{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,23]],"date-time":"2025-12-23T18:49:31Z","timestamp":1766515771972,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":15,"publisher":"ACM","license":[{"start":{"date-parts":[[2020,4,25]],"date-time":"2020-04-25T00:00:00Z","timestamp":1587772800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2020,4,25]]},"DOI":"10.1145\/3334480.3382804","type":"proceedings-article","created":{"date-parts":[[2020,5,28]],"date-time":"2020-05-28T13:22:17Z","timestamp":1590672137000},"page":"1-7","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":13,"title":["iMold: Enabling Interactive Design Optimization for In-Mold Electronics"],"prefix":"10.1145","author":[{"given":"Jonathan","family":"Ting","sequence":"first","affiliation":[{"name":"University of California, Berkeley, Berkeley, CA, USA"}]},{"given":"Yunbo","family":"Zhang","sequence":"additional","affiliation":[{"name":"Rochester Institute of Technology, Rochester, NY, USA"}]},{"given":"Sang Ho","family":"Yoon","sequence":"additional","affiliation":[{"name":"Microsoft Corporation, Redmond, WA, USA"}]},{"given":"James D.","family":"Holbery","sequence":"additional","affiliation":[{"name":"Tactual Labs, Redmond, WA, USA"}]},{"given":"Siyuan","family":"Ma","sequence":"additional","affiliation":[{"name":"Microsoft Corporation, Redmond, WA, USA"}]}],"member":"320","published-online":{"date-parts":[[2020,4,25]]},"reference":[{"key":"e_1_3_2_1_1_1","volume-title":"Retrieved","author":"Chemical Sun","year":"2019","unstructured":"Sun Chemical. 2019. In-Mold Electronic Materials. Retrieved Nov 30, 2019. (Nov. 2019). from https:\/\/www.sunchemical.com\/product\/in-mold-electronic-materials-ime."},{"volume-title":"Retrieved","year":"2019","key":"e_1_3_2_1_2_1","unstructured":"DuPont. 2019. DuPont In-Mold Electronic Technology. Retrieved Nov 30, 2019. (Nov. 2019). from https:\/\/www.dupont.com\/products\/in-mold-electronic-technology.html."},{"volume-title":"Retrieved","year":"2019","key":"e_1_3_2_1_3_1","unstructured":"DuraTech. 2019. IN-MOLD ELECTRONICS (IME). Retrieved Nov 30, 2019. (Nov. 2019). from https:\/\/www.duratech.com\/capabilities\/ime-in-mold-electronics."},{"volume-title":"INC. Retrieved","year":"2019","key":"e_1_3_2_1_4_1","unstructured":"Eastprint. 2019. IN-MOLD ELECTRONICS DESIGN & MANUFACTURING AT EASTPRINT, INC. Retrieved Nov 30, 2019. (Nov. 2019). from https:\/\/www.eastprint.com\/in-mold-electronics.html."},{"key":"e_1_3_2_1_5_1","volume-title":"Retrieved","author":"ECM.","year":"2019","unstructured":"ECM. 2019. Product List. Retrieved Nov 30, 2019. (Nov. 2019). from http:\/\/www.conductives.com\/new_products.php."},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1117\/12.915206"},{"key":"e_1_3_2_1_8_1","volume-title":"Adopting Hybrid Integrated Flexible Electronics in Products: Case-Personal Activity Meter","author":"Kololuoma Terho","year":"2019","unstructured":"Terho Kololuoma, Mikko Ker\u00e4nen, Timo Kurkela, Tuomas Happonen, Marko Korkalainen, Minna Kehusmaa, Lucia Gomez, Aida Branco, Sami Ihme, Carlos Pinheiro, and others. 2019. Adopting Hybrid Integrated Flexible Electronics in Products: Case-Personal Activity Meter. IEEE Journal of the Electron Devices Society (2019)."},{"volume-title":"Computer Graphics Forum","author":"Liu Ligang","key":"e_1_3_2_1_9_1","unstructured":"Ligang Liu, Lei Zhang, Yin Xu, Craig Gotsman, and Steven J Gortler. 2008. A local\/global approach to mesh parameterization. In Computer Graphics Forum, Vol. 27. Wiley Online Library, 1495--1504."},{"key":"e_1_3_2_1_10_1","volume-title":"SMTA Microelectronic Symposium, Kona. 18--20","author":"M\u00e4kinen JT","year":"2011","unstructured":"JT M\u00e4kinen, K Ker\u00e4nen, T Alajoki, M Koponen, A Ker\u00e4nen, A Kemppainen, and K R\u00f6nk\u00e4. 2011. Over-molded electronics and printed hybrid systems. In SMTA Microelectronic Symposium, Kona. 18--20."},{"key":"e_1_3_2_1_11_1","volume-title":"Retrieved","author":"Materials Creative","year":"2019","unstructured":"Creative Materials. 2019. Conductive Silver Inks. Retrieved Nov 30, 2019. (Nov. 2019). from http:\/\/www.creativematerials.com\/products\/silver-inks."},{"key":"e_1_3_2_1_12_1","volume-title":"Retrieved","author":"Oy TactoTek","year":"2019","unstructured":"TactoTek Oy. 2019. TactoTek. Retrieved Nov 30, 2019. (Nov. 2019). from https:\/\/tactotek.com."},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1145\/2897824.2925914"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cag.2004.06.011"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1108\/RPJ-08-2016-0129"},{"key":"e_1_3_2_1_16_1","volume-title":"Coloring 3D printed surfaces by thermoforming","author":"Zhang Yizhong","year":"2016","unstructured":"Yizhong Zhang, Yiying Tong, and Kun Zhou. 2016. Coloring 3D printed surfaces by thermoforming. IEEE transactions on visualization and computer graphics 23, 8 (2016), 1924--1935."}],"event":{"name":"CHI '20: CHI Conference on Human Factors in Computing Systems","sponsor":["SIGCHI ACM Special Interest Group on Computer-Human Interaction"],"location":"Honolulu HI USA","acronym":"CHI '20"},"container-title":["Extended Abstracts of the 2020 CHI Conference on Human Factors in Computing Systems"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3334480.3382804","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3334480.3382804","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T22:33:10Z","timestamp":1750199590000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3334480.3382804"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,4,25]]},"references-count":15,"alternative-id":["10.1145\/3334480.3382804","10.1145\/3334480"],"URL":"https:\/\/doi.org\/10.1145\/3334480.3382804","relation":{},"subject":[],"published":{"date-parts":[[2020,4,25]]},"assertion":[{"value":"2020-04-25","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}