{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,27]],"date-time":"2025-06-27T14:26:10Z","timestamp":1751034370727,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":10,"publisher":"ACM","license":[{"start":{"date-parts":[[2021,1,18]],"date-time":"2021-01-18T00:00:00Z","timestamp":1610928000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2021,1,18]]},"DOI":"10.1145\/3394885.3431563","type":"proceedings-article","created":{"date-parts":[[2021,1,29]],"date-time":"2021-01-29T11:32:46Z","timestamp":1611919966000},"page":"665-670","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":2,"title":["Placement for Wafer-Scale Deep Learning Accelerator"],"prefix":"10.1145","author":[{"given":"Benzheng","family":"Li","sequence":"first","affiliation":[{"name":"Xidian University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qi","family":"Du","sequence":"additional","affiliation":[{"name":"Xidian University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dingcheng","family":"Liu","sequence":"additional","affiliation":[{"name":"Xidian University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jingchong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Xidian University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gengjie","family":"Chen","sequence":"additional","affiliation":[{"name":"Giga Design Automation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hailong","family":"You","sequence":"additional","affiliation":[{"name":"Xidian University"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2021,1,29]]},"reference":[{"volume-title":"Wafer-Scale Deep Learning. In IEEE Hot Chips Symposium. 1--31","year":"2019","key":"e_1_3_2_1_1_1"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/337292.337541"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/2541940.2541967"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/309847.309928"},{"volume-title":"ISPD 2020 Physical Mapping of Neural Networks on a Wafer-Scale Deep Learning Accelerator. In ACM International Symposium on Physical Design (ISPD). 145--149","year":"2020","author":"James Michael","key":"e_1_3_2_1_5_1"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"e_1_3_2_1_7_1","unstructured":"Azalia Mirhoseini Anna Goldie Mustafa Yazgan Joe Jiang Ebrahim Songhori Shen Wang Young-Joon Lee Eric Johnson Omkar Pathak Sungmin Bae etal 2020. Chip Placement with Deep Reinforcement Learning. arXiv:2004.10746 (2020).  Azalia Mirhoseini Anna Goldie Mustafa Yazgan Joe Jiang Ebrahim Songhori Shen Wang Young-Joon Lee Eric Johnson Omkar Pathak Sungmin Bae et al. 2020. Chip Placement with Deep Reinforcement Learning. arXiv:2004.10746 (2020)."},{"volume-title":"IEEE\/ACM International Conference on Computer-Aided Design (ICCAD). 48--55","year":"2005","author":"Pan Min","key":"e_1_3_2_1_8_1"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2017.2761740"},{"volume-title":"ACM\/IEEE Design Automation Conference (DAC). 101--107","author":"Martin","key":"e_1_3_2_1_10_1"}],"event":{"name":"ASPDAC '21: 26th Asia and South Pacific Design Automation Conference","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CAS","IEEE CEDA"],"location":"Tokyo Japan","acronym":"ASPDAC '21"},"container-title":["Proceedings of the 26th Asia and South Pacific Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3394885.3431563","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3394885.3431563","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T21:32:02Z","timestamp":1750195922000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3394885.3431563"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,1,18]]},"references-count":10,"alternative-id":["10.1145\/3394885.3431563","10.1145\/3394885"],"URL":"https:\/\/doi.org\/10.1145\/3394885.3431563","relation":{},"subject":[],"published":{"date-parts":[[2021,1,18]]},"assertion":[{"value":"2021-01-29","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}