.1109\/ISLPED.2015.7273537"},{"key":"e_1_3_2_1_11_1","unstructured":"S. T. Group \"Amit's A<sup>*<\/sup> Pages.\" {Online}. Available: http:\/\/theory.stanford.edu\/~amitp\/GameProgramming\/AStarComparison.html 2010.  S. T. Group \"Amit's A<sup>*<\/sup> Pages.\" {Online}. Available: http:\/\/theory.stanford.edu\/~amitp\/GameProgramming\/AStarComparison.html 2010."}],"event":{"name":"ASPDAC '19: 24th Asia and South Pacific Design Automation Conference","location":"Tokyo Japan","acronym":"ASPDAC '19","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEICE ESS Institute of Electronics, Information and Communication Engineers, Engineering Sciences Society","IEEE CAS","IEEE CEDA","IPSJ SIG-SLDM Information Processing Society of Japan, SIG System LSI Design Methodology"]},"container-title":["Proceedings of the 24th Asia and South Pacific Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3287624.3287666","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3287624.3287666","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T01:08:04Z","timestamp":1750208884000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3287624.3287666"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,1,21]]},"references-count":10,"alternative-id":["10.1145\/3287624.3287666","10.1145\/3287624"],"URL":"https:\/\/doi.org\/10.1145\/3287624.3287666","relation":{},"subject":[],"published":{"date-parts":[[2019,1,21]]},"assertion":[{"value":"2019-01-21","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}