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However, the ultra-dense 3D interconnects impose significant challenges during physical design on how to best utilize them. Besides, the unique low-temperature fabrication process of M3D requires dedicated design-for-test mechanisms to verify the reliability of the chip. In this article, we provide an in-depth analysis on these design and test challenges in M3D. We also provide a comprehensive survey of the state-of-the-art solutions presented in the literature. This article encompasses all key steps on M3D physical design, including partitioning, placement, clock routing, and thermal analysis and optimization. In addition, we provide an in-depth analysis of various fault mechanisms, including M3D manufacturing defects, delay faults, and MIV (monolithic inter-tier via) faults. Our design-for-test solutions include test pattern generation for pre\/post-bond testing, built-in-self-test, and test access architectures targeting M3D.<\/jats:p>","DOI":"10.1145\/3473462","type":"journal-article","created":{"date-parts":[[2021,11,16]],"date-time":"2021-11-16T21:56:59Z","timestamp":1637099819000},"page":"1-49","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":7,"title":["Design Automation and Test Solutions for Monolithic 3D ICs"],"prefix":"10.1145","volume":"18","author":[{"given":"Lingjun","family":"Zhu","sequence":"first","affiliation":[{"name":"Georgia Institute of Technology, Atlanta GA, USA"}]},{"given":"Arjun","family":"Chaudhuri","sequence":"additional","affiliation":[{"name":"Duke University, Durham NC, USA"}]},{"given":"Sanmitra","family":"Banerjee","sequence":"additional","affiliation":[{"name":"Duke University, Durham NC, USA"}]},{"given":"Gauthaman","family":"Murali","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology, Atlanta GA, USA"}]},{"given":"Pruek","family":"Vanna-Iampikul","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology, Atlanta GA, USA"}]},{"given":"Krishnendu","family":"Chakrabarty","sequence":"additional","affiliation":[{"name":"Duke University, Durham NC, USA"}]},{"given":"Sung Kyu","family":"Lim","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology, Atlanta GA, USA"}]}],"member":"320","published-online":{"date-parts":[[2021,11,16]]},"reference":[{"key":"e_1_2_1_1_1","unstructured":"OpenCores Community. 2021. 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