{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,29]],"date-time":"2025-08-29T09:53:07Z","timestamp":1756461187239,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":10,"publisher":"ACM","license":[{"start":{"date-parts":[[2019,5,13]],"date-time":"2019-05-13T00:00:00Z","timestamp":1557705600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2019,5,13]]},"DOI":"10.1145\/3299874.3319487","type":"proceedings-article","created":{"date-parts":[[2019,5,16]],"date-time":"2019-05-16T12:10:25Z","timestamp":1558008625000},"page":"451-455","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["Investigation and Trade-offs in 3DIC Partitioning Methodologies"],"prefix":"10.1145","author":[{"given":"Nikolaos","family":"Sketopoulos","sequence":"first","affiliation":[{"name":"University of Thessaly, Volos, Greece"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Christos P.","family":"Sotiriou","sequence":"additional","affiliation":[{"name":"University of Thessaly, Volos, Greece"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vasileios","family":"Samaras","sequence":"additional","affiliation":[{"name":"University of Thessaly, Volos, Greece"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2019,5,13]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2012.2223593"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2062811"},{"key":"e_1_3_2_1_3_1","unstructured":"EVG Group. 2017. IMEC and EVG demonstrate for the first time 1.8\u03bcm pitch overlay accuracy for wafer bonding. https:\/\/www.evgroup.com\/en\/about\/news\/2017 01 imec\/."},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/3177540.3178244"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/2934583.2934622"},{"key":"e_1_3_2_1_6_1","unstructured":"OpenCores. 2019. OpenCores Open IP Community. https:\/\/opencores.org\/."},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/2560519.2560531"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.5555\/3152604"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2018.8342243"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2768330"}],"event":{"name":"GLSVLSI '19: Great Lakes Symposium on VLSI 2019","sponsor":["SIGDA ACM Special Interest Group on Design Automation"],"location":"Tysons Corner VA USA","acronym":"GLSVLSI '19"},"container-title":["Proceedings of the 2019 Great Lakes Symposium on VLSI"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3299874.3319487","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3299874.3319487","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T23:53:38Z","timestamp":1750204418000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3299874.3319487"}},"subtitle":["N\/A"],"short-title":[],"issued":{"date-parts":[[2019,5,13]]},"references-count":10,"alternative-id":["10.1145\/3299874.3319487","10.1145\/3299874"],"URL":"https:\/\/doi.org\/10.1145\/3299874.3319487","relation":{},"subject":[],"published":{"date-parts":[[2019,5,13]]},"assertion":[{"value":"2019-05-13","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}