{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T11:30:19Z","timestamp":1763724619581,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":24,"publisher":"ACM","license":[{"start":{"date-parts":[[2022,10,30]],"date-time":"2022-10-30T00:00:00Z","timestamp":1667088000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62141407, 61974032, 61674042, 61929102"],"award-info":[{"award-number":["62141407, 61974032, 61674042, 61929102"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Key R&D Program of China","award":["2020YFA0711900, 2020YFA0711904"],"award-info":[{"award-number":["2020YFA0711900, 2020YFA0711904"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2022,10,30]]},"DOI":"10.1145\/3508352.3549457","type":"proceedings-article","created":{"date-parts":[[2022,12,22]],"date-time":"2022-12-22T12:10:54Z","timestamp":1671711054000},"page":"1-9","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["A High-Precision Stochastic Solver for Steady-State Thermal Analysis with Fourier Heat Transfer Robin Boundary Conditions"],"prefix":"10.1145","author":[{"given":"Longlong","family":"Yang","sequence":"first","affiliation":[{"name":"Fudan University, China"}]},{"given":"Cuiyang","family":"Ding","sequence":"additional","affiliation":[{"name":"Fudan University, China"}]},{"given":"Changhao","family":"Yan","sequence":"additional","affiliation":[{"name":"Fudan University, China"}]},{"given":"Dian","family":"Zhou","sequence":"additional","affiliation":[{"name":"University of Texas at Dallas"}]},{"given":"Xuan","family":"Zeng","sequence":"additional","affiliation":[{"name":"Fudan University, China"}]}],"member":"320","published-online":{"date-parts":[[2022,12,22]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"Inc ANSYS et al. 2014. Ansys. https:\/\/www.ansys.com\/."},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2017.07.071"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1090\/S0025-5718-1950-0038138-X"},{"key":"e_1_3_2_1_4_1","volume-title":"2009 IEEE 8th International Conference on ASIC. IEEE, 771--774","author":"Guo Jun","year":"2009","unstructured":"Jun Guo, Sheqin Dong, and Satoshi Goto. 2009. Random walk algorithm for large thermal RC network analysis. In 2009 IEEE 8th International Conference on ASIC. IEEE, 771--774."},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/CADCG.2009.5246852"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/SISPAD.2000.871212"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.858276"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2014.6742996"},{"volume-title":"Wafer Level 3-D ICs Process Technology","author":"Lin Sheng-Chih","key":"e_1_3_2_1_10_1","unstructured":"Sheng-Chih Lin and Kaustav Banerjee. 2008. Thermal challenges of 3D ICs. In Wafer Level 3-D ICs Process Technology. Springer, 1--26."},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2002.1004232"},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1145\/1973009.1973051"},{"key":"e_1_3_2_1_13_1","volume-title":"International journal for numerical methods in engineering 40, 3","author":"JEAN-PAUL MORILLON.","year":"1997","unstructured":"JEAN-PAUL MORILLON. 1997. Numerical solutions of linear mixed boundary value problems using stochastic representations. International journal for numerical methods in engineering 40, 3 (1997), 387--405."},{"key":"e_1_3_2_1_14_1","volume-title":"The probabilistic solution of the third boundary value problem for second order elliptic equations. Probability Theory and related fields 87, 1","author":"Papanicolaou Vassilis G","year":"1990","unstructured":"Vassilis G Papanicolaou. 1990. The probabilistic solution of the third boundary value problem for second order elliptic equations. Probability Theory and related fields 87, 1 (1990), 27--77."},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.850863"},{"volume-title":"Monte Carlo methods: in boundary value problems","author":"Sabelfeld Karl K","key":"e_1_3_2_1_16_1","unstructured":"Karl K Sabelfeld. 1991. Monte Carlo methods: in boundary value problems. Springer."},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1137\/1106035"},{"key":"e_1_3_2_1_18_1","volume-title":"2008 9th International Conference on Solid-State and Integrated-Circuit Technology. IEEE, 456--459","author":"Su Rong","year":"2008","unstructured":"Rong Su, Shiwei Feng, Chunsheng Guo, Bin Zhang, Hao Meng, and Guangchen Zhang. 2008. Thermal analysis of ICs based on equivalent thermal resistance. In 2008 9th International Conference on Solid-State and Integrated-Circuit Technology. IEEE, 456--459."},{"key":"e_1_3_2_1_19_1","volume-title":"2009 15th International Workshop on Thermal Investigations of ICs and Systems. IEEE, 56--60","author":"Torregiani Cristina","year":"2009","unstructured":"Cristina Torregiani, B Vandevelde, H Oprins, Eric Beyne, and Ingrid De Wolf. 2009. Thermal analysis of hot spots in advanced 3D-stacked structures. In 2009 15th International Workshop on Thermal Investigations of ICs and Systems. IEEE, 56--60."},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.2307\/2002546"},{"key":"e_1_3_2_1_21_1","volume-title":"Xuan Zeng and Chanhao Yan","author":"Yijing Zhou Wei Cai Cuiyang Ding","year":"2019","unstructured":"Cuiyang Ding Yijing Zhou Wei Cai, Xuan Zeng and Chanhao Yan. 2019. A Path Integral Monte Carlo (PIMC) Method based on Feynman-Kac Formula for Electrical Impedance Tomography. arXiv preprint arXiv:1907.13147 (2019)."},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2006.243773"},{"key":"e_1_3_2_1_23_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10915-016-0184-y"},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.4310\/CMS.2017.v15.n1.a11"},{"key":"e_1_3_2_1_25_1","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2015.7383696"}],"event":{"name":"ICCAD '22: IEEE\/ACM International Conference on Computer-Aided Design","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE-EDS Electronic Devices Society","IEEE CAS","IEEE CEDA"],"location":"San Diego California","acronym":"ICCAD '22"},"container-title":["Proceedings of the 41st IEEE\/ACM International Conference on Computer-Aided Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3508352.3549457","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3508352.3549457","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T19:02:57Z","timestamp":1750186977000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3508352.3549457"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10,30]]},"references-count":24,"alternative-id":["10.1145\/3508352.3549457","10.1145\/3508352"],"URL":"https:\/\/doi.org\/10.1145\/3508352.3549457","relation":{},"subject":[],"published":{"date-parts":[[2022,10,30]]},"assertion":[{"value":"2022-12-22","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}