{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T05:05:07Z","timestamp":1750309507829,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":12,"publisher":"ACM","license":[{"start":{"date-parts":[[2024,6,23]],"date-time":"2024-06-23T00:00:00Z","timestamp":1719100800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2024,6,23]]},"DOI":"10.1145\/3649329.3656522","type":"proceedings-article","created":{"date-parts":[[2024,11,7]],"date-time":"2024-11-07T19:27:22Z","timestamp":1731007642000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["A Software-Hardware Co-design Solution for 3D Inner Structure Reconstruction"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2921-0242","authenticated-orcid":false,"given":"Xingchen","family":"Li","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, Beijing, China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7929-8054","authenticated-orcid":false,"given":"Zhe","family":"Zhou","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"},{"name":"School of Computer Science, Peking University, Beijing, China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-2787-9464","authenticated-orcid":false,"given":"Qilin","family":"Zheng","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, Beijing, China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7315-6589","authenticated-orcid":false,"given":"Guangyu","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, Beijing, China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3723-3444","authenticated-orcid":false,"given":"Qiankun","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, Beijing, China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9721-247X","authenticated-orcid":false,"given":"Chenhao","family":"Xue","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, Beijing, China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China"}]}],"member":"320","published-online":{"date-parts":[[2024,11,7]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"crossref","unstructured":"J. Ahn S. Hong et al. 2015. A scalable processing-in-memory accelerator for parallel graph processing. In ISCA.","DOI":"10.1145\/2749469.2750386"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"crossref","unstructured":"Margherita Capriotti Hyungsuk E Kim et al. 2017. Non-Destructive inspection of impact damage in composite aircraft panels by ultrasonic guided waves and statistical processing. Materials (2017).","DOI":"10.3390\/ma10060616"},{"key":"e_1_3_2_1_3_1","unstructured":"Hybrid Memory Cube Consortium et al. 2014. Hybrid memory cube specification 2.1. hybridmemorycube. org (2014)."},{"key":"e_1_3_2_1_4_1","unstructured":"Yasuko Eckert Nuwan Jayasena and Gabriel H Loh. 2014. Thermal feasibility of die-stacked processing in memory. (2014)."},{"key":"e_1_3_2_1_5_1","unstructured":"Yu-Hang He Ai-Xin Zhang et al. 2020. Deep learning based high-resolution incoherent x-ray imaging with a single-pixel detector. In ISA."},{"key":"e_1_3_2_1_6_1","volume-title":"SEG Technical Program Expanded Abstracts","author":"Weichang Li.","year":"2018","unstructured":"Weichang Li. 2018. Classifying geological structure elements from seismic images using deep learning. In SEG Technical Program Expanded Abstracts 2018."},{"key":"e_1_3_2_1_7_1","volume-title":"Toward a theory of optimization for over-parameterized systems of non-linear equations: the lessons of deep learning. arXiv preprint arXiv:2003.00307","author":"Liu Chaoyue","year":"2020","unstructured":"Chaoyue Liu, Libin Zhu, and Mikhail Belkin. 2020. Toward a theory of optimization for over-parameterized systems of non-linear equations: the lessons of deep learning. arXiv preprint arXiv:2003.00307 (2020)."},{"key":"e_1_3_2_1_8_1","volume-title":"NDC: Analyzing the impact of 3D-stacked memory+ logic devices on MapReduce workloads. In ISPASS.","author":"Pugsley Seth H","year":"2014","unstructured":"Seth H Pugsley, Jeffrey Jestes, et al. 2014. NDC: Analyzing the impact of 3D-stacked memory+ logic devices on MapReduce workloads. In ISPASS."},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"crossref","unstructured":"Yuki Takechi-Haraya Kumiko Sakai-Kato et al. 2016. Atomic force microscopic analysis of the effect of lipid composition on liposome membrane rigidity. Langmuir (2016).","DOI":"10.1021\/acs.langmuir.6b00741"},{"key":"e_1_3_2_1_10_1","unstructured":"Zhicong Yu Fr\u00e9d\u00e9ric Noo et al. 2012. Simulation tools for two-dimensional experiments in x-ray computed tomography using the FORBILD head phantom. Physics in Medicine & Biology (2012)."},{"key":"e_1_3_2_1_11_1","unstructured":"Wentai Zhang Linjun Qiao et al. 2020. FPGA Acceleration for 3D Low-Dose Tomographic Reconstruction. TCAD (2020)."},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"crossref","unstructured":"Yining Zhu Qian Wang et al. 2019. Image reconstruction by Mumford-Shah regularization for low-dose CT with multi-GPU acceleration. (2019).","DOI":"10.1088\/1361-6560\/ab2c85"}],"event":{"name":"DAC '24: 61st ACM\/IEEE Design Automation Conference","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA","SIGBED ACM Special Interest Group on Embedded Systems"],"location":"San Francisco CA USA","acronym":"DAC '24"},"container-title":["Proceedings of the 61st ACM\/IEEE Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3649329.3656522","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3649329.3656522","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:17:55Z","timestamp":1750295875000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3649329.3656522"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,23]]},"references-count":12,"alternative-id":["10.1145\/3649329.3656522","10.1145\/3649329"],"URL":"https:\/\/doi.org\/10.1145\/3649329.3656522","relation":{},"subject":[],"published":{"date-parts":[[2024,6,23]]},"assertion":[{"value":"2024-11-07","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}