{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,22]],"date-time":"2025-08-22T07:40:06Z","timestamp":1755848406538,"version":"3.44.0"},"publisher-location":"New York, NY, USA","reference-count":8,"publisher":"ACM","license":[{"start":{"date-parts":[[2022,12,23]],"date-time":"2022-12-23T00:00:00Z","timestamp":1671753600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2022,12,23]]},"DOI":"10.1145\/3579654.3579669","type":"proceedings-article","created":{"date-parts":[[2023,3,14]],"date-time":"2023-03-14T16:09:40Z","timestamp":1678810180000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Life assessment method of electronic components based on reliability factor sharing model"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5184-6805","authenticated-orcid":false,"given":"Linlin","family":"Shi","sequence":"first","affiliation":[{"name":"Huangpu Institute of Materials, China and \rThe Fifth Electronics Research Institute of Ministry of Industry and Information Technology, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7595-4867","authenticated-orcid":false,"given":"Peiliang","family":"Yang","sequence":"additional","affiliation":[{"name":"The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0115-8152","authenticated-orcid":false,"given":"Bin","family":"Zhou","sequence":"additional","affiliation":[{"name":"The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9105-6274","authenticated-orcid":false,"given":"Si","family":"Chen","sequence":"additional","affiliation":[{"name":"The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4473-7541","authenticated-orcid":false,"given":"Zhenwei","family":"Zhou","sequence":"additional","affiliation":[{"name":"The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5496-0232","authenticated-orcid":false,"given":"Danni","family":"Hong","sequence":"additional","affiliation":[{"name":"The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2023,3,14]]},"reference":[{"key":"e_1_3_2_1_1_1","volume-title":"The effects of design and environmental factors on the reliability of electronic products","author":"Lawson W .","year":"2007","unstructured":"Lawson W . The effects of design and environmental factors on the reliability of electronic products. 2007."},{"issue":"1","key":"e_1_3_2_1_2_1","first-page":"1","article-title":"Failure mode and effects analysis of power quality issues and their influence in the reliability of electronic products[J]","volume":"99","author":"Mendez-Gonzalez R, I","year":"2016","unstructured":"LC Mendez-Gonzalez, Ambrosio-Lazaro R, I Rodriguez-Borbon, Failure mode and effects analysis of power quality issues and their influence in the reliability of electronic products[J]. Electrical Engineering, 2016, 99(1):1-13.","journal-title":"Electrical Engineering"},{"key":"e_1_3_2_1_3_1","first-page":"199","article-title":"Assessing the reliability of electronic products using customer knowledge discovery[J]","author":"Pan X","year":"2020","unstructured":"Pan X , Wang H , You W , Assessing the reliability of electronic products using customer knowledge discovery[J]. Reliability Engineering and System Safety, 2020, 199.","journal-title":"Reliability Engineering and System Safety"},{"key":"e_1_3_2_1_4_1","volume-title":"PHYSICS-OF-FAILURE APPROACH TO DESIGN AND RELIABILITY ASSESSMENT OF MICROELECTRONIC PACKAGES[C]\/\/ International symposium on microelectronic package and PCB technology","author":"Pecht M .","year":"2074","unstructured":"Pecht M . PHYSICS-OF-FAILURE APPROACH TO DESIGN AND RELIABILITY ASSESSMENT OF MICROELECTRONIC PACKAGES[C]\/\/ International symposium on microelectronic package and PCB technology. CALCE Electronic Packaging Research Center University of Maryland, College Park, Maryland 20742, U.S.A.;, 1994."},{"key":"e_1_3_2_1_5_1","volume-title":"Bernstein J B . Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation","author":"White M","year":"2008","unstructured":"White M , Bernstein J B . Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation. 2008."},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2013.2290282"},{"issue":"2","key":"e_1_3_2_1_7_1","first-page":"28","volume":"37","author":"Mcleish J G","year":"2010","unstructured":"Mcleish J G , Hillman C , Solutions D , Enhancing MIL-HDBK-217 Reliability Predictions with Physics of Failure Methods[J]. Advancing Microelectronics, 2010, 37(2):P.28-32.","journal-title":"Advancing Microelectronics"},{"key":"e_1_3_2_1_8_1","volume-title":"IEEE","author":"Bo S","year":"2017","unstructured":"Bo S , Fan X , Fan J , A PoF and statistics combined reliability prediction for LED arrays in lamps[C]\/\/ International Conference on Thermal. IEEE, 2017."}],"event":{"name":"ACAI 2022: 2022 5th International Conference on Algorithms, Computing and Artificial Intelligence","acronym":"ACAI 2022","location":"Sanya China"},"container-title":["Proceedings of the 2022 5th International Conference on Algorithms, Computing and Artificial Intelligence"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3579654.3579669","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3579654.3579669","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,22]],"date-time":"2025-08-22T06:59:00Z","timestamp":1755845940000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3579654.3579669"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,12,23]]},"references-count":8,"alternative-id":["10.1145\/3579654.3579669","10.1145\/3579654"],"URL":"https:\/\/doi.org\/10.1145\/3579654.3579669","relation":{},"subject":[],"published":{"date-parts":[[2022,12,23]]},"assertion":[{"value":"2023-03-14","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}