{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:29:08Z","timestamp":1750220948256,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":16,"publisher":"ACM","license":[{"start":{"date-parts":[[2019,6,2]],"date-time":"2019-06-02T00:00:00Z","timestamp":1559433600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2019,6,2]]},"DOI":"10.1145\/3316781.3317913","type":"proceedings-article","created":{"date-parts":[[2019,5,23]],"date-time":"2019-05-23T18:07:13Z","timestamp":1558634833000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Sparse 3-D NoCs with Inductive Coupling"],"prefix":"10.1145","author":[{"given":"Michihiro","family":"Koibuchi","sequence":"first","affiliation":[{"name":"National Institute of Informatics, JAPAN"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lambert","family":"Leong","sequence":"additional","affiliation":[{"name":"University of Hawai'i at Manoa, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tomohiro","family":"Totoki","sequence":"additional","affiliation":[{"name":"Keio University, JAPAN"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Naoya","family":"Niwa","sequence":"additional","affiliation":[{"name":"Keio University, JAPAN"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroki","family":"Matsutani","sequence":"additional","affiliation":[{"name":"Keio University, JAPAN"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hideharu","family":"Amano","sequence":"additional","affiliation":[{"name":"Keio University, JAPAN"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Henri","family":"Casanova","sequence":"additional","affiliation":[{"name":"University of Hawai'i at Manoa, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2019,6,2]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/2024716.2024718"},{"volume-title":"Dynamic Thermal Management for High-Performance Microprocessors. In International Symposium on High-Performance Computer Architecture (HPCA). 171--182","author":"Brooks D. M.","key":"e_1_3_2_1_2_1","unstructured":"D. M. Brooks and M. Martonosi . 2001 . Dynamic Thermal Management for High-Performance Microprocessors. In International Symposium on High-Performance Computer Architecture (HPCA). 171--182 . D. M. Brooks and M. Martonosi. 2001. Dynamic Thermal Management for High-Performance Microprocessors. In International Symposium on High-Performance Computer Architecture (HPCA). 171--182."},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/3130218.3130224"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2418216"},{"key":"e_1_3_2_1_5_1","volume-title":"Near-Field Coupling Integration Technology. In International Symposium on Networks-on-Chip (NOCS), Keynote, http:\/\/www.arc.ics.keio.ac.jp\/nocs16\/files\/Kuroda NOCS2016","author":"Kuroda T.","year":"2016","unstructured":"T. Kuroda . 2016 . Near-Field Coupling Integration Technology. In International Symposium on Networks-on-Chip (NOCS), Keynote, http:\/\/www.arc.ics.keio.ac.jp\/nocs16\/files\/Kuroda NOCS2016 .pdf. T. Kuroda. 2016. Near-Field Coupling Integration Technology. In International Symposium on Networks-on-Chip (NOCS), Keynote, http:\/\/www.arc.ics.keio.ac.jp\/nocs16\/files\/Kuroda NOCS2016.pdf."},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/71.722222"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"volume-title":"Automation Test in Europe Conference Exhibition (DATE). 1--6.","author":"Matsutani H.","key":"e_1_3_2_1_8_1","unstructured":"H. Matsutani , M. Koibuchi , I. Fujiwara , T. Kagami , Y. Take , T. Kuroda , P. Bogdan , R. Marculescu , and H. Amano . 2014. Low-latency wireless 3D NoCs via randomized shortcut chips. In Design , Automation Test in Europe Conference Exhibition (DATE). 1--6. H. Matsutani, M. Koibuchi, I. Fujiwara, T. Kagami, Y. Take, T. Kuroda, P. Bogdan, R. Marculescu, and H. Amano. 2014. Low-latency wireless 3D NoCs via randomized shortcut chips. In Design, Automation Test in Europe Conference Exhibition (DATE). 1--6."},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.914716"},{"volume-title":"IEEE International Solid-State Circuits Conference (ISSCC). 436--437","author":"Miura N.","key":"e_1_3_2_1_10_1","unstructured":"N. Miura , K. Kasuga , M. Saito , and T. Kuroda . 2010. An 8Tb\/s 1pJ\/b 0.8mm2\/Tb\/s QDR inductive-coupling interface between 65nm CMOS GPU and 0.1μm DRAM . In IEEE International Solid-State Circuits Conference (ISSCC). 436--437 . N. Miura, K. Kasuga, M. Saito, and T. Kuroda. 2010. An 8Tb\/s 1pJ\/b 0.8mm2\/Tb\/s QDR inductive-coupling interface between 65nm CMOS GPU and 0.1μm DRAM. In IEEE International Solid-State Circuits Conference (ISSCC). 436--437."},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2013.112"},{"volume-title":"Randomly Optimized Grid Graph for Low-Latency Interconnection Networks. In International Conference on Parallel Processing (ICPP). 340--349","author":"Nakano K.","key":"e_1_3_2_1_12_1","unstructured":"K. Nakano , D. Takafuji , S. Fujita , H. Matsutani , I. Fujiwara , and M. Koibuchi . 2016 . Randomly Optimized Grid Graph for Low-Latency Interconnection Networks. In International Conference on Parallel Processing (ICPP). 340--349 . K. Nakano, D. Takafuji, S. Fujita, H. Matsutani, I. Fujiwara, and M. Koibuchi. 2016. Randomly Optimized Grid Graph for Low-Latency Interconnection Networks. In International Conference on Parallel Processing (ICPP). 340--349."},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2009.2020724"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.878263"},{"key":"e_1_3_2_1_15_1","volume-title":"Tech. Report CS-2015-04.","author":"Zhang R.","year":"2015","unstructured":"R. Zhang and M. R. Stan and K. Skadron . 2015 . HotSpot 6.0: Validation, Acceleration and Extension. University o f Virginia, Tech. Report CS-2015-04. R. Zhang and M. R. Stan and K. Skadron. 2015. HotSpot 6.0: Validation, Acceleration and Extension. University o f Virginia, Tech. Report CS-2015-04."},{"volume-title":"IEEE International Solid-State Circuits Conference (ISSCC). 440--441","author":"Saito M.","key":"e_1_3_2_1_16_1","unstructured":"M. Saito , N. Miura , and T. Kuroda . 2010. A 2Gb\/s 1.8pJ\/b\/chip inductive-coupling through-chip bus for 128-Die NAND-Flash memory stacking . In IEEE International Solid-State Circuits Conference (ISSCC). 440--441 . M. Saito, N. Miura, and T. Kuroda. 2010. A 2Gb\/s 1.8pJ\/b\/chip inductive-coupling through-chip bus for 128-Die NAND-Flash memory stacking. In IEEE International Solid-State Circuits Conference (ISSCC). 440--441."}],"event":{"name":"DAC '19: The 56th Annual Design Automation Conference 2019","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA","SIGBED ACM Special Interest Group on Embedded Systems"],"location":"Las Vegas NV USA","acronym":"DAC '19"},"container-title":["Proceedings of the 56th Annual Design Automation Conference 2019"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3316781.3317913","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3316781.3317913","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T23:53:53Z","timestamp":1750204433000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3316781.3317913"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,6,2]]},"references-count":16,"alternative-id":["10.1145\/3316781.3317913","10.1145\/3316781"],"URL":"https:\/\/doi.org\/10.1145\/3316781.3317913","relation":{},"subject":[],"published":{"date-parts":[[2019,6,2]]},"assertion":[{"value":"2019-06-02","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}