{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,27]],"date-time":"2026-02-27T03:47:54Z","timestamp":1772164074860,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":7,"publisher":"ACM","license":[{"start":{"date-parts":[[2022,6,6]],"date-time":"2022-06-06T00:00:00Z","timestamp":1654473600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/100000001","name":"NSF (National Science Foundation)","doi-asserted-by":"publisher","award":["2119236, 2122155, 2028929, 1931531, and 1763681"],"award-info":[{"award-number":["2119236, 2122155, 2028929, 1931531, and 1763681"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2022,6,6]]},"DOI":"10.1145\/3489048.3522647","type":"proceedings-article","created":{"date-parts":[[2022,6,2]],"date-time":"2022-06-02T10:30:55Z","timestamp":1654165855000},"page":"37-38","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["Data Convection"],"prefix":"10.1145","author":[{"given":"Soheil","family":"Khadirsharbiyani","sequence":"first","affiliation":[{"name":"Pennsylvania State University, University Park, PA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jagadish","family":"Kotra","sequence":"additional","affiliation":[{"name":"AMD Research, Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Karthik","family":"Rao","sequence":"additional","affiliation":[{"name":"Advanced Micro Devices Inc., Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mahmut Taylan","family":"Kandemir","sequence":"additional","affiliation":[{"name":"Pennsylvania State University, University Park, PA, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2022,6,6]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"HBM. 2015. High-Bandwidth Memory (HBM) reinventing memory technology. https:\/\/www.amd.com\/system\/files\/documents\/high-bandwidth-memory-hbm.pdf  HBM. 2015. High-Bandwidth Memory (HBM) reinventing memory technology. https:\/\/www.amd.com\/system\/files\/documents\/high-bandwidth-memory-hbm.pdf"},{"key":"e_1_3_2_1_2_1","unstructured":"HMC. 2018. Hybrid Memory Cube Consortium. https:\/\/www.micron.com\/-\/media\/client\/global\/documents\/products\/data-sheet\/hmc\/gen2\/hmc_gen2.pdf  HMC. 2018. Hybrid Memory Cube Consortium. https:\/\/www.micron.com\/-\/media\/client\/global\/documents\/products\/data-sheet\/hmc\/gen2\/hmc_gen2.pdf"},{"key":"e_1_3_2_1_3_1","unstructured":"JEDEC. 2014. JEDEC publishes Wide I\/O 2 mobile DRAM standard. https:\/\/www.jedec.org\/news\/pressreleases\/jedec-publishes-wide-io-2-mobile-dram-standard  JEDEC. 2014. JEDEC publishes Wide I\/O 2 mobile DRAM standard. https:\/\/www.jedec.org\/news\/pressreleases\/jedec-publishes-wide-io-2-mobile-dram-standard"},{"key":"e_1_3_2_1_4_1","volume-title":"In proceedings of The Sixteenth International Symposium on High-Performance Computer Architecture (HPCA). 1--12","author":"Jiang X.","unstructured":"X. Jiang , N. Madan , L. Zhao , M. Upton , R. Iyer , S. Makineni , D. Newell , Y. Solihin , and R. Balasubramonian . 2010. CHOP: adaptive filter-based DRAM caching for CMP server platforms . In In proceedings of The Sixteenth International Symposium on High-Performance Computer Architecture (HPCA). 1--12 . X. Jiang, N. Madan, L. Zhao, M. Upton, R. Iyer, S. Makineni, D. Newell, Y. Solihin, and R. Balasubramonian. 2010. CHOP: adaptive filter-based DRAM caching for CMP server platforms. In In proceedings of The Sixteenth International Symposium on High-Performance Computer Architecture (HPCA). 1--12."},{"key":"e_1_3_2_1_5_1","volume-title":"Through-silicon via (TSV). Proc","author":"Motoyoshi Makoto","year":"2009","unstructured":"Makoto Motoyoshi . 2009. Through-silicon via (TSV). Proc . IEEE ( 2009 ). Makoto Motoyoshi. 2009. Through-silicon via (TSV). Proc. IEEE (2009)."},{"key":"e_1_3_2_1_6_1","volume-title":"Keckler","author":"Rhu Minsoo","year":"2016","unstructured":"Minsoo Rhu , Natalia Gimelshein , Jason Clemons , Arslan Zulfiqar , and Stephen W . Keckler . 2016 . VDNN : Virtualized Deep Neural Networks for Scalable, Memory-Efficient Neural Network Design. In The 49th Annual IEEE\/ACM International Symposium on Microarchitecture (Taipei, Taiwan) (MICRO-49). IEEE Press , Article 18, 13 pages. Minsoo Rhu, Natalia Gimelshein, Jason Clemons, Arslan Zulfiqar, and Stephen W. Keckler. 2016. VDNN: Virtualized Deep Neural Networks for Scalable, Memory-Efficient Neural Network Design. In The 49th Annual IEEE\/ACM International Symposium on Microarchitecture (Taipei, Taiwan) (MICRO-49). IEEE Press, Article 18, 13 pages."},{"key":"e_1_3_2_1_7_1","volume-title":"IEEE International Symposium on High Performance Computer Architecture (HPCA).","author":"Vijayaraghavan T.","unstructured":"T. Vijayaraghavan , Y. Eckert , G. H. Loh , M. J. Schulte , M. Ignatowski , B. M. Beckmann , W. C. Brantley , J. L. Greathouse , W. Huang , A. Karunanithi , O. Kayiran , M. Meswani , I. Paul , M. Poremba , S. Raasch , S. K. Reinhardt , G. Sadowski , and V. Sridharan . 2017. Design and Analysis of an APU for Exascale Computing . In IEEE International Symposium on High Performance Computer Architecture (HPCA). T. Vijayaraghavan, Y. Eckert, G. H. Loh, M. J. Schulte, M. Ignatowski, B. M. Beckmann, W. C. Brantley, J. L. Greathouse, W. Huang, A. Karunanithi, O. Kayiran, M. Meswani, I. Paul, M. Poremba, S. Raasch, S. K. Reinhardt, G. Sadowski, and V. Sridharan. 2017. Design and Analysis of an APU for Exascale Computing. In IEEE International Symposium on High Performance Computer Architecture (HPCA)."}],"event":{"name":"SIGMETRICS\/PERFORMANCE '22: ACM SIGMETRICS\/IFIP PERFORMANCE Joint International Conference on Measurement and Modeling of Computer Systems","location":"Mumbai India","acronym":"SIGMETRICS\/PERFORMANCE '22","sponsor":["SIGMETRICS ACM Special Interest Group on Measurement and Evaluation"]},"container-title":["Abstract Proceedings of the 2022 ACM SIGMETRICS\/IFIP PERFORMANCE Joint International Conference on Measurement and Modeling of Computer Systems"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3489048.3522647","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/abs\/10.1145\/3489048.3522647","content-type":"text\/html","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3489048.3522647","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3489048.3522647","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T16:49:00Z","timestamp":1750178940000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3489048.3522647"}},"subtitle":["A GPU-Driven Case Study for Thermal-Aware Data Placement in 3D DRAMs"],"short-title":[],"issued":{"date-parts":[[2022,6,6]]},"references-count":7,"alternative-id":["10.1145\/3489048.3522647","10.1145\/3489048"],"URL":"https:\/\/doi.org\/10.1145\/3489048.3522647","relation":{"is-identical-to":[{"id-type":"doi","id":"10.1145\/3547353.3522647","asserted-by":"object"}]},"subject":[],"published":{"date-parts":[[2022,6,6]]},"assertion":[{"value":"2022-06-06","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}