{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,15]],"date-time":"2026-01-15T04:36:52Z","timestamp":1768451812067,"version":"3.49.0"},"publisher-location":"New York, NY, USA","reference-count":0,"publisher":"ACM","isbn-type":[{"value":"9798400704024","type":"print"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,2,11]]},"DOI":"10.1145\/3623509","type":"proceedings","created":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T18:17:01Z","timestamp":1706120221000},"source":"Crossref","is-referenced-by-count":1,"title":["Proceedings of the Eighteenth International Conference on Tangible, Embedded, and Embodied Interaction"],"prefix":"10.1145","member":"320","published-online":{"date-parts":[[2024,2,11]]},"event":{"name":"TEI '24: Eighteenth International Conference on Tangible, Embedded, and Embodied Interaction","location":"Cork Ireland","acronym":"TEI '24","sponsor":["SIGCHI ACM Special Interest Group on Computer-Human Interaction"]},"container-title":[],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3623509","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,1,14]],"date-time":"2026-01-14T17:35:32Z","timestamp":1768412132000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/proceedings\/10.1145\/3623509"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2,11]]},"ISBN":["9798400704024"],"references-count":0,"alternative-id":["10.1145\/3623509"],"URL":"https:\/\/doi.org\/10.1145\/3623509","relation":{},"subject":[],"published":{"date-parts":[[2024,2,11]]}}}