{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,23]],"date-time":"2025-12-23T12:32:38Z","timestamp":1766493158423},"publisher-location":"New York, NY, USA","reference-count":0,"publisher":"ACM","isbn-type":[{"value":"9781450393799","type":"print"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,7,18]]},"DOI":"10.1145\/3533767","type":"proceedings","created":{"date-parts":[[2022,7,15]],"date-time":"2022-07-15T14:28:50Z","timestamp":1657895330000},"source":"Crossref","is-referenced-by-count":2,"title":["Proceedings of the 31st ACM SIGSOFT International Symposium on Software Testing and Analysis"],"prefix":"10.1145","member":"320","published-online":{"date-parts":[[2022,7,18]]},"event":{"name":"ISSTA '22: 31st ACM SIGSOFT International Symposium on Software Testing and Analysis","location":"Virtual South Korea","acronym":"ISSTA '22","sponsor":["SIGSOFT ACM Special Interest Group on Software Engineering"]},"container-title":[],"original-title":[],"deposited":{"date-parts":[[2023,11,25]],"date-time":"2023-11-25T19:13:40Z","timestamp":1700939620000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/proceedings\/10.1145\/3533767"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,7,18]]},"ISBN":["9781450393799"],"references-count":0,"alternative-id":["10.1145\/3533767"],"URL":"https:\/\/doi.org\/10.1145\/3533767","relation":{},"subject":[],"published":{"date-parts":[[2022,7,18]]}}}