{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,3]],"date-time":"2025-09-03T09:54:54Z","timestamp":1756893294686,"version":"3.44.0"},"publisher-location":"New York, NY, USA","reference-count":66,"publisher":"ACM","license":[{"start":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T00:00:00Z","timestamp":1730160000000},"content-version":"vor","delay-in-days":366,"URL":"http:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["2047189"],"award-info":[{"award-number":["2047189"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100007234","name":"University of Chicago","doi-asserted-by":"publisher","award":["DMR-2011854"],"award-info":[{"award-number":["DMR-2011854"]}],"id":[{"id":"10.13039\/100007234","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2023,10,29]]},"DOI":"10.1145\/3586183.3606747","type":"proceedings-article","created":{"date-parts":[[2023,10,20]],"date-time":"2023-10-20T20:46:22Z","timestamp":1697834782000},"page":"1-14","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":6,"title":["ThermalRouter: Enabling Users to Design Thermally-Sound Devices"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4023-7577","authenticated-orcid":false,"given":"Alex","family":"Mazursky","sequence":"first","affiliation":[{"name":"University of Chicago, United States"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-3893-0145","authenticated-orcid":false,"given":"Borui","family":"Li","sequence":"additional","affiliation":[{"name":"University of Chicago, United States"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1079-097X","authenticated-orcid":false,"given":"Shan-Yuan","family":"Teng","sequence":"additional","affiliation":[{"name":"University of Chicago, United States"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-7677-2640","authenticated-orcid":false,"given":"Daria","family":"Shifrina","sequence":"additional","affiliation":[{"name":"University of Chicago, United States"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-4949-923X","authenticated-orcid":false,"given":"Joyce E","family":"Passananti","sequence":"additional","affiliation":[{"name":"University of Chicago, United States"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-4861-0832","authenticated-orcid":false,"given":"Svitlana","family":"Midianko","sequence":"additional","affiliation":[{"name":"University of Chicago, United States"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6527-7084","authenticated-orcid":false,"given":"Pedro","family":"Lopes","sequence":"additional","affiliation":[{"name":"University of Chicago, United States"}]}],"member":"320","published-online":{"date-parts":[[2023,10,29]]},"reference":[{"key":"e_1_3_2_2_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445466"},{"key":"e_1_3_2_2_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3173834"},{"key":"e_1_3_2_2_3_1","doi-asserted-by":"publisher","DOI":"10.1021\/cr60244a004"},{"key":"e_1_3_2_2_4_1","doi-asserted-by":"publisher","DOI":"10.1115\/1.3262173"},{"key":"e_1_3_2_2_5_1","unstructured":"Autodesk Fusion 360 API: https:\/\/autodeskfusion360.github.io\/. Accessed: 2021-09-08."},{"key":"e_1_3_2_2_6_1","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1616377114"},{"key":"e_1_3_2_2_7_1","doi-asserted-by":"publisher","unstructured":"Baudisch P. and Mueller S. 2017. Personal Fabrication. Foundations and Trends\u00ae in Human\u2013Computer Interaction. 10 3\u20134 (2017) 165\u2013293. DOI:https:\/\/doi.org\/10.1561\/1100000055.","DOI":"10.1561\/1100000055"},{"volume-title":"Thermal design and optimization","author":"Bejan A.","key":"e_1_3_2_2_8_1","unstructured":"Bejan, A. 1996. Thermal design and optimization. Wiley."},{"key":"e_1_3_2_2_9_1","doi-asserted-by":"publisher","DOI":"10.1080\/09500693.2015.1025246"},{"key":"e_1_3_2_2_10_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00779-007-0181-0"},{"key":"e_1_3_2_2_11_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2016.08.080"},{"key":"e_1_3_2_2_12_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.progpolymsci.2016.03.001"},{"key":"e_1_3_2_2_13_1","volume-title":"Forte: User-Driven Generative Design. Proceedings of the 2018 CHI Conference on Human Factors in Computing Systems (Montreal QC Canada","author":"Chen X.","year":"2018","unstructured":"Chen, X. \u201cAnthony\u201d 2018. Forte: User-Driven Generative Design. Proceedings of the 2018 CHI Conference on Human Factors in Computing Systems (Montreal QC Canada, Apr. 2018), 1\u201312."},{"key":"e_1_3_2_2_14_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0008-6223(01)00112-9"},{"key":"e_1_3_2_2_15_1","doi-asserted-by":"publisher","DOI":"10.1145\/3290605.3300893"},{"key":"e_1_3_2_2_16_1","doi-asserted-by":"publisher","DOI":"10.1002\/tea.10097"},{"key":"e_1_3_2_2_17_1","doi-asserted-by":"publisher","DOI":"10.1207\/s1532690xci2404_3"},{"key":"e_1_3_2_2_18_1","doi-asserted-by":"publisher","DOI":"10.1088\/0031-9120\/20\/4\/309"},{"key":"e_1_3_2_2_19_1","volume-title":"Multiphysics Topology Optimization of Heat Transfer and Fluid Flow Systems. Excerpt from the Proceedings of the COMSOL Conference 2009 Boston","author":"Dede E.M.","year":"2009","unstructured":"Dede, E.M. 2009. Multiphysics Topology Optimization of Heat Transfer and Fluid Flow Systems. Excerpt from the Proceedings of the COMSOL Conference 2009 Boston (2009), 7."},{"key":"e_1_3_2_2_20_1","unstructured":"Dragon SkinTM FX\u2011 ProTM Product Information: https:\/\/www.smooth-on.com\/products\/dragon-skin-fx-pro\/. Accessed: 2021-09-08."},{"key":"e_1_3_2_2_21_1","doi-asserted-by":"crossref","unstructured":"Edwards C. 2013. Not-so-humble Raspberry Pi gets big ideas. Engineering & Technology.","DOI":"10.1049\/et.2013.0301"},{"key":"e_1_3_2_2_22_1","unstructured":"Felber R.A. 2016. Design and Modeling of 3D-Printed Air-Cooled Heat Exchangers. (2016) 9."},{"volume-title":"Fab: the coming revolution on your desktop - from personal computers to personal fabrication","author":"Gershenfeld N.A.","key":"e_1_3_2_2_23_1","unstructured":"Gershenfeld, N.A. 2007. Fab: the coming revolution on your desktop - from personal computers to personal fabrication. Basic Books."},{"key":"e_1_3_2_2_24_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.compscitech.2013.08.022"},{"key":"e_1_3_2_2_25_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202000832"},{"key":"e_1_3_2_2_26_1","doi-asserted-by":"publisher","DOI":"10.1145\/3332165.3347951"},{"key":"e_1_3_2_2_27_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201909788"},{"key":"e_1_3_2_2_28_1","volume-title":"Soft Thermal Actuators with Embedded Liquid Metal Microdroplets for Improved Heat Management. 2020 3rd IEEE International Conference on Soft Robotics (RoboSoft)","author":"Huang X.","year":"2020","unstructured":"Huang, X. 2020. Soft Thermal Actuators with Embedded Liquid Metal Microdroplets for Improved Heat Management. 2020 3rd IEEE International Conference on Soft Robotics (RoboSoft) (New Haven, CT, USA, May 2020), 367\u2013372."},{"key":"e_1_3_2_2_29_1","volume-title":"Metamaterial Mechanisms. Proceedings of the 29th Annual Symposium on User Interface Software and Technology (Tokyo Japan","author":"Ion A.","year":"2016","unstructured":"Ion, A. 2016. Metamaterial Mechanisms. Proceedings of the 29th Annual Symposium on User Interface Software and Technology (Tokyo Japan, Oct. 2016), 529\u2013539."},{"key":"e_1_3_2_2_30_1","doi-asserted-by":"publisher","DOI":"10.1145\/2858036.2858138"},{"key":"e_1_3_2_2_31_1","volume-title":"USA","author":"Khounsary A.M.","year":"1998","unstructured":"Khounsary, A.M. 1998. Heat Transfer Education: Keeping it Relevant and Vibrant. Heat Transfer: Volume 3 \u2014 Application of Heat Transfer in Equipment, Systems, and Education (Anaheim, California, USA, Nov. 1998), 17\u201323."},{"key":"e_1_3_2_2_32_1","doi-asserted-by":"publisher","DOI":"10.1145\/3025453.3026016"},{"key":"e_1_3_2_2_33_1","doi-asserted-by":"publisher","DOI":"10.1145\/3242587.3242607"},{"key":"e_1_3_2_2_34_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.learninstruc.2004.06.011"},{"key":"e_1_3_2_2_35_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2018.05.106"},{"key":"e_1_3_2_2_36_1","doi-asserted-by":"publisher","DOI":"10.1002\/tea.3660310607"},{"key":"e_1_3_2_2_37_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2017.01.007"},{"key":"e_1_3_2_2_38_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.icheatmasstransfer.2016.04.016"},{"key":"e_1_3_2_2_39_1","doi-asserted-by":"publisher","DOI":"10.1002\/htj.21993"},{"key":"e_1_3_2_2_40_1","unstructured":"Lienhard J.H. and Lienhard J.H. 2019. A heat transfer textbook. Dover Publications Inc."},{"key":"e_1_3_2_2_41_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00158-016-1563-6"},{"key":"e_1_3_2_2_42_1","doi-asserted-by":"publisher","DOI":"10.1145\/2601097.2601168"},{"key":"e_1_3_2_2_43_1","doi-asserted-by":"publisher","DOI":"10.3389\/fpsyg.2020.01718"},{"key":"e_1_3_2_2_44_1","doi-asserted-by":"publisher","DOI":"10.1126\/scirobotics.aaz3918"},{"key":"e_1_3_2_2_45_1","doi-asserted-by":"crossref","unstructured":"Morgan R.V. 2017. Emissivity Measurements of Additively Manufactured Materials. Technical Report #LA-UR\u20137-20513 1341825.","DOI":"10.2172\/1341825"},{"key":"e_1_3_2_2_46_1","doi-asserted-by":"publisher","DOI":"10.1002\/pc.20276"},{"key":"e_1_3_2_2_47_1","unstructured":"nschloe\/stressberry: Stress tests for the Raspberry Pi: https:\/\/github.com\/nschloe\/stressberry. Accessed: 2021-09-08."},{"key":"e_1_3_2_2_48_1","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445631"},{"key":"e_1_3_2_2_49_1","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3174015"},{"key":"e_1_3_2_2_50_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.expthermflusci.2014.01.018"},{"key":"e_1_3_2_2_51_1","doi-asserted-by":"publisher","DOI":"10.1145\/2461912.2461957"},{"key":"e_1_3_2_2_52_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10443-017-9661-1"},{"key":"e_1_3_2_2_53_1","doi-asserted-by":"publisher","DOI":"10.1145\/2858036.2858485"},{"key":"e_1_3_2_2_54_1","volume-title":"Engineering Students\u2019 Conceptions Of Heat And Temperature Pre And Post Thermodynamics Course. 2006 Annual Conference & Exposition Proceedings","author":"Robbins D.","year":"2006","unstructured":"Robbins, D. and Ardebili, M. 2006. Engineering Students\u2019 Conceptions Of Heat And Temperature Pre And Post Thermodynamics Course. 2006 Annual Conference & Exposition Proceedings (Chicago, Illinois, Jun. 2006), 11.578.1-11.578.9."},{"key":"e_1_3_2_2_55_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41528-020-00098-1"},{"key":"e_1_3_2_2_56_1","doi-asserted-by":"publisher","DOI":"10.1002\/tea.3660180506"},{"key":"e_1_3_2_2_57_1","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2019.8757285"},{"key":"e_1_3_2_2_58_1","doi-asserted-by":"publisher","DOI":"10.1023\/A:1019113924178"},{"key":"e_1_3_2_2_59_1","unstructured":"Ultimaker PLA material: Highly versatile easy to print: https:\/\/ultimaker.com\/materials\/pla. Accessed: 2021-09-08."},{"key":"e_1_3_2_2_60_1","doi-asserted-by":"publisher","DOI":"10.1145\/2980179.2980250"},{"key":"e_1_3_2_2_61_1","doi-asserted-by":"publisher","DOI":"10.1145\/2601097.2601129"},{"key":"e_1_3_2_2_62_1","doi-asserted-by":"publisher","unstructured":"Wang X. and Jiang H. 2018. Design of origami fin for heat dissipation enhancement. Applied Thermal Engineering. 145 (Dec. 2018) 674\u2013684. DOI:https:\/\/doi.org\/10.1016\/j.applthermaleng.2018.09.079.","DOI":"10.1016\/j.applthermaleng.2018.09.079"},{"key":"e_1_3_2_2_63_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2006.01.033"},{"key":"e_1_3_2_2_64_1","doi-asserted-by":"publisher","DOI":"10.1145\/3379337.3415898"},{"key":"e_1_3_2_2_65_1","unstructured":"Game of Thrones - Drogon fire dragon lamp. https:\/\/www.thingiverse.com\/thing:3648004."},{"key":"e_1_3_2_2_66_1","unstructured":"Ice9 Nylon Thermally Conductive and Electrically Non-Conducting Filament. https:\/\/tcpoly.com\/purchase-ice9-materials\/. TCPoly."}],"event":{"name":"UIST '23: The 36th Annual ACM Symposium on User Interface Software and Technology","sponsor":["SIGGRAPH ACM Special Interest Group on Computer Graphics and Interactive Techniques","SIGCHI ACM Special Interest Group on Computer-Human Interaction"],"location":"San Francisco CA USA","acronym":"UIST '23"},"container-title":["Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3586183.3606747","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3586183.3606747","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3586183.3606747","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T23:52:59Z","timestamp":1755820379000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3586183.3606747"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,29]]},"references-count":66,"alternative-id":["10.1145\/3586183.3606747","10.1145\/3586183"],"URL":"https:\/\/doi.org\/10.1145\/3586183.3606747","relation":{},"subject":[],"published":{"date-parts":[[2023,10,29]]},"assertion":[{"value":"2023-10-29","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}