{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,5]],"date-time":"2026-08-05T17:58:44Z","timestamp":1785952724022,"version":"3.56.0"},"publisher-location":"New York, NY, USA","reference-count":38,"publisher":"ACM","license":[{"start":{"date-parts":[[2019,6,22]],"date-time":"2019-06-22T00:00:00Z","timestamp":1561161600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2019,6,22]]},"DOI":"10.1145\/3307650.3322219","type":"proceedings-article","created":{"date-parts":[[2019,6,14]],"date-time":"2019-06-14T12:42:33Z","timestamp":1560516153000},"page":"774-787","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":25,"title":["Cryogenic computer architecture modeling with memory-side case studies"],"prefix":"10.1145","author":[{"given":"Gyu-hyeon","family":"Lee","sequence":"first","affiliation":[{"name":"Seoul National University, Seoul, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dongmoon","family":"Min","sequence":"additional","affiliation":[{"name":"Seoul National University, Seoul, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ilkwon","family":"Byun","sequence":"additional","affiliation":[{"name":"Seoul National University, Seoul, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jangwoo","family":"Kim","sequence":"additional","affiliation":[{"name":"Seoul National University, Seoul, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2019,6,22]]},"reference":[{"key":"e_1_3_2_1_1_1","article-title":"Thermodynamic Properties of Copper","volume":"36","author":"Arblaster J. W.","year":"2015","unstructured":"J. W. Arblaster. 2015. Thermodynamic Properties of Copper. Journal of Phase Equilibria and Diffusion 36, 5 (01 Oct 2015), 422--444.","journal-title":"Journal of Phase Equilibria and Diffusion"},{"key":"e_1_3_2_1_2_1","volume-title":"Influence of substrate freeze-out on the characteristics of MOS transistors at very low temperatures. Solid-state electronics 30, 3","author":"Balestra F","year":"1987","unstructured":"F Balestra, L Audaire, and C Lucas. 1987. Influence of substrate freeze-out on the characteristics of MOS transistors at very low temperatures. Solid-state electronics 30, 3 (1987), 321--327."},{"key":"e_1_3_2_1_3_1","unstructured":"N Balshaw. 1996. Practical cryogenics. And introduction to laboratory cryogenics. (1996)."},{"key":"e_1_3_2_1_4_1","volume-title":"Cryogenic heat transfer","author":"Barron Randall F","unstructured":"Randall F Barron. 1999. Cryogenic heat transfer. CRC press."},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/2024716.2024718"},{"key":"e_1_3_2_1_6_1","unstructured":"Chris Brady. {n.d.}. Memtest86."},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2015.368"},{"key":"e_1_3_2_1_8_1","volume-title":"Fundamentals of materials science and engineering: an integrated approach","author":"Callister William D","unstructured":"William D Callister Jr and David G Rethwisch. 2012. Fundamentals of materials science and engineering: an integrated approach. John Wiley & Sons."},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.5555\/2492708.2492719"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2015.2481183"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1974.1050511"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/2248487.2150982"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1080\/14786435908233340"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"crossref","unstructured":"WH Henkels D-S Wen RL Mohler RL Franch TJ Bucelot CW Long JA Bracchitta WJ Cote GB Bronner Y Taur et al. 1991. A 4-Mb low-temperature DRAM. IEEE journal of solid-state circuits 26 11 (1991) 1519--1529.","DOI":"10.1109\/4.98967"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1145\/1186736.1186737"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.3253100"},{"key":"e_1_3_2_1_17_1","volume-title":"Case studies in superconducting magnets: design and operational issues","author":"Iwasa Yukikazu","unstructured":"Yukikazu Iwasa. 2009. Case studies in superconducting magnets: design and operational issues. Springer Science & Business Media."},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1631\/jzus.A0820540"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2003.1250885"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2005.379"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1109\/77.80745"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/2.612253"},{"key":"e_1_3_2_1_23_1","doi-asserted-by":"publisher","DOI":"10.1147\/rd.462.0169"},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1145\/1995896.1995911"},{"key":"e_1_3_2_1_25_1","doi-asserted-by":"publisher","DOI":"10.1109\/6.591665"},{"key":"e_1_3_2_1_26_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2692(02)00071-X"},{"key":"e_1_3_2_1_27_1","volume-title":"2014 11th International Workshop on Low Temperature Electronics (WOLTE). 29--32","author":"Shin M.","unstructured":"M. Shin, M. Shi, M. Mouis, A. Cros, E. Josse, G. T. Kim, and G. Ghibaudo. 2014. Low temperature characterization of 14nm FDSOI CMOS devices. In 2014 11th International Workshop on Low Temperature Electronics (WOLTE). 29--32."},{"key":"e_1_3_2_1_28_1","doi-asserted-by":"publisher","DOI":"10.1088\/0953-2048\/26\/3\/035010"},{"key":"e_1_3_2_1_29_1","doi-asserted-by":"publisher","DOI":"10.1145\/3132402.3132436"},{"key":"e_1_3_2_1_30_1","doi-asserted-by":"publisher","DOI":"10.1109\/IMW.2018.8388826"},{"key":"e_1_3_2_1_31_1","doi-asserted-by":"publisher","DOI":"10.1145\/3132402.3132424"},{"key":"e_1_3_2_1_32_1","volume-title":"International technology roadmap for semiconductors (ITRS)","author":"Wilson Linda","year":"2013","unstructured":"Linda Wilson. 2013. International technology roadmap for semiconductors (ITRS). Semiconductor Industry Association (2013)."},{"key":"e_1_3_2_1_33_1","doi-asserted-by":"publisher","DOI":"10.1109\/4.509850"},{"key":"e_1_3_2_1_34_1","doi-asserted-by":"publisher","DOI":"10.1145\/216585.216588"},{"key":"e_1_3_2_1_35_1","first-page":"30","article-title":"Bsim4. 3.0 mosfet model. Dept","volume":"94720","author":"Xi X","year":"2003","unstructured":"X Xi, Mohan Dunga, Jin He, Weidong Liu, Kanyu M Cao, Xiaodong Jin, Jeff J Ou, Mansun Chan, Ali M Niknejad, Chenming Hu, et al. 2003. Bsim4. 3.0 mosfet model. Dept. Elect. Eng. Comput. Sci., Univ. California, Berkeley, CA, Tech. Rep 94720 (2003), 30.","journal-title":"Elect. Eng. Comput. Sci., Univ. California, Berkeley, CA, Tech. Rep"},{"key":"e_1_3_2_1_36_1","volume-title":"Validation, acceleration and extension","author":"Zhang Runjie","year":"2015","unstructured":"Runjie Zhang, Mircea R Stan, and Kevin Skadron. 2015. HotSpot 6.0: Validation, acceleration and extension. University of Virginia, Tech. Rep (2015)."},{"key":"e_1_3_2_1_37_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cryogenics.2013.10.003"},{"key":"e_1_3_2_1_38_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.91"}],"event":{"name":"ISCA '19: The 46th Annual International Symposium on Computer Architecture","location":"Phoenix Arizona","acronym":"ISCA '19","sponsor":["SIGARCH ACM Special Interest Group on Computer Architecture","IEEE-CS\\DATC IEEE Computer Society"]},"container-title":["Proceedings of the 46th International Symposium on Computer Architecture"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3307650.3322219","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3307650.3322219","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T23:13:38Z","timestamp":1750202018000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3307650.3322219"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,6,22]]},"references-count":38,"alternative-id":["10.1145\/3307650.3322219","10.1145\/3307650"],"URL":"https:\/\/doi.org\/10.1145\/3307650.3322219","relation":{},"subject":[],"published":{"date-parts":[[2019,6,22]]},"assertion":[{"value":"2019-06-22","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}