{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T18:45:54Z","timestamp":1755801954126,"version":"3.44.0"},"publisher-location":"New York, NY, USA","reference-count":10,"publisher":"ACM","license":[{"start":{"date-parts":[[2023,10,20]],"date-time":"2023-10-20T00:00:00Z","timestamp":1697760000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2023,10,20]]},"DOI":"10.1145\/3650400.3650515","type":"proceedings-article","created":{"date-parts":[[2024,4,17]],"date-time":"2024-04-17T08:33:18Z","timestamp":1713342798000},"page":"692-697","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Analysis about High-Speed Trace in PCB of Glass-Weave: The effect of the PCB of Glass-Weave on insertion loss, impedance and phase of high-speed trace"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-0718-8411","authenticated-orcid":false,"given":"Long","family":"Sun","sequence":"first","affiliation":[{"name":"Inspur Electronic Information Industry Co.,Ltd, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-1942-7133","authenticated-orcid":false,"given":"Bo","family":"Liu","sequence":"additional","affiliation":[{"name":"Inspur Electronic Information Industry Co.,Ltd, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-4532-1668","authenticated-orcid":false,"given":"Jin","family":"Liu","sequence":"additional","affiliation":[{"name":"Inspur Electronic Information Industry Co.,Ltd, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-9762-8255","authenticated-orcid":false,"given":"Minzheng","family":"Tian","sequence":"additional","affiliation":[{"name":"Inspur Electronic Information Industry Co.,Ltd, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-5506-1735","authenticated-orcid":false,"given":"Kunyang","family":"Wu","sequence":"additional","affiliation":[{"name":"Inspur Electronic Information Industry Co.,Ltd, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2024,4,17]]},"reference":[{"volume-title":"Entitled Signal and Power Integrity\u2014Simplified","key":"e_1_3_2_1_1_1","unstructured":"Eric Bogatin. 2018. Entitled Signal and Power Integrity\u2014Simplified. Pearson Education Group."},{"key":"e_1_3_2_1_2_1","first-page":"200","volume-title":"Cottbus","author":"Willemsen M.","year":"2020","unstructured":"M. Willemsen, J. Lei\u00df and M. Mart\u00ednez-V\u00e1zquez, \"Design and Verification of Teststructures for Complex Multilayer-PCB Trace,\" 2020 German Microwave Conference (GeMiC), Cottbus, Germany, 2020, pp. 200-203."},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2014.6899019"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.23919\/USNC-URSI51813.2021.9703528"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/EMC\/SI\/PI\/EMCEurope52599.2021.9559363"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2017.8077987"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2016.7835439"},{"volume-title":"etc. Simulation and analysis of via in immersion cooling server. Automation and instrumentation (in Chinese)","year":"2023","key":"e_1_3_2_1_8_1","unstructured":"Gong Wei, etc. Simulation and analysis of via in immersion cooling server. Automation and instrumentation (in Chinese), 2023 (7) : 260-264. doi: 10.14016"},{"key":"e_1_3_2_1_9_1","first-page":"1","volume":"29","year":"2021","unstructured":"Qiu Xiaohua qing-chun li, Li Yancheng, etc. Effect of Line Width and Glass Fiber Structure on Signal Loss in High-speed Circuit [J]. Printed Circuit Information, 2021, 29(S1):1-7.","journal-title":"Printed Circuit Information"},{"key":"e_1_3_2_1_10_1","volume-title":"Fiber Weave Intra-pair Skew Analysis and Mitigation on 32Gbps NRZ & 64Gbps PAM-4 [M]. DesignCon","author":"YAN","year":"2021","unstructured":"YAN C, ZHANG X, YE X, Fiber Weave Intra-pair Skew Analysis and Mitigation on 32Gbps NRZ & 64Gbps PAM-4 [M]. DesignCon. 2021."}],"event":{"name":"EITCE 2023: 2023 7th International Conference on Electronic Information Technology and Computer Engineering","acronym":"EITCE 2023","location":"Xiamen China"},"container-title":["Proceedings of the 2023 7th International Conference on Electronic Information Technology and Computer Engineering"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3650400.3650515","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3650400.3650515","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T05:09:14Z","timestamp":1755752954000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3650400.3650515"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,20]]},"references-count":10,"alternative-id":["10.1145\/3650400.3650515","10.1145\/3650400"],"URL":"https:\/\/doi.org\/10.1145\/3650400.3650515","relation":{},"subject":[],"published":{"date-parts":[[2023,10,20]]},"assertion":[{"value":"2024-04-17","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}