{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T11:32:36Z","timestamp":1763724756879,"version":"3.41.0"},"publisher-location":"New York, NY, USA","reference-count":26,"publisher":"ACM","license":[{"start":{"date-parts":[[2025,1,20]],"date-time":"2025-01-20T00:00:00Z","timestamp":1737331200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"Strategic Priority Research Program of Chinese Academy of Sciences","award":["XDB44000000"],"award-info":[{"award-number":["XDB44000000"]}]},{"name":"Anhui Provincial Natural Science Foundation","award":["2408085MF17"],"award-info":[{"award-number":["2408085MF17"]}]},{"name":"USTC Research Funds of the Double First- Class Initiative","award":["YD2100002012"],"award-info":[{"award-number":["YD2100002012"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2025,1,20]]},"DOI":"10.1145\/3658617.3697729","type":"proceedings-article","created":{"date-parts":[[2025,3,4]],"date-time":"2025-03-04T14:23:57Z","timestamp":1741098237000},"page":"900-906","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["ThePlace: Thermal-Aware Placement With Operator Learning-Based Ultra-Fast Simulator"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-4740-7899","authenticated-orcid":false,"given":"Xinfei","family":"Liu","sequence":"first","affiliation":[{"name":"Univ. of Science and Tech. of China, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2454-5561","authenticated-orcid":false,"given":"Siting","family":"Liu","sequence":"additional","affiliation":[{"name":"Chinese Univ. of Hong Kong, Hong Kong, Hong Kong"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6406-4810","authenticated-orcid":false,"given":"Bei","family":"Yu","sequence":"additional","affiliation":[{"name":"Chinese Univ. of Hong Kong, Hong Kong, Hong Kong"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0341-3428","authenticated-orcid":false,"given":"Song","family":"Chen","sequence":"additional","affiliation":[{"name":"Univ. of Science and Tech. of China, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0375-9800","authenticated-orcid":false,"given":"Qi","family":"Xu","sequence":"additional","affiliation":[{"name":"Univ. of Science and Tech. of China, Hefei, China"}]}],"member":"320","published-online":{"date-parts":[[2025,3,4]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"crossref","unstructured":"Z. Zhuang B. Yu K.-Y. Chao and T.-Y. Ho \"Multi-package co-design for chiplet integration \" in IEEE\/ACM International Conference on Computer-Aided Design (ICCAD) 2022 pp. 1--9.","DOI":"10.1145\/3508352.3549404"},{"key":"e_1_3_2_1_2_1","first-page":"669","volume-title":"Stress-driven 3D-IC placement with tsv keep-out zone and regularity study,\" in IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)","author":"Athikulwongse K.","year":"2010","unstructured":"K. Athikulwongse, A. Chakraborty, J.-S. Yang, D. Z. Pan, and S. K. Lim, \"Stress-driven 3D-IC placement with tsv keep-out zone and regularity study,\" in IEEE\/ACM International Conference on Computer-Aided Design (ICCAD), 2010, pp. 669--674."},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/3309544"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/43.828554"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2007.895754"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2293422"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2018.10.045"},{"key":"e_1_3_2_1_8_1","volume-title":"DeepONet: Learning nonlinear operators for identifying differential equations based on the universal approximation theorem of operators,\" arXiv preprint arXiv:1910.03193","author":"Lu L.","year":"2019","unstructured":"L. Lu, P. Jin, and G. E. Karniadakis, \"DeepONet: Learning nonlinear operators for identifying differential equations based on the universal approximation theorem of operators,\" arXiv preprint arXiv:1910.03193, 2019."},{"key":"e_1_3_2_1_9_1","volume-title":"Fourier neural operator for parametric partial differential equations,\" arXiv preprint arXiv:2010.08895","author":"Li Z.","year":"2020","unstructured":"Z. Li, N. Kovachki, K. Azizzadenesheli, B. Liu, K. Bhattacharya, A. Stuart, and A. Anandkumar, \"Fourier neural operator for parametric partial differential equations,\" arXiv preprint arXiv:2010.08895, 2020."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2432141"},{"key":"e_1_3_2_1_11_1","first-page":"71","volume-title":"Analytical thermal placement for VLSI lifetime improvement and minimum performance variation,\" in IEEE International Conference on Computer Design (ICCD)","author":"Kahng A. B.","year":"2007","unstructured":"A. B. Kahng, S.-M. Kang, W. Li, and B. Liu, \"Analytical thermal placement for VLSI lifetime improvement and minimum performance variation,\" in IEEE International Conference on Computer Design (ICCD), 2007, pp. 71--77."},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"crossref","unstructured":"J.-M. Lin T.-T. Chen Y.-F. Chang W.-Y. Chang Y.-T. Shyu Y.-J. Chang and J.-M. Lu \"A fast thermal-aware fixed-outline floorplanning methodology based on analytical models \" in IEEE\/ACM International Conference on Computer-Aided Design (ICCAD) 2018 pp. 1--8.","DOI":"10.1145\/3240765.3240769"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317803"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2006043"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/43.67789"},{"key":"e_1_3_2_1_16_1","first-page":"269","volume-title":"Generic global placement and floorplanning,\" in ACM\/IEEE Design Automation Conference (DAC)","author":"Eisenmann H.","year":"1998","unstructured":"H. Eisenmann and F. M. Johannes, \"Generic global placement and floorplanning,\" in ACM\/IEEE Design Automation Conference (DAC), 1998, pp. 269--274."},{"key":"e_1_3_2_1_17_1","volume-title":"Non-linear optimization system and method for wire length and delay optimization for an automatic electric circuit placer","author":"Naylor W. C.","year":"2001","unstructured":"W. C. Naylor, R. Donelly, and L. Sha, \"Non-linear optimization system and method for wire length and delay optimization for an automatic electric circuit placer,\" Oct. 9 2001, US Patent 6,301,693."},{"key":"e_1_3_2_1_18_1","first-page":"664","volume-title":"TSV-aware analytical placement for 3D IC designs,\" in ACM\/IEEE Design Automation Conference (DAC)","author":"Hsu M.-K.","year":"2011","unstructured":"M.-K. Hsu, Y.-W. Chang, and V. Balabanov, \"TSV-aware analytical placement for 3D IC designs,\" in ACM\/IEEE Design Automation Conference (DAC), 2011, pp. 664--669."},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1145\/2699873"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"crossref","unstructured":"W. Zhu Z. Huang J. Chen and Y.-W. Chang \"Analytical solution of poisson's equation and its application to vlsi global placement \" in IEEE\/ACM International Conference on Computer-Aided Design (ICCAD) 2018 pp. 1--8.","DOI":"10.1145\/3240765.3240779"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10107-012-0629-5"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1109\/72.392253"},{"key":"e_1_3_2_1_23_1","unstructured":"\"ANSYS Icepak Softeware \" https:\/\/www.ansys.com\/zh-cn\/products\/electronics\/ansys-icepak."},{"key":"e_1_3_2_1_24_1","unstructured":"A. N. Ng R. Aggarwal V. Ramachandran and I. L. Markov \"ISPD-IBM Benchmarks \" http:\/\/vlsicad.eecs.umich.edu\/BK\/Slots\/cache\/www.public.iastate.edu\/~nataraj\/ISPD04_Bench.html."},{"key":"e_1_3_2_1_25_1","volume-title":"DeVito et al., \"Automatic differentiation in PyTorch,\" in NIPS Workshop","author":"Paszke A.","year":"2017","unstructured":"A. Paszke, S. Gross, S. Chintala, G. Chanan, E. Yang, Z. DeVito et al., \"Automatic differentiation in PyTorch,\" in NIPS Workshop, 2017."},{"key":"e_1_3_2_1_26_1","first-page":"878","volume-title":"Compact thermal modeling for temperature-aware design,\" in ACM\/IEEE Design Automation Conference (DAC)","author":"Huang W.","year":"2004","unstructured":"W. Huang, M. R. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, and S. Velusam, \"Compact thermal modeling for temperature-aware design,\" in ACM\/IEEE Design Automation Conference (DAC), 2004, pp. 878--883."}],"event":{"name":"ASPDAC '25: 30th Asia and South Pacific Design Automation Conference","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEICE","IPSJ","IEEE CAS","IEEE CEDA"],"location":"Tokyo Japan","acronym":"ASPDAC '25"},"container-title":["Proceedings of the 30th Asia and South Pacific Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3658617.3697729","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3658617.3697729","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:17:49Z","timestamp":1750295869000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3658617.3697729"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1,20]]},"references-count":26,"alternative-id":["10.1145\/3658617.3697729","10.1145\/3658617"],"URL":"https:\/\/doi.org\/10.1145\/3658617.3697729","relation":{},"subject":[],"published":{"date-parts":[[2025,1,20]]},"assertion":[{"value":"2025-03-04","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}