{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T04:17:15Z","timestamp":1750220235728,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":5,"publisher":"ACM","license":[{"start":{"date-parts":[[2021,10,22]],"date-time":"2021-10-22T00:00:00Z","timestamp":1634860800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2021,10,22]]},"DOI":"10.1145\/3501409.3501417","type":"proceedings-article","created":{"date-parts":[[2022,1,2]],"date-time":"2022-01-02T06:18:08Z","timestamp":1641104288000},"page":"39-43","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["The Relationship between Packaging Structures, Chip Area and Thermal Resistance of NMOS Semiconductor in Transient Dual Interface Method"],"prefix":"10.1145","author":[{"given":"Fan","family":"Chen","sequence":"first","affiliation":[{"name":"Shanghai Precision Metrology and Test Research Institute, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dapeng","family":"Liu","sequence":"additional","affiliation":[{"name":"Shanghai Precision Metrology and Test Research Institute, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Long","family":"Chen","sequence":"additional","affiliation":[{"name":"Shanghai Precision Metrology and Test Research Institute, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shuai","family":"Tao","sequence":"additional","affiliation":[{"name":"Shanghai Precision Metrology and Test Research Institute, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"You","sequence":"additional","affiliation":[{"name":"Shanghai Precision Metrology and Test Research Institute, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zebin","family":"Kong","sequence":"additional","affiliation":[{"name":"Shanghai Precision Metrology and Test Research Institute, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2021,12,31]]},"reference":[{"key":"e_1_3_2_1_1_1","volume-title":"Method 1012.1 Thermal Characteristics[S]. MIL-STD-883G","author":"United States Department of Defense Test Method Standard","year":"1980","unstructured":"United States Department of Defense Test Method Standard: Microcircuits, Method 1012.1 Thermal Characteristics[S]. MIL-STD-883G, 1980."},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2013.2271485"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2014.2300856"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/SEMI-THERM.2013.6526837"},{"key":"e_1_3_2_1_5_1","volume-title":"EIA\/JEDEC Standard, JESD51-14","author":"Interface Test Transient Dual","year":"2010","unstructured":"Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-Case of Semiconductor Devices with Heat Flow Through a Single Path[S]. Electronic Industries Association, EIA\/JEDEC Standard, JESD51-14; 2010."}],"event":{"name":"EITCE 2021: 2021 5th International Conference on Electronic Information Technology and Computer Engineering","acronym":"EITCE 2021","location":"Xiamen China"},"container-title":["Proceedings of the 2021 5th International Conference on Electronic Information Technology and Computer Engineering"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3501409.3501417","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3501409.3501417","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T19:30:20Z","timestamp":1750188620000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3501409.3501417"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,22]]},"references-count":5,"alternative-id":["10.1145\/3501409.3501417","10.1145\/3501409"],"URL":"https:\/\/doi.org\/10.1145\/3501409.3501417","relation":{},"subject":[],"published":{"date-parts":[[2021,10,22]]},"assertion":[{"value":"2021-12-31","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}