{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:29:59Z","timestamp":1750220999559,"version":"3.41.0"},"reference-count":3,"publisher":"Association for Computing Machinery (ACM)","issue":"6","license":[{"start":{"date-parts":[[2019,5,21]],"date-time":"2019-05-21T00:00:00Z","timestamp":1558396800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["Commun. ACM"],"published-print":{"date-parts":[[2019,5,21]]},"abstract":"<jats:p>How long can the silicon foundry sector continue to adapt, as physical limits make further shrinkage virtually impossible?<\/jats:p>","DOI":"10.1145\/3323703","type":"journal-article","created":{"date-parts":[[2019,5,21]],"date-time":"2019-05-21T15:03:51Z","timestamp":1558451031000},"page":"16-18","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["And then, there were three"],"prefix":"10.1145","volume":"62","author":[{"given":"Don","family":"Monroe","sequence":"first","affiliation":[{"name":"Boston, MA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2019,5,21]]},"reference":[{"key":"e_1_2_1_1_1","unstructured":"International Roadmap for Devices and Systems 2017 Edition IEEE https:\/\/irds.ieee.org\/roadmap-2017.  International Roadmap for Devices and Systems 2017 Edition IEEE https:\/\/irds.ieee.org\/roadmap-2017."},{"volume-title":"The TSMC Way: Meeting Customer Needs at Taiwan Semiconductor Manufacturing Co., Harvard Business School Case Collection","year":"2009","author":"Shih W. C.","key":"e_1_2_1_2_1"},{"volume-title":"Communications","year":"2018","author":"Monroe D.","key":"e_1_2_1_3_1"}],"container-title":["Communications of the ACM"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3323703","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3323703","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T00:25:40Z","timestamp":1750206340000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3323703"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,5,21]]},"references-count":3,"journal-issue":{"issue":"6","published-print":{"date-parts":[[2019,5,21]]}},"alternative-id":["10.1145\/3323703"],"URL":"https:\/\/doi.org\/10.1145\/3323703","relation":{},"ISSN":["0001-0782","1557-7317"],"issn-type":[{"type":"print","value":"0001-0782"},{"type":"electronic","value":"1557-7317"}],"subject":[],"published":{"date-parts":[[2019,5,21]]},"assertion":[{"value":"2019-05-21","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}