{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T14:36:41Z","timestamp":1777646201126,"version":"3.51.4"},"publisher-location":"New York, NY, USA","reference-count":40,"publisher":"ACM","license":[{"start":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T00:00:00Z","timestamp":1651017600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,4,27]]},"DOI":"10.1145\/3491101.3519823","type":"proceedings-article","created":{"date-parts":[[2022,4,29]],"date-time":"2022-04-29T17:42:11Z","timestamp":1651254131000},"page":"1-10","source":"Crossref","is-referenced-by-count":33,"title":["A Tale of Two Mice: Sustainable Electronics Design and Prototyping"],"prefix":"10.1145","author":[{"given":"Vicente","family":"Arroyos","sequence":"first","affiliation":[{"name":"Paul G. Allen School of Computer Science and Engineering, University of Washington, United States"}]},{"given":"Maria L K","family":"Viitaniemi","sequence":"additional","affiliation":[{"name":"Microsoft Research, United States and University of Washington, United States"}]},{"given":"Nicholas","family":"Keehn","sequence":"additional","affiliation":[{"name":"Microsoft Research, United States"}]},{"given":"Vaidehi","family":"Oruganti","sequence":"additional","affiliation":[{"name":"Microsoft Research, United States"}]},{"given":"Winston","family":"Saunders","sequence":"additional","affiliation":[{"name":"Microsoft Research, United States"}]},{"given":"Karin","family":"Strauss","sequence":"additional","affiliation":[{"name":"Microsoft Research, United States and Paul G. Allen School of Computer Science and Engineering, University of Washington, USA"}]},{"given":"Vikram","family":"Iyer","sequence":"additional","affiliation":[{"name":"Paul G. Allen School of Computer Science and Engineering, University of Washington, United States"}]},{"given":"Bichlien H","family":"Nguyen","sequence":"additional","affiliation":[{"name":"Microsoft Research, United States and Paul G. Allen School of Computer Science and Engineering, University of Washington, United States"}]}],"member":"320","published-online":{"date-parts":[[2022,4,28]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"U.S. Environmental\u00a0Protection Agency. 2012. Tool for Reduction and Assessment of Chemicals and Other Environmental Impacts (TRACI). https:\/\/www.epa.gov\/chemical-research\/tool-reduction-and-assessment-chemicals-and-other-environmental-impacts-traci  U.S. Environmental\u00a0Protection Agency. 2012. Tool for Reduction and Assessment of Chemicals and Other Environmental Impacts (TRACI). https:\/\/www.epa.gov\/chemical-research\/tool-reduction-and-assessment-chemicals-and-other-environmental-impacts-traci"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/1240624.1240705"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10924-020-01854-0"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/3123939.3123980"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/3415232"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2996020"},{"key":"e_1_3_2_1_7_1","unstructured":"WillowFlex 3D\u00a0Print Filament. 2022. Compostable Filament for 3D printing. https:\/\/www.willow-flex.com\/compostable-filament\/  WillowFlex 3D\u00a0Print Filament. 2022. Compostable Filament for 3D printing. https:\/\/www.willow-flex.com\/compostable-filament\/"},{"key":"e_1_3_2_1_8_1","unstructured":"Fillamentum. 2022. Fillamentum NonOilen. https:\/\/www.fillamentumnonoilen.com\/  Fillamentum. 2022. Fillamentum NonOilen. https:\/\/www.fillamentumnonoilen.com\/"},{"key":"e_1_3_2_1_10_1","unstructured":"Ellen\u00a0MacArthur Foundation. 2019. Circular economy diagram. https:\/\/ellenmacarthurfoundation.org\/circular-economy-diagram  Ellen\u00a0MacArthur Foundation. 2019. Circular economy diagram. https:\/\/ellenmacarthurfoundation.org\/circular-economy-diagram"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1002\/pol.20210683"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/3161165"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2619983"},{"key":"e_1_3_2_1_14_1","volume-title":"Chasing Carbon: The Elusive Environmental Footprint of Computing. In 2021 IEEE International Symposium on High-Performance Computer Architecture (HPCA). IEEE, 854\u2013867","author":"Gupta Udit","year":"2021","unstructured":"Udit Gupta , Young\u00a0Geun Kim , Sylvia Lee , Jordan Tse , Hsien-Hsin\u00a0 S Lee , Gu-Yeon Wei , David Brooks , and Carole-Jean Wu . 2021 . Chasing Carbon: The Elusive Environmental Footprint of Computing. In 2021 IEEE International Symposium on High-Performance Computer Architecture (HPCA). IEEE, 854\u2013867 . Udit Gupta, Young\u00a0Geun Kim, Sylvia Lee, Jordan Tse, Hsien-Hsin\u00a0S Lee, Gu-Yeon Wei, David Brooks, and Carole-Jean Wu. 2021. Chasing Carbon: The Elusive Environmental Footprint of Computing. In 2021 IEEE International Symposium on High-Performance Computer Architecture (HPCA). IEEE, 854\u2013867."},{"key":"e_1_3_2_1_15_1","volume-title":"Design of Hybrid Wireless Power Transfer and Dual Ultrahigh-Frequency Antenna System. In 2019 URSI International Symposium on Electromagnetic Theory (EMTS). 1\u20134. https:\/\/doi.org\/10","author":"Haerinia Mohammad","year":"2019","unstructured":"Mohammad Haerinia and Sima Noghanian . 2019 . Design of Hybrid Wireless Power Transfer and Dual Ultrahigh-Frequency Antenna System. In 2019 URSI International Symposium on Electromagnetic Theory (EMTS). 1\u20134. https:\/\/doi.org\/10 .23919\/URSI-EMTS.2019.8931514 Mohammad Haerinia and Sima Noghanian. 2019. Design of Hybrid Wireless Power Transfer and Dual Ultrahigh-Frequency Antenna System. In 2019 URSI International Symposium on Electromagnetic Theory (EMTS). 1\u20134. https:\/\/doi.org\/10.23919\/URSI-EMTS.2019.8931514"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1557\/mrs.2020.22"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445069"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201403164"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1145\/3474349.3480191"},{"key":"e_1_3_2_1_20_1","unstructured":"Amin Javid. 2021. Carbon Footprint of the ICT equipment and Internet use at the University of Oulu Research report. https:\/\/www.oulu.fi\/sites\/default\/files\/108\/CF_ICT_Internet.pdf  Amin Javid. 2021. Carbon Footprint of the ICT equipment and Internet use at the University of Oulu Research report. https:\/\/www.oulu.fi\/sites\/default\/files\/108\/CF_ICT_Internet.pdf"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1145\/2493432.2493486"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1145\/2493432.2493474"},{"key":"e_1_3_2_1_23_1","doi-asserted-by":"publisher","DOI":"10.1145\/3357236.3395510"},{"key":"e_1_3_2_1_24_1","volume-title":"ACS","author":"Liao Kuotian","year":"2022","unstructured":"Kuotian Liao , Andrew\u00a0 M. Jimenez , Mallory Parker , Hareesh Iyer , Bichlien Nguyen , Karin Strauss , and Eleftheria Roumeli . 2022. Effects of algal biomass in the structure, mechanical and thermal properties of PLA . In ACS Spring 2022 . ACS. Kuotian Liao, Andrew\u00a0M. Jimenez, Mallory Parker, Hareesh Iyer, Bichlien Nguyen, Karin Strauss, and Eleftheria Roumeli. 2022. Effects of algal biomass in the structure, mechanical and thermal properties of PLA. In ACS Spring 2022. ACS."},{"key":"e_1_3_2_1_25_1","doi-asserted-by":"publisher","DOI":"10.1039\/C4EE01995D"},{"key":"e_1_3_2_1_26_1","doi-asserted-by":"publisher","DOI":"10.3390\/su10093027"},{"key":"e_1_3_2_1_27_1","unstructured":"Jiva Materials. 2020. The World\u2019s First Fully Recyclable PCB Substrate. https:\/\/www.jivamaterials.com\/  Jiva Materials. 2020. The World\u2019s First Fully Recyclable PCB Substrate. https:\/\/www.jivamaterials.com\/"},{"key":"e_1_3_2_1_28_1","unstructured":"Ryan Oakey. 2017. Paper PCB. https:\/\/ryanoakey.com\/paper-pcb  Ryan Oakey. 2017. Paper PCB. https:\/\/ryanoakey.com\/paper-pcb"},{"key":"e_1_3_2_1_29_1","volume-title":"Average lifespan (replacement cycle length) of smartphones in the United States from 2014 to","author":"O\u2019Dea S.","year":"2025","unstructured":"S. O\u2019Dea . 2021. Average lifespan (replacement cycle length) of smartphones in the United States from 2014 to 2025 . Technical Report. Daniel Research Group . 49 pages. https:\/\/www.statista.com\/statistics\/619788\/average-smartphone-life\/ S. O\u2019Dea. 2021. Average lifespan (replacement cycle length) of smartphones in the United States from 2014 to 2025. Technical Report. Daniel Research Group. 49 pages. https:\/\/www.statista.com\/statistics\/619788\/average-smartphone-life\/"},{"key":"e_1_3_2_1_30_1","doi-asserted-by":"publisher","DOI":"10.1177\/0734242X07082028"},{"key":"e_1_3_2_1_31_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymertesting.2020.106880"},{"key":"e_1_3_2_1_32_1","unstructured":"3D PrintLife. 2022. 3D Printlife Pro PLA 1KG Of Premium Impact Modified PLA 3D Printer Filament. https:\/\/www.3dprintlife.com\/pro-pla  3D PrintLife. 2022. 3D Printlife Pro PLA 1KG Of Premium Impact Modified PLA 3D Printer Filament. https:\/\/www.3dprintlife.com\/pro-pla"},{"key":"e_1_3_2_1_33_1","doi-asserted-by":"publisher","DOI":"10.1145\/2556288.2557391"},{"key":"e_1_3_2_1_34_1","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3173826"},{"key":"e_1_3_2_1_35_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.200901363"},{"key":"e_1_3_2_1_36_1","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445529"},{"key":"e_1_3_2_1_37_1","doi-asserted-by":"publisher","DOI":"10.1021\/es303012r"},{"key":"e_1_3_2_1_38_1","doi-asserted-by":"publisher","DOI":"10.1002\/adem.202100210"},{"key":"e_1_3_2_1_39_1","doi-asserted-by":"crossref","unstructured":"Eldy S.\u00a0Lazaro Vasquez and Katia Vega. 2019. From plastic to biomaterials: prototyping DIY electronics with mycelium. In Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers(UbiComp\/ISWC \u201919 Adjunct). Association for Computing Machinery London United Kingdom 308\u2013311. https:\/\/doi.org\/10.1145\/3341162.3343808  Eldy S.\u00a0Lazaro Vasquez and Katia Vega. 2019. From plastic to biomaterials: prototyping DIY electronics with mycelium. In Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers(UbiComp\/ISWC \u201919 Adjunct). Association for Computing Machinery London United Kingdom 308\u2013311. https:\/\/doi.org\/10.1145\/3341162.3343808","DOI":"10.1145\/3341162.3343808"},{"key":"e_1_3_2_1_40_1","doi-asserted-by":"publisher","DOI":"10.1145\/3341163.3346938"},{"key":"e_1_3_2_1_41_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201301847"}],"event":{"name":"CHI '22: CHI Conference on Human Factors in Computing Systems","location":"New Orleans LA USA","acronym":"CHI '22","sponsor":["SIGCHI ACM Special Interest Group on Computer-Human Interaction"]},"container-title":["CHI Conference on Human Factors in Computing Systems Extended Abstracts"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3491101.3519823","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3491101.3519823","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T19:31:01Z","timestamp":1750188661000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3491101.3519823"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,4,27]]},"references-count":40,"alternative-id":["10.1145\/3491101.3519823","10.1145\/3491101"],"URL":"https:\/\/doi.org\/10.1145\/3491101.3519823","relation":{},"subject":[],"published":{"date-parts":[[2022,4,27]]}}}