{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:30:31Z","timestamp":1750221031918,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":9,"publisher":"ACM","license":[{"start":{"date-parts":[[2019,10,22]],"date-time":"2019-10-22T00:00:00Z","timestamp":1571702400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2019,10,22]]},"DOI":"10.1145\/3331453.3360965","type":"proceedings-article","created":{"date-parts":[[2019,10,21]],"date-time":"2019-10-21T13:34:22Z","timestamp":1571664862000},"page":"1-4","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":2,"title":["Research on TSV Void Defects Based on Machine Learning"],"prefix":"10.1145","author":[{"given":"Shouhong","family":"Chen","sequence":"first","affiliation":[{"name":"School of Electronic Engineering&Automation, Guangxi Key Laboratory of Automatic Detecting Technology and Instruments, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huaiqiang","family":"Kang","sequence":"additional","affiliation":[{"name":"School of Electronic Engineering&Automation, Guangxi Key Laboratory of Automatic Detecting Technology and Instruments, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Electronic Engineering&Automation, Guangxi Key Laboratory of Automatic Detecting Technology and Instruments, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ling","family":"Guo","sequence":"additional","affiliation":[{"name":"School of Electronic Engineering&Automation, Guangxi Key Laboratory of Automatic Detecting Technology and Instruments, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xingna","family":"Hou","sequence":"additional","affiliation":[{"name":"School of Electronic Engineering&Automation, Guangxi Key Laboratory of Automatic Detecting Technology and Instruments, Guilin University of Electronic Technology, Guilin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2019,10,22]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306569"},{"key":"e_1_3_2_1_2_1","volume-title":"C Wu and D Kwai","author":"Chen","year":"2010","unstructured":"P Chen , C Wu and D Kwai ( 2010 ). On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding. 2010-28th VLSI Test Symposium (VTS), Santa Cruz, CA , 263--268. P Chen, C Wu and D Kwai (2010). On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding. 2010-28th VLSI Test Symposium (VTS), Santa Cruz, CA, 263--268."},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-011-5261-4"},{"key":"e_1_3_2_1_4_1","first-page":"5","volume":"2","author":"Huang J","year":"2014","unstructured":"S Huang , J Lee , K Tsai and W Cheng ( 2014 ). Pulse-Vanishing Test for Interposers Wires in 2 . 5 -D IC. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 33(8): 1258--1268. S Huang, J Lee, K Tsai and W Cheng (2014). Pulse-Vanishing Test for Interposers Wires in 2.5-D IC. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 33(8): 1258--1268.","journal-title":"Pulse-Vanishing Test for Interposers Wires in"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.225"},{"issue":"6","key":"e_1_3_2_1_6_1","first-page":"863","volume":"46","author":"Liu Yong LI","year":"2016","unstructured":"Liu Yong , LI Huangqi , Huang Zhengfeng and Chang Hao ( 2016 ). A Method of Prebond TSV Test Based on Arbiter. Microelectronics , 46 ( 6 ): 863 -- 868 . Liu Yong, LI Huangqi, Huang Zhengfeng and Chang Hao (2016). A Method of Prebond TSV Test Based on Arbiter. Microelectronics, 46(6):863--868.","journal-title":"Microelectronics"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1038\/nature14539"},{"key":"e_1_3_2_1_8_1","volume-title":"Overview of Ensemble Algorithms. China Computer & Communication, (3):50--51","author":"Zhang Pengpeng","year":"2019","unstructured":"Zhang Pengpeng ( 2019 ). Overview of Ensemble Algorithms. China Computer & Communication, (3):50--51 . Zhang Pengpeng (2019). Overview of Ensemble Algorithms. China Computer & Communication, (3):50--51."},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2788896"}],"event":{"name":"CSAE 2019: The 3rd International Conference on Computer Science and Application Engineering","acronym":"CSAE 2019","location":"Sanya China"},"container-title":["Proceedings of the 3rd International Conference on Computer Science and Application Engineering"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3331453.3360965","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3331453.3360965","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T00:43:29Z","timestamp":1750207409000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3331453.3360965"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10,22]]},"references-count":9,"alternative-id":["10.1145\/3331453.3360965","10.1145\/3331453"],"URL":"https:\/\/doi.org\/10.1145\/3331453.3360965","relation":{},"subject":[],"published":{"date-parts":[[2019,10,22]]},"assertion":[{"value":"2019-10-22","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}