{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:17:39Z","timestamp":1781885859218,"version":"3.54.5"},"publisher-location":"New York, NY, USA","reference-count":19,"publisher":"ACM","license":[{"start":{"date-parts":[[2024,6,12]],"date-time":"2024-06-12T00:00:00Z","timestamp":1718150400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2024,6,12]]},"DOI":"10.1145\/3649476.3658727","type":"proceedings-article","created":{"date-parts":[[2024,6,10]],"date-time":"2024-06-10T12:29:41Z","timestamp":1718022581000},"page":"390-396","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["A Hybrid ECO Detailed Placement Flow for Improved Reduction of Dynamic IR Drop"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4490-5018","authenticated-orcid":false,"given":"Andrew B.","family":"Kahng","sequence":"first","affiliation":[{"name":"University of California, San Diego, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-6014-1048","authenticated-orcid":false,"given":"Bodhisatta","family":"Pramanik","sequence":"additional","affiliation":[{"name":"University of California, San Diego, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6772-3930","authenticated-orcid":false,"given":"Mingyu","family":"Woo","sequence":"additional","affiliation":[{"name":"ECE, University of California, San Diego, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2024,6,12]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2017.55"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.923063"},{"issue":"11","key":"e_1_3_2_1_3_1","first-page":"1649","article-title":"Voltage-drop Aware Analytical Placement by Global Power Spreading for Mixed-size Circuit Designs","volume":"30","author":"Chuang Y.","year":"2011","unstructured":"[3] Y. Chuang, P. Lee and Y. Chang, \u201cVoltage-drop Aware Analytical Placement by Global Power Spreading for Mixed-size Circuit Designs\u201d, IEEE TCAD 30(11) (2011), pp. 1649\u2013-1662.","journal-title":"IEEE TCAD"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/3240765.3240823"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8715096"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD45719.2019.8942110"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415614"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2005.101"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1145\/1055137.1055187"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1145\/2160916.2160936"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045574"},{"key":"e_1_3_2_1_12_1","unstructured":"[12] Cadence Innovus Rapid Adoption Kit. http:\/\/www.cadence.com"},{"key":"e_1_3_2_1_13_1","unstructured":"[13] Cadence Voltus IC Power Integrity Solution User Guide. http:\/\/www.cadence.com"},{"key":"e_1_3_2_1_14_1","unstructured":"[14] ILP-ECO DP Sources and Full Tables with Ten Designs (aes1-2 des1-2 jpeg1-2 mpeg1-2 and vga1-2). https:\/\/github.com\/ABKGroup\/Dynamic-IR-Drop-ECO-DP"},{"key":"e_1_3_2_1_15_1","unstructured":"[15] OpenCores: Open-Source IP Cores. https:\/\/opencores.org"},{"key":"e_1_3_2_1_16_1","volume-title":"September","year":"2023","unstructured":"[16] Qualcomm, personal communication, September 2023."},{"key":"e_1_3_2_1_17_1","unstructured":"[17] Synopsys Design Compiler version R-2020.09. https:\/\/www.synopsys.com\/"},{"key":"e_1_3_2_1_18_1","unstructured":"[18] Cadence Voltus IC Power Integrity Solution version 21.14-s111_1.https:\/\/www.cadence.com"},{"key":"e_1_3_2_1_19_1","unstructured":"[19] Cadence Innovus Implementation System version 21.1.https:\/\/www.cadence.com"}],"event":{"name":"GLSVLSI '24: Great Lakes Symposium on VLSI 2024","location":"Clearwater FL USA","acronym":"GLSVLSI '24","sponsor":["SIGDA ACM Special Interest Group on Design Automation"]},"container-title":["Proceedings of the Great Lakes Symposium on VLSI 2024"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3649476.3658727","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3649476.3658727","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,22]],"date-time":"2025-08-22T02:33:02Z","timestamp":1755829982000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3649476.3658727"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,6,12]]},"references-count":19,"alternative-id":["10.1145\/3649476.3658727","10.1145\/3649476"],"URL":"https:\/\/doi.org\/10.1145\/3649476.3658727","relation":{},"subject":[],"published":{"date-parts":[[2024,6,12]]},"assertion":[{"value":"2024-06-12","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}