{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,2]],"date-time":"2025-10-02T06:06:36Z","timestamp":1759385196449,"version":"3.41.0"},"reference-count":19,"publisher":"Association for Computing Machinery (ACM)","issue":"1","license":[{"start":{"date-parts":[[2020,2,29]],"date-time":"2020-02-29T00:00:00Z","timestamp":1582934400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["Queue"],"published-print":{"date-parts":[[2020,2,29]]},"abstract":"<jats:p>Smaller transistors can do more calculations without overheating, which makes them more power efficient. It also allows for smaller die sizes, which reduce costs and can increase density, allowing more cores per chip. The silicon wafers that chips are made of vary in purity, and none are perfect, which means every chip has a chance of having imperfections that differ in effect. Manufacturers can limit the effect of imperfections by using chiplets.<\/jats:p>","DOI":"10.1145\/3387945.3388515","type":"journal-article","created":{"date-parts":[[2020,3,13]],"date-time":"2020-03-13T18:03:43Z","timestamp":1584122623000},"page":"5-15","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":4,"title":["Chipping Away at Moore\u2019s Law"],"prefix":"10.1145","volume":"18","author":[{"given":"Jessie","family":"Frazelle","sequence":"first","affiliation":[{"name":"Oxide Computer Company"}]}],"member":"320","published-online":{"date-parts":[[2020,3,13]]},"reference":[{"key":"e_1_2_1_1_1","unstructured":"Advanced Interface Bus (AIB) die-to-die hardware open source; https:\/\/github.com\/chipsalliance\/aib-phy-hardware."},{"key":"e_1_2_1_2_1","volume-title":"DARPA project aims to make modular computers out of chiplets. Techcrunch","author":"Coldewey D.","year":"2017","unstructured":"Coldewey, D. 2017. DARPA project aims to make modular computers out of chiplets. Techcrunch; https:\/\/techcrunch.com\/2017\/08\/26\/darpa-project-aims-to-make-modular-computers-out-of-chiplets\/."},{"key":"e_1_2_1_3_1","unstructured":"Cuttress I. 2019. Intel's 10nm Cannon Lake and Core i3-8121U deep dive review. Anandtech; https:\/\/www.anandtech.com\/show\/13405\/intel-10nm-cannon-lake-and-core-i3-8121u-deep-dive-review."},{"key":"e_1_2_1_4_1","volume-title":"Mask makers' survey","author":"Beam Initiative","year":"2019","unstructured":"eBeam Initiative. 2019. Mask makers' survey; https:\/\/www.ebeam.org\/docs\/2019-mask-maker-survey_en.pdf."},{"key":"e_1_2_1_5_1","volume-title":"Survey: 2019 eBeam Initiative mask makers' survey results. Semiconductor Engineering","author":"Beam Initiative 0.","year":"2019","unstructured":"eBeam Initiative. 2020. Survey: 2019 eBeam Initiative mask makers' survey results. Semiconductor Engineering; https:\/\/semiengineering.com\/survey-2019-ebeam-initiative-mask-makers-survey-results\/."},{"key":"e_1_2_1_6_1","unstructured":"Frumusanu A. 2018. The iPhone XS and XS Max review: unveiling the silicon secrets. Anandtech; https:\/\/www.anandtech.com\/show\/13392\/the-iphone-xs-xs-max-review-unveiling-the-silicon-secrets\/2."},{"key":"e_1_2_1_7_1","unstructured":"Hruska J. 2019. Chiplets are both solution to and symptom of a larger problem. Extremetech; https:\/\/www.extremetech.com\/computing\/290450-chiplets-are-both-solution-and-symptom-to-a-larger-problem."},{"key":"e_1_2_1_8_1","unstructured":"Leibson S. 2019. Intel releases royalty-free high-performance AIB interconnect standard to spur industry's chiplet adoption and grow the ecosystem. Intel Programmable Logic; https:\/\/blogs.intel.com\/psg\/intel-releases-royalty-free-high-performance-aib-interconnect-standard-to-spur-industrys-chiplet-adoption-and-grow-the-ecosystem\/."},{"key":"e_1_2_1_9_1","volume-title":"Globalfoundries' change in strategy pays off. Forbes","author":"McGregor J.","year":"2019","unstructured":"McGregor, J. 2019. Globalfoundries' change in strategy pays off. Forbes; https:\/\/www.forbes.com\/sites\/tiriasresearch\/2019\/09\/17\/globalfoundries-change-in-strategy-pays-off\/#40990f3c1d37."},{"key":"e_1_2_1_10_1","volume-title":"Cramming more components onto integrated circuits. Electronics 38(8)","author":"Moore G.","year":"2018","unstructured":"Moore, G. 1965. Cramming more components onto integrated circuits. Electronics 38(8); https:\/\/newsroom.intel.com\/wp-content\/uploads\/sites\/11\/2018\/05\/moores-law-electronics.pdf"},{"key":"e_1_2_1_11_1","unstructured":"Open Compute Project. 2020. Open Domain-Specific Architecture subgroup; https:\/\/www.opencompute.org\/wiki\/Server\/ODSA."},{"key":"e_1_2_1_12_1","volume-title":"Huawei promises its 7nm Kirin 980 processor will destroy the Snapdragon 845. The Verge","author":"Savov V.","year":"2018","unstructured":"Savov, V. 2018. Huawei promises its 7nm Kirin 980 processor will destroy the Snapdragon 845. The Verge; https:\/\/www.theverge.com\/2018\/8\/31\/17803682\/huawei-kirin-980-processor-soc-qualcomm-snapdragon-845-ifa-2018."},{"key":"e_1_2_1_13_1","volume-title":"Intel unveils Foveros 3D chip stacking and new 10nm 'chiplets.' The Verge","author":"Savov V.","year":"2018","unstructured":"Savov, V. 2018. Intel unveils Foveros 3D chip stacking and new 10nm 'chiplets.' The Verge; https:\/\/www.theverge.com\/2018\/12\/12\/18137401\/intel-foveros-3d-chip-stacking-10nm-roadmap-future."},{"key":"e_1_2_1_14_1","volume-title":"IEDM 2017: AMD's grand vision for the future of HPC. WikiChip Fuse; https:\/\/fuse.wikichip.org\/news\/523\/iedm-2017-amds-grand-vision-for-the-future-of-hpc\/.","author":"Schor D.","year":"2017","unstructured":"Schor, D. 2017. IEDM 2017: AMD's grand vision for the future of HPC. WikiChip Fuse; https:\/\/fuse.wikichip.org\/news\/523\/iedm-2017-amds-grand-vision-for-the-future-of-hpc\/."},{"key":"e_1_2_1_15_1","unstructured":"Tallis B. Shilov A. 2018. Samsung starts mass production of chips using its 7nm EUV process tech. Anandtech; https:\/\/www.anandtech.com\/show\/13496\/samsung-starts-mass-production-of-chips-using-its-7nm-euv-process-tech."},{"key":"e_1_2_1_16_1","unstructured":"TSMC. 7nm technology; https:\/\/www.tsmc.com\/english\/dedicatedFoundry\/technology\/7nm.htm."},{"key":"e_1_2_1_17_1","volume-title":"UMC not to rejoin race to develop 7nm technology. Taipei Times","author":"Wang L.","year":"2018","unstructured":"Wang, L. 2018. UMC not to rejoin race to develop 7nm technology. Taipei Times; http:\/\/www.taipeitimes.com\/News\/biz\/archives\/2018\/09\/04\/2003699736."},{"key":"e_1_2_1_18_1","volume-title":"Intel TOCK BLOCK: 10nm Cannonlake delayed to","author":"Williams C.","year":"2017","unstructured":"Williams, C. 2015. Intel TOCK BLOCK: 10nm Cannonlake delayed to 2017, bonus 14nm Kaby Lake to '16. The Register; https:\/\/www.theregister.co.uk\/2015\/07\/16\/intel_10nm_14nm_plans\/."},{"key":"e_1_2_1_19_1","unstructured":"Yeric G. 2018. Three dimensions in 3DIC Part 1. Arm Research; https:\/\/community.arm.com\/developer\/research\/b\/articles\/posts\/three-dimensions-in-3dic-part-1."}],"container-title":["Queue"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3387945.3388515","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3387945.3388515","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T22:38:47Z","timestamp":1750199927000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3387945.3388515"}},"subtitle":["Modern CPUs are just chiplets connected together."],"short-title":[],"issued":{"date-parts":[[2020,2,29]]},"references-count":19,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2020,2,29]]}},"alternative-id":["10.1145\/3387945.3388515"],"URL":"https:\/\/doi.org\/10.1145\/3387945.3388515","relation":{},"ISSN":["1542-7730","1542-7749"],"issn-type":[{"type":"print","value":"1542-7730"},{"type":"electronic","value":"1542-7749"}],"subject":[],"published":{"date-parts":[[2020,2,29]]},"assertion":[{"value":"2020-03-13","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}