{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T04:46:37Z","timestamp":1750308397232,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":10,"publisher":"ACM","license":[{"start":{"date-parts":[[2022,4,13]],"date-time":"2022-04-13T00:00:00Z","timestamp":1649808000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2022,4,13]]},"DOI":"10.1145\/3505170.3506726","type":"proceedings-article","created":{"date-parts":[[2022,4,14]],"date-time":"2022-04-14T00:07:38Z","timestamp":1649894858000},"page":"117-125","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["LEO: Line End Optimizer for Sub-7nm Technology Nodes"],"prefix":"10.1145","author":[{"given":"Diwesh","family":"Pandey","sequence":"first","affiliation":[{"name":"IBM Systems, Bengaluru, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gustavo E.","family":"Tellez","sequence":"additional","affiliation":[{"name":"IBM T.J. Watson Research Center, Yorktown Heights, NY, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"James","family":"Leland","sequence":"additional","affiliation":[{"name":"IBM Systems, Poughkeepsie, NY, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2022,4,13]]},"reference":[{"key":"e_1_3_2_1_1_1","volume-title":"Simplify to survive: prescriptive layouts ensure profitable scaling to 32nm and beyond,\" in Design for Manufacturability through Design-Process Integration III","author":"Liebmann L.","year":"2009","unstructured":"L. Liebmann , L. Pileggi , J. Hibbeler , V. Rovner , T. Jhaveri , and G. Northrop , \" Simplify to survive: prescriptive layouts ensure profitable scaling to 32nm and beyond,\" in Design for Manufacturability through Design-Process Integration III , vol. 7275 , p. 72750A, International Society for Optics and Photonics , 2009 . L. Liebmann, L. Pileggi, J. Hibbeler, V. Rovner, T. Jhaveri, and G. Northrop, \"Simplify to survive: prescriptive layouts ensure profitable scaling to 32nm and beyond,\" in Design for Manufacturability through Design-Process Integration III, vol. 7275, p. 72750A, International Society for Optics and Photonics, 2009."},{"key":"e_1_3_2_1_2_1","first-page":"787","volume-title":"2011 16th Asia and South Pacific","author":"Zhang H.","year":"2011","unstructured":"H. Zhang , Y. Du , M. D. Wong , and K.-Y. Chao , \"Mask cost reduction with circuit performance consideration for self-aligned double patterning,\" in Design Automation Conference (ASP-DAC) , 2011 16th Asia and South Pacific , pp. 787 -- 792 , IEEE, 2011 . H. Zhang, Y. Du, M. D. Wong, and K.-Y. Chao, \"Mask cost reduction with circuit performance consideration for self-aligned double patterning,\" in Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific, pp. 787--792, IEEE, 2011."},{"key":"e_1_3_2_1_3_1","first-page":"71","volume-title":"Self-aligned double patterning decomposition for overlay minimization and hot spot detection,\" in Proceedings of the 48th Design Automation Conference","author":"Zhang H.","year":"2011","unstructured":"H. Zhang , Y. Du , M. D. Wong , and R. Topaloglu , \" Self-aligned double patterning decomposition for overlay minimization and hot spot detection,\" in Proceedings of the 48th Design Automation Conference , pp. 71 -- 76 , IEEE , 2011 . H. Zhang, Y. Du, M. D. Wong, and R. Topaloglu, \"Self-aligned double patterning decomposition for overlay minimization and hot spot detection,\" in Proceedings of the 48th Design Automation Conference, pp. 71--76, IEEE, 2011."},{"key":"e_1_3_2_1_4_1","volume-title":"ACM","author":"Ban Y.","year":"2011","unstructured":"Y. Ban , K. Lucas , and D. Pan , \" Flexible 2d layout decomposition framework for spacer-type double pattering lithography,\" in Proceedings of the 48th Design Automation Conference, pp. 789--794 , ACM , 2011 . Y. Ban, K. Lucas, and D. Pan, \"Flexible 2d layout decomposition framework for spacer-type double pattering lithography,\" in Proceedings of the 48th Design Automation Conference, pp. 789--794, ACM, 2011."},{"doi-asserted-by":"crossref","unstructured":"Z. Xiao Y. Du H. Zhang and M. D.Wong \"A polynomial time exact algorithm for self-aligned double patterning layout decomposition \" in Proceedings of the 2012 ACM international symposium on International Symposium on Physical Design pp. 17--24 ACM 2012.  Z. Xiao Y. Du H. Zhang and M. D.Wong \"A polynomial time exact algorithm for self-aligned double patterning layout decomposition \" in Proceedings of the 2012 ACM international symposium on International Symposium on Physical Design pp. 17--24 ACM 2012.","key":"e_1_3_2_1_5_1","DOI":"10.1145\/2160916.2160922"},{"key":"e_1_3_2_1_6_1","volume-title":"IEEE Press","author":"Zhang H.","year":"2010","unstructured":"H. Zhang , M. D. Wong , and K.-Y. Chao , \"On process-aware 1-d standard cell design,\" in Proceedings of the 2010 Asia and South Pacific Design Automation Conference, pp. 838--842 , IEEE Press , 2010 . H. Zhang, M. D. Wong, and K.-Y. Chao, \"On process-aware 1-d standard cell design,\" in Proceedings of the 2010 Asia and South Pacific Design Automation Conference, pp. 838--842, IEEE Press, 2010."},{"doi-asserted-by":"publisher","key":"e_1_3_2_1_7_1","DOI":"10.1109\/TCAD.2015.2399439"},{"doi-asserted-by":"crossref","unstructured":"S. Y. Fang \"Cut mask optimization with wire planning in self-aligned multiple patterning full-chip routing \" in The 20th Asia and South Pacific Design Automation Conference pp. 396--401 Jan 2015.  S. Y. Fang \"Cut mask optimization with wire planning in self-aligned multiple patterning full-chip routing \" in The 20th Asia and South Pacific Design Automation Conference pp. 396--401 Jan 2015.","key":"e_1_3_2_1_8_1","DOI":"10.1109\/ASPDAC.2015.7059037"},{"key":"e_1_3_2_1_9_1","first-page":"1473","volume-title":"Automation Test in Europe Conference Exhibition (DATE)","author":"Wei Y.","year":"2018","unstructured":"Y. Wei , R. Samanta , and Y. Li , \" Lesar: A dynamic line-end spacing aware detailed router,\" in 2018 Design , Automation Test in Europe Conference Exhibition (DATE) , pp. 1473 -- 1476 , March 2018 . Y. Wei, R. Samanta, and Y. Li, \"Lesar: A dynamic line-end spacing aware detailed router,\" in 2018 Design, Automation Test in Europe Conference Exhibition (DATE), pp. 1473--1476, March 2018."},{"key":"e_1_3_2_1_10_1","volume-title":"ACM","author":"Cremer P.","year":"2017","unstructured":"P. Cremer , S. Hougardy , J. Schneider , and J. Silvanus , \" Automatic cell layout in the 7nm era,\" in Proceedings of the 2017 ACM on International Symposium on Physical Design, pp. 99--106 , ACM , 2017 . P. Cremer, S. Hougardy, J. Schneider, and J. Silvanus, \"Automatic cell layout in the 7nm era,\" in Proceedings of the 2017 ACM on International Symposium on Physical Design, pp. 99--106, ACM, 2017."}],"event":{"sponsor":["SIGDA ACM Special Interest Group on Design Automation","SIGCHI ACM Special Interest Group on Computer-Human Interaction"],"acronym":"ISPD '22","name":"ISPD '22: International Symposium on Physical Design","location":"Virtual Event Canada"},"container-title":["Proceedings of the 2022 International Symposium on Physical Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3505170.3506726","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3505170.3506726","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T17:45:06Z","timestamp":1750268706000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3505170.3506726"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,4,13]]},"references-count":10,"alternative-id":["10.1145\/3505170.3506726","10.1145\/3505170"],"URL":"https:\/\/doi.org\/10.1145\/3505170.3506726","relation":{},"subject":[],"published":{"date-parts":[[2022,4,13]]},"assertion":[{"value":"2022-04-13","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}