{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,9]],"date-time":"2026-07-09T23:42:33Z","timestamp":1783640553560,"version":"3.55.0"},"publisher-location":"New York, NY, USA","reference-count":30,"publisher":"ACM","license":[{"start":{"date-parts":[[2024,6,23]],"date-time":"2024-06-23T00:00:00Z","timestamp":1719100800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"Semiconductor Research Corporation CoCoSys, one of the seven centers in JUMP 2.0"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2024,6,23]]},"DOI":"10.1145\/3649329.3658482","type":"proceedings-article","created":{"date-parts":[[2024,11,7]],"date-time":"2024-11-07T19:27:22Z","timestamp":1731007642000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":17,"title":["3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Integrated Circuits"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0005-7149-7696","authenticated-orcid":false,"given":"Yujie","family":"Zhao","sequence":"first","affiliation":[{"name":"Georgia Institute of Technology, Atlanta, GA, United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8023-1551","authenticated-orcid":false,"given":"Yang (Katie)","family":"Zhao","sequence":"additional","affiliation":[{"name":"University of Minnesota, Twin Cities, Minneapolis, MN, United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2295-3481","authenticated-orcid":false,"given":"Cheng","family":"Wan","sequence":"additional","affiliation":[{"name":"Georgia Tech, Atlanta, GA, United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5946-203X","authenticated-orcid":false,"given":"Yingyan (Celine)","family":"Lin","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology, Atlanta, GA, United States"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2024,11,7]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"2023. EVG. https:\/\/www.evgroup.com\/products\/bonding\/."},{"key":"e_1_3_2_1_2_1","unstructured":"2023. GPU: Power vs Performance. http:\/\/uu.diva-portal.org\/smash\/get\/diva2:767619\/FULLTEXT01.pdf"},{"key":"e_1_3_2_1_3_1","unstructured":"2024. Intel\u00ae Stratix\u00ae 10 FPGAs Overview - High Performance Intel\u00aeFPGA."},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"crossref","unstructured":"Akgun et al. 2019. Network-on-chip design guidelines for monolithic 3-D integration. IEEE Micro (2019).","DOI":"10.1109\/MM.2019.2937726"},{"key":"e_1_3_2_1_5_1","unstructured":"AMD. 2023. AMD Navi 31."},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"crossref","unstructured":"Arunkumar et al. 2017. MCM-GPU: Multi-chip-module GPUs for continued performance scalability. In ISCA.","DOI":"10.1145\/3079856.3080231"},{"key":"e_1_3_2_1_7_1","unstructured":"Bardon et al. 2020. DTCO including sustainability: Power-performance-area-cost-environmental score (PPACE) analysis for logic technologies. In IEDM. IEEE."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"crossref","unstructured":"Cristian Constantinescu. 2021. AMD EPYC\u2122 7002 Series - A Processor with Improved Soft Error Resilience. In DSN-S.","DOI":"10.1109\/DSN-S52858.2021.00026"},{"key":"e_1_3_2_1_9_1","unstructured":"Dell. 2021. LCA of Dell Servers."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"crossref","unstructured":"Eeckhout et al. 2022. A First-Order Model to Assess Computer Architecture Sustainability. IEEE Computer Architecture Letters (2022).","DOI":"10.1109\/LCA.2022.3217366"},{"key":"e_1_3_2_1_11_1","unstructured":"Elgamal et al. 2023. Design Space Exploration and Optimization for Carbon-Efficient Extended Reality Systems. arXiv preprint arXiv:2305.01831 (2023)."},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"crossref","unstructured":"Feng et al. 2022. Chiplet actuary: a quantitative cost model and multichiplet architecture exploration. In DAC.","DOI":"10.1145\/3489517.3530428"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"crossref","unstructured":"Freitag et al. 2021. The real climate and transformative impact of ICT: A critique of estimates trends and regulations. Patterns (2021).","DOI":"10.1016\/j.patter.2021.100340"},{"key":"e_1_3_2_1_14_1","unstructured":"GaBi. 2022. GaBi database."},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"crossref","unstructured":"Gomes et al. 2020. 8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12\u00d712mm2 1mm Package-on-Package. In ISSCC.","DOI":"10.1109\/ISSCC19947.2020.9062957"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"crossref","unstructured":"Guler et al. 2020. McPAT-Monolithic: An area\/power\/timing architecture modeling framework for 3-D hybrid monolithic multicore systems. VLSI (2020).","DOI":"10.1109\/TVLSI.2020.3002723"},{"key":"e_1_3_2_1_17_1","volume-title":"ACT: Designing sustainable computer systems with an architectural carbon modeling tool. In ISCA.","author":"Gupta","year":"2022","unstructured":"Gupta et al. 2022. ACT: Designing sustainable computer systems with an architectural carbon modeling tool. In ISCA."},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"crossref","unstructured":"Huang et al. 2010. Interaction of scaling trends in processor architecture and cooling. 198 -- 204.","DOI":"10.1109\/STHERM.2010.5444290"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"crossref","unstructured":"Kim et al. 2021. Micro-bumping hybrid bonding or monolithic? A PPA study for heterogeneous 3D IC options. In DAC. IEEE.","DOI":"10.1109\/DAC18074.2021.9586229"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.suscom.2017.10.001"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"crossref","unstructured":"Mahajan et al. 2016. Embedded Multi-die Interconnect Bridge (EMIB) - A High Density High Bandwidth Packaging Interconnect. In ECTC.","DOI":"10.1109\/ECTC.2016.201"},{"key":"e_1_3_2_1_22_1","volume-title":"IEEE Hot Chip Conference. 22--24","author":"Mahajan","year":"2021","unstructured":"Mahajan et al. 2021. Advanced packaging technologies for heterogeneous integration. In IEEE Hot Chip Conference. 22--24."},{"key":"e_1_3_2_1_23_1","doi-asserted-by":"crossref","unstructured":"Naffziger et al. 2021. Pioneering Chiplet Technology and Design for the AMD EPYC\u2122 and Ryzen\u2122 Processor Families : Industrial Product. In ISCA.","DOI":"10.1109\/ISCA52012.2021.00014"},{"key":"e_1_3_2_1_24_1","volume-title":"Sustainable Computing: Informatics and Systems","author":"Nagapurkar","year":"2022","unstructured":"Nagapurkar et al. 2022. Economic and embodied energy analysis of integrated circuit manufacturing processes. Sustainable Computing: Informatics and Systems (2022)."},{"key":"e_1_3_2_1_25_1","unstructured":"Nvidia. 2022. Nvidia architecture."},{"key":"e_1_3_2_1_26_1","unstructured":"NVIDIA. 2023. NVIDIA Tesla P100."},{"key":"e_1_3_2_1_27_1","doi-asserted-by":"crossref","unstructured":"Stow et al. 2016. Cost and thermal analysis of high-performance 2.5D and 3D integrated circuit design space. In ISVLSI. IEEE.","DOI":"10.1109\/ISVLSI.2016.133"},{"key":"e_1_3_2_1_28_1","volume-title":"Wheels: Emissions From Computing Onboard Autonomous Vehicles","author":"Sudhakar","year":"2023","unstructured":"Sudhakar et al. 2023. Data Centers on Wheels: Emissions From Computing Onboard Autonomous Vehicles. IEEE Micro (2023)."},{"key":"e_1_3_2_1_29_1","unstructured":"TSMC. 2023. CoWoS."},{"key":"e_1_3_2_1_30_1","doi-asserted-by":"crossref","unstructured":"Wuu et al. 2022. 3D V-Cache: the Implementation of a Hybrid-Bonded 64MB Stacked Cache for a 7nm x86-64 CPU. In ISSCC.","DOI":"10.1109\/ISSCC42614.2022.9731565"}],"event":{"name":"DAC '24: 61st ACM\/IEEE Design Automation Conference","location":"San Francisco CA USA","acronym":"DAC '24","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE-CEDA","SIGBED ACM Special Interest Group on Embedded Systems"]},"container-title":["Proceedings of the 61st ACM\/IEEE Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3649329.3658482","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3649329.3658482","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:18:01Z","timestamp":1750295881000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3649329.3658482"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,23]]},"references-count":30,"alternative-id":["10.1145\/3649329.3658482","10.1145\/3649329"],"URL":"https:\/\/doi.org\/10.1145\/3649329.3658482","relation":{},"subject":[],"published":{"date-parts":[[2024,6,23]]},"assertion":[{"value":"2024-11-07","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}