{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,8]],"date-time":"2026-02-08T02:51:59Z","timestamp":1770519119411,"version":"3.49.0"},"publisher-location":"New York, NY, USA","reference-count":202,"publisher":"ACM","license":[{"start":{"date-parts":[[2020,3,30]],"date-time":"2020-03-30T00:00:00Z","timestamp":1585526400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"NYUAD REF","award":["RE218"],"award-info":[{"award-number":["RE218"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2020,3,30]]},"DOI":"10.1145\/3372780.3378175","type":"proceedings-article","created":{"date-parts":[[2020,3,20]],"date-time":"2020-03-20T21:30:19Z","timestamp":1584739819000},"page":"75-86","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":22,"title":["Hardware Security For and Beyond CMOS Technology"],"prefix":"10.1145","author":[{"given":"Johann","family":"Knechtel","sequence":"first","affiliation":[{"name":"New York University Abu Dhabi, Abu Dhabi, UAE"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2020,3,30]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"BIBentryALTinterwordspacingB. Krebs. (2019) First american financial corp. leaked hundreds of millions of title insurance records. https:\/\/krebsonsecurity.com\/2019\/05\/first-american-financial-corp-leaked-hundreds-of-millions-of-title-insurance-records\/BIBentrySTDinterwordspacing  BIBentryALTinterwordspacingB. Krebs. (2019) First american financial corp. leaked hundreds of millions of title insurance records. https:\/\/krebsonsecurity.com\/2019\/05\/first-american-financial-corp-leaked-hundreds-of-millions-of-title-insurance-records\/BIBentrySTDinterwordspacing"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2017.2647955"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/3297858.3304020"},{"key":"e_1_3_2_1_4_1","volume-title":"Comp. Research Rep., 2019","author":"Nabeel M.","year":"1906"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0146-5"},{"key":"e_1_3_2_1_6_1","volume-title":"Secure Integrated Circuits and Systems, ser. Integrated Circuits and Systems.hskip 1em plus 0.5em minus 0.4emrelax Springer","author":"Verbauwhede I.","year":"2010"},{"key":"e_1_3_2_1_7_1","first-page":"10","article-title":"Correlation power analysis with a leakage model","author":"Brier E.","year":"2004","journal-title":"Proc. Cryptogr. Hardw. Embed. Sys."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1007\/s13389-015-0113-2"},{"key":"e_1_3_2_1_9_1","first-page":"195","volume-title":"Proc. Comp. Comm. Sec., 2019","author":"Qiu P.","year":"1953"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.46586\/tches.v2019.i4.126-153"},{"key":"e_1_3_2_1_11_1","volume-title":"Proc. Worksh. Off. Tech.","author":"Cui A.","year":"2017"},{"key":"e_1_3_2_1_12_1","volume-title":"IACR Crypt. ePrint Arch., no. 388","author":"Zhou Y.","year":"2005"},{"key":"e_1_3_2_1_13_1","volume-title":"IACR Crypt. ePrint Arch.","author":"Osvik D. A.","year":"2005"},{"key":"e_1_3_2_1_14_1","volume-title":"Comp. Research Rep., 2018","author":"Lipp M.","year":"1801"},{"key":"e_1_3_2_1_15_1","volume-title":"Comp. Research Rep., 2019","author":"Schwarz M.","year":"1905"},{"key":"e_1_3_2_1_16_1","first-page":"10","article-title":"Domain-oriented masking: Compact masked hardware implementations with arbitrary protection order","author":"Gro\u00df H.","year":"2016","journal-title":"Proc. Comp. Comm. Sec."},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2816914"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1109\/FDTC.2016.16"},{"key":"e_1_3_2_1_19_1","first-page":"1675","article-title":"Drammer: Deterministic rowhammer attacks on mobile platforms","author":"van der Veen V.","year":"2016","journal-title":"Proc. Comp. Comm. Sec."},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8714891"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1109\/DCIS.2018.8681476"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/FDTC.2018.00009"},{"key":"e_1_3_2_1_23_1","first-page":"68","volume-title":"Proc. PROOFS@CHES","author":"Karp B.","year":"2018"},{"issue":"4","key":"e_1_3_2_1_24_1","first-page":"36","article-title":"Plasma FIB deprocessing of integrated circuits from the backside","volume":"19","author":"Principe E. L.","year":"2017","journal-title":"Elec. Dev. Fail. Analysis"},{"issue":"5","key":"e_1_3_2_1_25_1","first-page":"63","article-title":"Probing attacks on integrated circuits: Challenges and research opportunities","volume":"34","author":"Wang H.","year":"2017","journal-title":"Des. Test"},{"key":"e_1_3_2_1_26_1","first-page":"733","article-title":"Breaking and entering through the silicon","author":"Helfmeier C.","year":"2013","journal-title":"Proc. Comp. Comm. Sec."},{"key":"e_1_3_2_1_27_1","first-page":"1661","article-title":"On the power of optical contactless probing: Attacking bitstream encryption of FPGAs","author":"Tajik S.","year":"2017","journal-title":"Proc. Comp. Comm. Sec."},{"key":"e_1_3_2_1_28_1","first-page":"1","volume-title":"Proc. Int. Symp. Test. Failure Analys.","author":"Courbon F.","year":"2016"},{"key":"e_1_3_2_1_29_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2901449"},{"key":"e_1_3_2_1_30_1","first-page":"10","article-title":"Robust secure shield architecture for detection and protection against invasive attacks","author":"Lee Y.","year":"2019","journal-title":"Trans. Comp.-Aided Des. Integ. Circ. Sys."},{"key":"e_1_3_2_1_31_1","doi-asserted-by":"publisher","DOI":"10.5573\/JSTS.2016.16.4.470"},{"key":"e_1_3_2_1_32_1","volume-title":"Proc. Int. Symp. Test. Failure Analys.","author":"Shen H.","year":"2018"},{"key":"e_1_3_2_1_33_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2762630"},{"key":"e_1_3_2_1_34_1","first-page":"463","article-title":"Private circuits: Securing hardware against probing attacks","author":"Ishai Y.","year":"2003","journal-title":"Advances in Cryptology"},{"key":"e_1_3_2_1_35_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2335155"},{"key":"e_1_3_2_1_36_1","doi-asserted-by":"publisher","DOI":"10.1145\/3312614.3312657"},{"key":"e_1_3_2_1_37_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-15334-2"},{"key":"e_1_3_2_1_38_1","doi-asserted-by":"publisher","DOI":"10.3850\/9783981537079_0687"},{"key":"e_1_3_2_1_39_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-66787-4_9"},{"key":"e_1_3_2_1_40_1","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2010.284"},{"key":"e_1_3_2_1_41_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2511144"},{"key":"e_1_3_2_1_42_1","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2015.7140252"},{"key":"e_1_3_2_1_43_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-662-53140-2_7"},{"key":"e_1_3_2_1_44_1","first-page":"1601","article-title":"Provably-secure logic locking: From theory to practice","author":"Yasin M.","year":"2017","journal-title":"Proc. Comp. Comm. Sec."},{"key":"e_1_3_2_1_45_1","doi-asserted-by":"publisher","DOI":"10.1145\/3060403.3060469"},{"key":"e_1_3_2_1_46_1","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2017.7951805"},{"key":"e_1_3_2_1_47_1","volume-title":"Comp. Research Rep.","author":"Massad M. E.","year":"2017"},{"key":"e_1_3_2_1_48_1","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8714955"},{"key":"e_1_3_2_1_49_1","doi-asserted-by":"publisher","DOI":"10.1109\/AsianHOST.2018.8607163"},{"key":"e_1_3_2_1_50_1","first-page":"709","article-title":"Security analysis of integrated circuit camouflaging","author":"Rajendran J.","year":"2013","journal-title":"Proc. Comp. Comm. Sec."},{"key":"e_1_3_2_1_51_1","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2016.7495587"},{"key":"e_1_3_2_1_52_1","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967065"},{"key":"e_1_3_2_1_53_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203758"},{"key":"e_1_3_2_1_54_1","unstructured":"BIBentryALTinterwordspacing(2019) Circuit camouflage technology. Rambus Inc. https:\/\/www.rambus.com\/security\/cryptofirewall-cores\/circuit-camouflage-technology\/BIBentrySTDinterwordspacing  BIBentryALTinterwordspacing(2019) Circuit camouflage technology. Rambus Inc. https:\/\/www.rambus.com\/security\/cryptofirewall-cores\/circuit-camouflage-technology\/BIBentrySTDinterwordspacing"},{"key":"e_1_3_2_1_55_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2323976"},{"key":"e_1_3_2_1_56_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2652220"},{"key":"e_1_3_2_1_57_1","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.261"},{"key":"e_1_3_2_1_58_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203796"},{"key":"e_1_3_2_1_59_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2018.8297314"},{"key":"e_1_3_2_1_60_1","first-page":"1","volume-title":"Proc. Des. Autom. Conf., 2018","author":"Patnaik S.","year":"1959"},{"key":"e_1_3_2_1_61_1","unstructured":"BIBentryALTinterwordspacingC. McCants. (2016) Trusted integrated chips (TIC) program. https:\/\/www.ndia.org\/-\/media\/sites\/ndia\/meetings-and-events\/divisions\/systems-engineering\/past-events\/trusted-micro\/2016-august\/mccants-carl.ashxBIBentrySTDinterwordspacing  BIBentryALTinterwordspacingC. McCants. (2016) Trusted integrated chips (TIC) program. https:\/\/www.ndia.org\/-\/media\/sites\/ndia\/meetings-and-events\/divisions\/systems-engineering\/past-events\/trusted-micro\/2016-august\/mccants-carl.ashxBIBentrySTDinterwordspacing"},{"key":"e_1_3_2_1_62_1","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2014.6855559"},{"key":"e_1_3_2_1_63_1","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898104"},{"key":"e_1_3_2_1_64_1","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317780"},{"key":"e_1_3_2_1_65_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-68511-3"},{"key":"e_1_3_2_1_66_1","doi-asserted-by":"publisher","DOI":"10.1145\/3315574"},{"key":"e_1_3_2_1_67_1","doi-asserted-by":"publisher","DOI":"10.1007\/s13389-016-0132-7"},{"key":"e_1_3_2_1_68_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-04138-9_28"},{"key":"e_1_3_2_1_69_1","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2010.2061228"},{"key":"e_1_3_2_1_70_1","first-page":"51","volume-title":"Proc. Int. Symp. Hardw.-Orient. Sec. Trust, 2008","author":"Jin Y.","year":"2008"},{"key":"e_1_3_2_1_71_1","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2011.2160627"},{"key":"e_1_3_2_1_72_1","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2019.8740840"},{"key":"e_1_3_2_1_73_1","doi-asserted-by":"publisher","DOI":"10.1007\/s13389-015-0102-5"},{"key":"e_1_3_2_1_74_1","volume-title":"Proc. Int. Symp. Test. Failure Analys., 2018","author":"Vashistha N.","year":"2034"},{"key":"e_1_3_2_1_75_1","doi-asserted-by":"publisher","DOI":"10.1109\/RSP.2015.7416550"},{"key":"e_1_3_2_1_76_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2356453"},{"key":"e_1_3_2_1_77_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2060375"},{"issue":"3","key":"e_1_3_2_1_78_1","first-page":"6","article-title":"Protection against hardware trojan attacks: Towards a comprehensive solution","volume":"30","author":"Bhunia S.","year":"2013","journal-title":"Des. Test"},{"key":"e_1_3_2_1_79_1","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2017.2658544"},{"key":"e_1_3_2_1_80_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2474373"},{"key":"e_1_3_2_1_81_1","doi-asserted-by":"publisher","DOI":"10.1109\/SP.2016.51"},{"key":"e_1_3_2_1_82_1","first-page":"495","volume-title":"Proc. USENIX Sec. Symp.","author":"Imeson F.","year":"2013"},{"key":"e_1_3_2_1_83_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2320516"},{"key":"e_1_3_2_1_84_1","first-page":"3","volume-title":"Physically Unclonable Functions: A Study on the State of the Art and Future Research Directions. hskip 1em plus 0.5em minus 0.4emrelax Springer","author":"Maes R.","year":"2010"},{"key":"e_1_3_2_1_85_1","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2017.2713305"},{"key":"e_1_3_2_1_87_1","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2013.2279798"},{"key":"e_1_3_2_1_88_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2759731"},{"key":"e_1_3_2_1_89_1","doi-asserted-by":"publisher","DOI":"10.1126\/science.1074376"},{"key":"e_1_3_2_1_90_1","volume-title":"IACR Crypt. ePrint Arch.","author":"R\u00fchrmair U.","year":"2013"},{"key":"e_1_3_2_1_91_1","first-page":"133","volume-title":"Strong Authentication with Physical Unclonable Functions. hskip 1em plus 0.5em minus 0.4emrelax","author":"Tuyls P.","year":"2007"},{"key":"e_1_3_2_1_92_1","doi-asserted-by":"publisher","DOI":"10.1364\/OE.25.012710"},{"key":"e_1_3_2_1_93_1","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2019.2920949"},{"key":"e_1_3_2_1_94_1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2870916"},{"key":"e_1_3_2_1_95_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-017-00714-1"},{"key":"e_1_3_2_1_96_1","doi-asserted-by":"publisher","DOI":"10.1364\/OE.20.012222"},{"key":"e_1_3_2_1_97_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2018.2882603"},{"key":"e_1_3_2_1_98_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0099-8"},{"key":"e_1_3_2_1_99_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-018-0770-2"},{"key":"e_1_3_2_1_100_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2013.2252317"},{"key":"e_1_3_2_1_101_1","doi-asserted-by":"publisher","DOI":"10.1088\/0268-1242\/31\/11\/113006"},{"key":"e_1_3_2_1_102_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2481793"},{"issue":"3","key":"e_1_3_2_1_103_1","first-page":"22","article-title":"Spin-based reconfigurable logic for power- and area-efficient applications","volume":"36","author":"Rangarajan N.","year":"2019","journal-title":"Des. Test"},{"key":"e_1_3_2_1_104_1","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2014.214"},{"key":"e_1_3_2_1_105_1","doi-asserted-by":"publisher","DOI":"10.1038\/nphys3242"},{"key":"e_1_3_2_1_106_1","doi-asserted-by":"publisher","DOI":"10.1038\/nmat1349"},{"key":"e_1_3_2_1_107_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mattod.2017.07.007"},{"key":"e_1_3_2_1_108_1","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2017.2696041"},{"key":"e_1_3_2_1_109_1","doi-asserted-by":"publisher","DOI":"10.1143\/APEX.1.091301"},{"key":"e_1_3_2_1_110_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCT.1971.1083337"},{"key":"e_1_3_2_1_111_1","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/22\/48\/485203"},{"key":"e_1_3_2_1_112_1","first-page":"667","volume-title":"Proc. Des. Autom. Test Europe, 2010","author":"Wang X.","year":"2010"},{"key":"e_1_3_2_1_113_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.carbon.2017.07.090"},{"key":"e_1_3_2_1_114_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00339-011-6264-9"},{"key":"e_1_3_2_1_115_1","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2013.2256257"},{"key":"e_1_3_2_1_116_1","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/24\/25\/255201"},{"key":"e_1_3_2_1_117_1","volume-title":"Comp. Research Rep.","author":"Meuffels P.","year":"2012"},{"key":"e_1_3_2_1_118_1","first-page":"131","volume-title":"Proc. Int. Integ. Rel. Worksh., 2014","author":"Yang-Scharlotta J.","year":"2014"},{"key":"e_1_3_2_1_119_1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046994"},{"key":"e_1_3_2_1_120_1","volume-title":"Memristors and memristive systems. hskip 1em plus 0.5em minus 0.4emrelax Springer","author":"Tetzlaff R.","year":"2013"},{"key":"e_1_3_2_1_121_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-019-0270-x"},{"key":"e_1_3_2_1_122_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-29746-0"},{"key":"e_1_3_2_1_123_1","doi-asserted-by":"publisher","DOI":"10.1088\/0034-4885\/69\/3\/R01"},{"key":"e_1_3_2_1_124_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-73558-0_4"},{"key":"e_1_3_2_1_125_1","doi-asserted-by":"publisher","DOI":"10.1021\/nl203701g"},{"key":"e_1_3_2_1_126_1","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2018.8454842"},{"key":"e_1_3_2_1_127_1","doi-asserted-by":"publisher","DOI":"10.1039\/C3NR05290G"},{"key":"e_1_3_2_1_128_1","doi-asserted-by":"publisher","DOI":"10.1038\/nature12502"},{"key":"e_1_3_2_1_129_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2870560"},{"key":"e_1_3_2_1_130_1","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2007.914069"},{"key":"e_1_3_2_1_131_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2187527"},{"key":"e_1_3_2_1_132_1","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6641\/aa5581"},{"key":"e_1_3_2_1_133_1","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2006.873371"},{"key":"e_1_3_2_1_134_1","doi-asserted-by":"publisher","DOI":"10.1016\/S1369-7021(08)70055-5"},{"key":"e_1_3_2_1_135_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2008.2005158"},{"key":"e_1_3_2_1_136_1","first-page":"66","article-title":"Junctionless nanowire transistor (JNT): Properties and design guidelines","volume":"65","author":"Colinge J.","year":"2011","journal-title":"Solid-State Electronics"},{"key":"e_1_3_2_1_137_1","doi-asserted-by":"publisher","DOI":"10.1166\/jno.2016.1913"},{"key":"e_1_3_2_1_138_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.joule.2017.10.014"},{"key":"e_1_3_2_1_139_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.snb.2008.11.048"},{"key":"e_1_3_2_1_140_1","doi-asserted-by":"publisher","DOI":"10.2197\/ipsjtsldm.10.45"},{"key":"e_1_3_2_1_141_1","volume-title":"hskip 1em plus 0.5em minus 0.4emrelax Springer","author":"Radojcic R.","year":"2017"},{"key":"e_1_3_2_1_142_1","volume-title":"3D Stacked Chips -- From Emerging Processes to Heterogeneous Systems. hskip 1em plus 0.5em minus 0.4emrelax Springer","author":"Elfadel I. A. M.","year":"2016"},{"key":"e_1_3_2_1_143_1","doi-asserted-by":"publisher","DOI":"10.1557\/mrs.2015.32"},{"key":"e_1_3_2_1_144_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2222814"},{"key":"e_1_3_2_1_145_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176969"},{"key":"e_1_3_2_1_146_1","volume-title":"AMD previews EPYC rome processor: Up to 64 Zen 2 cores. https:\/\/www.anandtech.com\/show\/13561\/amd-previews-epyc-rome-processor-up-to-64-zen-2-coresBIBentrySTDinterwordspacing","author":"Shilov A.","year":"2018"},{"key":"e_1_3_2_1_147_1","doi-asserted-by":"publisher","DOI":"10.5555\/3152604"},{"issue":"6","key":"e_1_3_2_1_148_1","first-page":"1432","article-title":"A scalable network-on-chip microprocessor with 2.5D integrated memory and accelerator","volume":"64","author":"S. M. P. D.","year":"2017","journal-title":"Trans. Circ. Sys."},{"key":"e_1_3_2_1_149_1","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317775"},{"key":"e_1_3_2_1_150_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203849"},{"key":"e_1_3_2_1_151_1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2016.7838545"},{"key":"e_1_3_2_1_152_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2013.6487803"},{"key":"e_1_3_2_1_153_1","doi-asserted-by":"publisher","DOI":"10.1115\/IPACK2011-52189"},{"key":"e_1_3_2_1_154_1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.348"},{"key":"e_1_3_2_1_155_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2387353"},{"key":"e_1_3_2_1_156_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2016.2583419"},{"issue":"99","key":"e_1_3_2_1_157_1","first-page":"1","article-title":"Security beyond CMOS: Fundamentals, applications, and roadmap","author":"Rahman F.","year":"2017","journal-title":"Trans. VLSI Syst."},{"key":"e_1_3_2_1_158_1","doi-asserted-by":"publisher","DOI":"10.1145\/3060403.3060471"},{"key":"e_1_3_2_1_159_1","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898099"},{"key":"e_1_3_2_1_160_1","first-page":"10","article-title":"Exploiting spin-orbit torque devices as reconfigurable logic for circuit obfuscation","author":"Yang J.","year":"2018","journal-title":"Trans. Comp.-Aided Des. Integ. Circ. Sys."},{"key":"e_1_3_2_1_161_1","first-page":"10","article-title":"Spin-orbit torque devices for hardware security: From deterministic to probabilistic regime","volume":"2019","author":"Patnaik S.","journal-title":"Trans. Comp.-Aided Des. Integ. Circ. Sys."},{"key":"e_1_3_2_1_162_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2017.35"},{"key":"e_1_3_2_1_163_1","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2018.8341986"},{"key":"e_1_3_2_1_164_1","volume-title":"Comp. Research Rep., 2018","author":"Rangarajan N.","year":"1811"},{"key":"e_1_3_2_1_165_1","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2019.2934887"},{"key":"e_1_3_2_1_166_1","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2015.2398232"},{"key":"e_1_3_2_1_167_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.4985702"},{"key":"e_1_3_2_1_168_1","volume-title":"Comp. Research Rep., 2019","author":"Rangarajan N.","year":"1902"},{"key":"e_1_3_2_1_169_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2013.6509623"},{"key":"e_1_3_2_1_170_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0039-7"},{"key":"e_1_3_2_1_171_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2019.00102"},{"key":"e_1_3_2_1_172_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2606433"},{"key":"e_1_3_2_1_173_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2762919"},{"issue":"5","key":"e_1_3_2_1_174_1","first-page":"50","article-title":"A comparative security analysis of current and emerging technologies","volume":"36","author":"Suresh C. K. H.","year":"2016","journal-title":"Micro"},{"key":"e_1_3_2_1_175_1","doi-asserted-by":"publisher","DOI":"10.1145\/2816818"},{"key":"e_1_3_2_1_176_1","doi-asserted-by":"publisher","DOI":"10.1039\/C3NR04375D"},{"key":"e_1_3_2_1_177_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201603428"},{"key":"e_1_3_2_1_178_1","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2019.8854395"},{"key":"e_1_3_2_1_179_1","doi-asserted-by":"publisher","DOI":"10.1109\/TMSCS.2016.2550460"},{"key":"e_1_3_2_1_180_1","doi-asserted-by":"publisher","DOI":"10.1145\/3060403.3060500"},{"key":"e_1_3_2_1_181_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2227257"},{"key":"e_1_3_2_1_182_1","doi-asserted-by":"publisher","DOI":"10.1109\/MC.2017.121"},{"key":"e_1_3_2_1_183_1","doi-asserted-by":"publisher","DOI":"10.1109\/AsianHOST.2018.8607176"},{"issue":"6","key":"e_1_3_2_1_184_1","first-page":"799","article-title":"Hardware-efficient logic camouflaging for monolithic 3D ICs","volume":"65","author":"Yan C.","year":"2018","journal-title":"Trans. Circ. Sys."},{"key":"e_1_3_2_1_185_1","first-page":"10","article-title":"A modern approach to IP protection and trojan prevention: Split manufacturing for 3D ICs and obfuscation of vertical interconnects","volume":"2019","author":"Patnaik S.","journal-title":"Trans. Emerg. Top. Comp."},{"key":"e_1_3_2_1_186_1","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2014.6855563"},{"key":"e_1_3_2_1_187_1","doi-asserted-by":"publisher","DOI":"10.1145\/3061639.3062293"},{"key":"e_1_3_2_1_188_1","doi-asserted-by":"publisher","DOI":"10.1109\/TDSC.2017.2712156"},{"key":"e_1_3_2_1_189_1","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8715281"},{"key":"e_1_3_2_1_191_1","doi-asserted-by":"publisher","DOI":"10.1007\/s13389-017-0164-7"},{"key":"e_1_3_2_1_192_1","doi-asserted-by":"publisher","DOI":"10.1145\/3240765.3240784"},{"key":"e_1_3_2_1_193_1","doi-asserted-by":"publisher","DOI":"10.1145\/2902961.2903014"},{"key":"e_1_3_2_1_194_1","first-page":"116","volume-title":"Integration","volume":"58","author":"Mossa S. F.","year":"2017"},{"key":"e_1_3_2_1_195_1","volume-title":"Huang, S. \u201cxobs","author":"A.","year":"2019"},{"key":"e_1_3_2_1_196_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001391"},{"key":"e_1_3_2_1_197_1","doi-asserted-by":"publisher","DOI":"10.1109\/EDSSC.2015.7285113"},{"key":"e_1_3_2_1_198_1","doi-asserted-by":"publisher","DOI":"10.1145\/1168917.1168890"},{"key":"e_1_3_2_1_199_1","first-page":"10","article-title":"Exploiting PDN noise to thwart correlation power analysis attacks in 3D ICs","author":"Dofe J.","year":"2018","journal-title":"Proc. Int. Worksh. Sys.-Level Interconn. Pred."},{"key":"e_1_3_2_1_200_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2016.7753336"},{"key":"e_1_3_2_1_201_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2015.7357114"},{"key":"e_1_3_2_1_202_1","doi-asserted-by":"publisher","DOI":"10.1109\/FDTC.2019.00014"},{"key":"e_1_3_2_1_203_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-33027-8_1"},{"key":"e_1_3_2_1_204_1","volume-title":"Proc. Des. Autom. Test Europe, 2020","author":"Knechtel J.","year":"2001"}],"event":{"name":"ISPD '20: International Symposium on Physical Design","location":"Taipei Taiwan","acronym":"ISPD '20","sponsor":["SIGDA ACM Special Interest Group on Design Automation"]},"container-title":["Proceedings of the 2020 International Symposium on Physical Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3372780.3378175","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3372780.3378175","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T23:44:16Z","timestamp":1750203856000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3372780.3378175"}},"subtitle":["An Overview on Fundamentals, Applications, and Challenges"],"short-title":[],"issued":{"date-parts":[[2020,3,30]]},"references-count":202,"alternative-id":["10.1145\/3372780.3378175","10.1145\/3372780"],"URL":"https:\/\/doi.org\/10.1145\/3372780.3378175","relation":{},"subject":[],"published":{"date-parts":[[2020,3,30]]},"assertion":[{"value":"2020-03-30","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}