{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,22]],"date-time":"2025-08-22T19:40:03Z","timestamp":1755891603741,"version":"3.44.0"},"publisher-location":"New York, NY, USA","reference-count":0,"publisher":"ACM","isbn-type":[{"type":"print","value":"9798400703294"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,28]]},"DOI":"10.1145\/3613424","type":"proceedings","created":{"date-parts":[[2023,12,8]],"date-time":"2023-12-08T12:22:15Z","timestamp":1702038135000},"source":"Crossref","is-referenced-by-count":0,"title":["56th Annual IEEE\/ACM International Symposium on Microarchitecture"],"prefix":"10.1145","member":"320","published-online":{"date-parts":[[2023,12,8]]},"event":{"name":"MICRO '23: 56th Annual IEEE\/ACM International Symposium on Microarchitecture","sponsor":["SIGMICRO ACM Special Interest Group on Microarchitectural Research and Processing"],"location":"Toronto ON Canada","acronym":"MICRO '23"},"container-title":[],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3613424","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,22]],"date-time":"2025-08-22T19:18:36Z","timestamp":1755890316000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/proceedings\/10.1145\/3613424"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,28]]},"ISBN":["9798400703294"],"references-count":0,"alternative-id":["10.1145\/3613424"],"URL":"https:\/\/doi.org\/10.1145\/3613424","relation":{},"subject":[],"published":{"date-parts":[[2023,10,28]]}}}