{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,7]],"date-time":"2026-01-07T18:47:19Z","timestamp":1767811639910,"version":"3.49.0"},"publisher-location":"New York, NY, USA","reference-count":28,"publisher":"ACM","license":[{"start":{"date-parts":[[2023,1,16]],"date-time":"2023-01-16T00:00:00Z","timestamp":1673827200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"Computing and Communication Foundations","award":["1527324"],"award-info":[{"award-number":["1527324"]}]},{"name":"Office Of Internatl Science &Engineering","award":["1854276"],"award-info":[{"award-number":["1854276"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2023,1,16]]},"DOI":"10.1145\/3566097.3568347","type":"proceedings-article","created":{"date-parts":[[2023,1,31]],"date-time":"2023-01-31T18:40:49Z","timestamp":1675190449000},"page":"98-103","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":4,"title":["Learning Based Spatial Power Characterization and Full-Chip Power Estimation for Commercial TPUs"],"prefix":"10.1145","author":[{"given":"Jincong","family":"Lu","sequence":"first","affiliation":[{"name":"University of California"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jinwei","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of California"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wentian","family":"Jin","sequence":"additional","affiliation":[{"name":"University of California"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sachin","family":"Sachdeva","sequence":"additional","affiliation":[{"name":"University of California"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheldon X.-D.","family":"Tan","sequence":"additional","affiliation":[{"name":"University of California"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2023,1,31]]},"reference":[{"key":"e_1_3_2_1_1_1","volume-title":"International Sematech Technology Transfer Document 03024377A-TR","year":"2003","unstructured":"\"Critical Reliability Challenges for The International Technology Roadmap for Semiconductors (ITRS),\" 2003. In International Sematech Technology Transfer Document 03024377A-TR, 2003."},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2012.17"},{"key":"e_1_3_2_1_3_1","first-page":"8","article-title":"A landscape of the new dark silicon design regime","volume":"33","author":"Taylor M.","year":"2013","unstructured":"M. Taylor, \"A landscape of the new dark silicon design regime,\" IEEE\/ACM International Symposium on Microarchitecture, vol. 33, pp. 8--19, October 2013.","journal-title":"IEEE\/ACM International Symposium on Microarchitecture"},{"key":"e_1_3_2_1_4_1","volume-title":"Intl. Symp. on Computer Architecture","author":"Skadron K.","year":"2006","unstructured":"K. Skadron, M. R. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, and D. Tarjan, \"Temperature-aware microarchitecture,\" in Proc. Intl. Symp. on Computer Architecture, 2006."},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/2187671.2187675"},{"key":"e_1_3_2_1_6_1","article-title":"Post-silicon heat-source identification and machine-learning-based thermal modeling using infrared thermal imaging","author":"Sadiqbatcha S.","year":"2020","unstructured":"S. Sadiqbatcha, J. Zhang, H. Zhao, H. Amrouch, J. Hankel, and S. X.-D. Tan, \"Post-silicon heat-source identification and machine-learning-based thermal modeling using infrared thermal imaging,\" IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, 2020.","journal-title":"IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems"},{"key":"e_1_3_2_1_7_1","first-page":"135","volume-title":"Int. Symp. on Low Power Electronics and Design (ISLPED)","author":"Joseph R.","year":"2001","unstructured":"R. Joseph and M. Martonosi, \"Run-time power estimation in high-performance microprocessors,\" in Proc. Int. Symp. on Low Power Electronics and Design (ISLPED), pp. 135--140, 2001."},{"key":"e_1_3_2_1_8_1","volume-title":"Runtime power monitoring in high-end processors: Methodology and empirical data,\" in Proceedings of MICRO","author":"Isci C.","year":"2003","unstructured":"C. Isci and M. Martonosi, \"Runtime power monitoring in high-end processors: Methodology and empirical data,\" in Proceedings of MICRO, 2003."},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1145\/1255456.1255462"},{"key":"e_1_3_2_1_10_1","first-page":"39","volume-title":"Power mapping and modeling of multi-core processors,\" in International Symposium on Low Power Electronics and Design (ISLPED)","author":"Dev K.","year":"2013","unstructured":"K. Dev, A. N. Nowroz, and S. Reda, \"Power mapping and modeling of multi-core processors,\" in International Symposium on Low Power Electronics and Design (ISLPED), pp. 39--44, Sept 2013."},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2009.2017204"},{"key":"e_1_3_2_1_12_1","first-page":"331","volume-title":"Int. Symp. on Low Power Electronics and Design (ISLPED)","author":"Cochran R.","year":"2010","unstructured":"R. Cochran, A. N. Nowroz, and S. Reda, \"Post-silicon power characterization using thermal infrared emissions,\" in Proc. Int. Symp. on Low Power Electronics and Design (ISLPED), (New York, NY, USA), pp. 331--336, ACM, 2010."},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2272542"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2211111"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2474382"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2774704"},{"key":"e_1_3_2_1_17_1","first-page":"1","article-title":"Full-chip power density and thermal map characterization for commercial microprocessors under heat sink cooling","author":"Zhang J.","year":"2021","unstructured":"J. Zhang, S. Sadiqbatcha, M. O'Dea, H. Amrouch, and S. X.-D. Tan, \"Full-chip power density and thermal map characterization for commercial microprocessors under heat sink cooling,\" IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, pp. 1--1, 2021.","journal-title":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2021.3086112"},{"key":"e_1_3_2_1_19_1","unstructured":"Intel \"Intel Performance Counter Monitor (PCM).\" https:\/\/software.intel.com\/en-us\/articles\/intel-performance-counter-monitor."},{"key":"e_1_3_2_1_20_1","first-page":"1085","volume-title":"Automation and Test in Europe Conference and Exhibition (DATE)","author":"Zhang J.","year":"2020","unstructured":"J. Zhang, S. Sadiqbatcha, W. Jin, and S. X. . Tan, \"Accurate power density map estimation for commercial multi-core microprocessors,\" in 2020 Design, Automation and Test in Europe Conference and Exhibition (DATE), pp. 1085--1090, 2020."},{"key":"e_1_3_2_1_21_1","first-page":"347","volume-title":"Lucid infrared thermography of thermally-constrained processors,\" in 2015 IEEE\/ACM International Symposium on Low Power Electronics and Design (ISLPED)","author":"Amrouch H.","year":"2015","unstructured":"H. Amrouch and J. Henkel, \"Lucid infrared thermography of thermally-constrained processors,\" in 2015 IEEE\/ACM International Symposium on Low Power Electronics and Design (ISLPED), pp. 347--352, July 2015."},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2774704"},{"key":"e_1_3_2_1_23_1","volume-title":"TensorFlow: Large-scale machine learning on heterogeneous systems","author":"Abadi M.","year":"2015","unstructured":"M. Abadi et al., \"TensorFlow: Large-scale machine learning on heterogeneous systems,\" 2015. Software available from tensorflow.org."},{"key":"e_1_3_2_1_24_1","first-page":"23","article-title":"Discrete cosine transform","author":"Ahmed N.","year":"1974","unstructured":"N. Ahmed, T. Natarajan, and K. R. Rao, \"Discrete cosine transform,\" IEEE Transactions on Computers, vol. C-23, pp. 90--93, Jan 1974.","journal-title":"IEEE Transactions on Computers"},{"key":"e_1_3_2_1_25_1","unstructured":"\"Edge TPU Compiler.\" Available from coral.ai\/docs\/edgetpu\/compiler."},{"key":"e_1_3_2_1_26_1","first-page":"2672","volume-title":"Generative adversarial nets,\" in Advances in Neural Information Processing Systems 27","author":"Goodfellow I.","year":"2014","unstructured":"I. Goodfellow, J. Pouget-Abadie, M. Mirza, B. Xu, D. Warde-Farley, S. Ozair, A. Courville, and Y. Bengio, \"Generative adversarial nets,\" in Advances in Neural Information Processing Systems 27 (Z. Ghahramani, M. Welling, C. Cortes, N. D. Lawrence, and K. Q. Weinberger, eds.), pp. 2672--2680, Curran Associates, Inc., 2014."},{"key":"e_1_3_2_1_27_1","volume-title":"Conditional Generative Adversarial Nets,\" arXiv e-prints","author":"Mirza M.","year":"2014","unstructured":"M. Mirza and S. Osindero, \"Conditional Generative Adversarial Nets,\" arXiv e-prints, p. arXiv:1411.1784, Nov. 2014."},{"key":"e_1_3_2_1_28_1","volume-title":"Wasserstein GAN,\" arXiv e-prints","author":"Arjovsky M.","year":"2017","unstructured":"M. Arjovsky, S. Chintala, and L. Bottou, \"Wasserstein GAN,\" arXiv e-prints, p. arXiv:1701.07875, Dec. 2017."}],"event":{"name":"ASPDAC '23: 28th Asia and South Pacific Design Automation Conference","location":"Tokyo Japan","acronym":"ASPDAC '23","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CEDA","IEICE","IEEE CAS","IPSJ"]},"container-title":["Proceedings of the 28th Asia and South Pacific Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3566097.3568347","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3566097.3568347","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3566097.3568347","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,1,7]],"date-time":"2026-01-07T17:36:15Z","timestamp":1767807375000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3566097.3568347"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,1,16]]},"references-count":28,"alternative-id":["10.1145\/3566097.3568347","10.1145\/3566097"],"URL":"https:\/\/doi.org\/10.1145\/3566097.3568347","relation":{},"subject":[],"published":{"date-parts":[[2023,1,16]]},"assertion":[{"value":"2023-01-31","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}