{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,27]],"date-time":"2026-02-27T16:00:30Z","timestamp":1772208030102,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":18,"publisher":"ACM","license":[{"start":{"date-parts":[[2024,6,23]],"date-time":"2024-06-23T00:00:00Z","timestamp":1719100800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62374039 and 62235009"],"award-info":[{"award-number":["62374039 and 62235009"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Shanghai Committee of Science and Technology","award":["No.21TS1401400"],"award-info":[{"award-number":["No.21TS1401400"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2024,6,23]]},"DOI":"10.1145\/3649329.3657313","type":"proceedings-article","created":{"date-parts":[[2024,11,7]],"date-time":"2024-11-07T19:27:22Z","timestamp":1731007642000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["CEDAR: Computing-in-pixel Edge-aware Detection and Reconstruction Architecture for High-resolution 3D Imaging"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0007-1332-6113","authenticated-orcid":false,"given":"Bu","family":"Chen","sequence":"first","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2551-7044","authenticated-orcid":false,"given":"Zhangcheng","family":"Huang","sequence":"additional","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9340-6709","authenticated-orcid":false,"given":"Qi","family":"Zheng","sequence":"additional","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-0765-2281","authenticated-orcid":false,"given":"Weiyi","family":"Tang","sequence":"additional","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-2326-3350","authenticated-orcid":false,"given":"Jingyi","family":"Wang","sequence":"additional","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-7489-5095","authenticated-orcid":false,"given":"Hankun","family":"Lv","sequence":"additional","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5980-4236","authenticated-orcid":false,"given":"Chixiao","family":"Chen","sequence":"additional","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0388-6148","authenticated-orcid":false,"given":"Jianlu","family":"Wang","sequence":"additional","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7062-831X","authenticated-orcid":false,"given":"Qi","family":"Liu","sequence":"additional","affiliation":[{"name":"Fudan University, Shanghai, Shanghai, China"}]}],"member":"320","published-online":{"date-parts":[[2024,11,7]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/MSP.2020.2973615"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2015.2453092"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720605"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1364\/OPTICA.386574"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2883720"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366010"},{"key":"e_1_3_2_1_7_1","first-page":"53","volume-title":"Proc. Int. Image Sensor Workshop","author":"Stoppa","year":"2021","unstructured":"Stoppa et al. A reconfigurable qvga\/q3vga direct time-of-flight 3d imaging system with on-chip depth-map computation in 45\/40 nm 3d-stacked bsi spad cmos. In Proc. Int. Image Sensor Workshop, pages 53--56, 2021."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2017.8008513"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1364\/OPTICA.391726"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/TRPMS.2017.2712260"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/34.790425"},{"key":"e_1_3_2_1_12_1","volume-title":"Hdr image reconstruction from a single exposure using deep cnns. ACM Trans. Graph., 36(6), nov","author":"Eilertsen","year":"2017","unstructured":"Eilertsen et al. Hdr image reconstruction from a single exposure using deep cnns. ACM Trans. Graph., 36(6), nov 2017."},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1145\/1015706.1015766"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-24574-4_28"},{"key":"e_1_3_2_1_15_1","volume-title":"Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition (CVPR)","author":"Zhirong","year":"2015","unstructured":"Zhirong et al. Wu. 3d shapenets: A deep representation for volumetric shapes. In Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition (CVPR), June 2015."},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2015.7298655"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662355"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365961"}],"event":{"name":"DAC '24: 61st ACM\/IEEE Design Automation Conference","location":"San Francisco CA USA","acronym":"DAC '24","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA","SIGBED ACM Special Interest Group on Embedded Systems"]},"container-title":["Proceedings of the 61st ACM\/IEEE Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3649329.3657313","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3649329.3657313","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:17:56Z","timestamp":1750295876000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3649329.3657313"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,23]]},"references-count":18,"alternative-id":["10.1145\/3649329.3657313","10.1145\/3649329"],"URL":"https:\/\/doi.org\/10.1145\/3649329.3657313","relation":{},"subject":[],"published":{"date-parts":[[2024,6,23]]},"assertion":[{"value":"2024-11-07","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}