{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T15:25:28Z","timestamp":1780500328842,"version":"3.54.1"},"reference-count":53,"publisher":"Association for Computing Machinery (ACM)","issue":"3","license":[{"start":{"date-parts":[[2020,5,13]],"date-time":"2020-05-13T00:00:00Z","timestamp":1589328000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"IEEE International Test Conference 2018"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["ACM Trans. Des. Autom. Electron. Syst."],"published-print":{"date-parts":[[2020,5,31]]},"abstract":"<jats:p>An RRAM-based computing system (RCS) provides an energy-efficient hardware implementation of vector-matrix multiplication for machine-learning hardware. However, it is vulnerable to faults due to the immature RRAM fabrication process. We propose an efficient fault tolerance method for RCS; the proposed method, referred to as extended-ABFT (X-ABFT), is inspired by algorithm-based fault tolerance (ABFT). We utilize row checksums and test-input vectors to extract signatures for fault detection and error correction. We present a solution to alleviate the overflow problem caused by the limited number of voltage levels for the test-input signals. Simulation results show that for a Hopfield classifier with faults in 5% of its RRAM cells, X-ABFT allows us to achieve nearly the same classification accuracy as in the fault-free case.<\/jats:p>","DOI":"10.1145\/3386360","type":"journal-article","created":{"date-parts":[[2020,5,19]],"date-time":"2020-05-19T10:31:05Z","timestamp":1589884265000},"page":"1-31","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":15,"title":["Algorithmic Fault Detection for RRAM-based Matrix Operations"],"prefix":"10.1145","volume":"25","author":[{"given":"Mengyun","family":"Liu","sequence":"first","affiliation":[{"name":"Duke University, NC, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lixue","family":"Xia","sequence":"additional","affiliation":[{"name":"Alibaba Group, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yu","family":"Wang","sequence":"additional","affiliation":[{"name":"Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Krishnendu","family":"Chakrabarty","sequence":"additional","affiliation":[{"name":"Duke University, NC, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2020,5,13]]},"reference":[{"key":"e_1_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2010.2070830"},{"key":"e_1_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/12.9736"},{"key":"e_1_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2654298"},{"key":"e_1_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1557\/adv.2016.377"},{"key":"e_1_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/DSN.2014.48"},{"key":"e_1_2_1_6_1","volume-title":"Proceedings of the Design Automation Conference (DAC\u201918)","author":"Yi"},{"key":"e_1_2_1_7_1","volume-title":"Proceedings of the International Solid-State Circuits Conference Digest of Technical Papers (ISSCC\u201914)","author":"Meng-Fan"},{"key":"e_1_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2011.6131539"},{"key":"e_1_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.4816747"},{"key":"e_1_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2014.12"},{"key":"e_1_2_1_11_1","volume-title":"Proceedings of the Design, Automation 8 Test in Europe Conference (DATE\u201917)","author":"Lerong"},{"key":"e_1_2_1_12_1","volume-title":"Proceedings of the International Electron Devices Meeting. 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