{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T15:38:00Z","timestamp":1781797080064,"version":"3.54.5"},"publisher-location":"New York, NY, USA","reference-count":16,"publisher":"ACM","license":[{"start":{"date-parts":[[2025,1,20]],"date-time":"2025-01-20T00:00:00Z","timestamp":1737331200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2025,1,20]]},"DOI":"10.1145\/3658617.3697754","type":"proceedings-article","created":{"date-parts":[[2025,3,4]],"date-time":"2025-03-04T14:32:21Z","timestamp":1741098741000},"page":"628-634","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["Efficient ML-Based Transient Thermal Prediction for 3D-ICs"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0003-4334-9050","authenticated-orcid":false,"given":"Yun-Feng","family":"Yang","sequence":"first","affiliation":[{"name":"National Taiwan Univ., Taipei, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-8114-4223","authenticated-orcid":false,"given":"Wei-Shen","family":"Wang","sequence":"additional","affiliation":[{"name":"National Taiwan Univ., Taipei, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-2983-023X","authenticated-orcid":false,"given":"Yung-Jen","family":"Lee","sequence":"additional","affiliation":[{"name":"National Taiwan Univ., Taipei, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4393-5186","authenticated-orcid":false,"given":"James Chien-Mo","family":"Li","sequence":"additional","affiliation":[{"name":"National Taiwan Univ., Taipei, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2524-0935","authenticated-orcid":false,"given":"Norman","family":"Chang","sequence":"additional","affiliation":[{"name":"Ansys, San Jose, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3649-771X","authenticated-orcid":false,"given":"Akhilesh","family":"Kumar","sequence":"additional","affiliation":[{"name":"Ansys, San Jose, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-3793-3072","authenticated-orcid":false,"given":"Ying-Shiun","family":"Li","sequence":"additional","affiliation":[{"name":"Ansys, San Jose, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-8469-1720","authenticated-orcid":false,"given":"Jessica","family":"Yen","sequence":"additional","affiliation":[{"name":"Ansys, San Jose, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7432-6722","authenticated-orcid":false,"given":"Lang","family":"Lin","sequence":"additional","affiliation":[{"name":"Ansys, San Jose, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2025,3,4]]},"reference":[{"key":"e_1_3_2_1_1_1","volume-title":"Introduction to Heat Transfer","author":"Bergman T.L.","unstructured":"T.L. Bergman, A.S. Lavine, F.P. Incropera, and D.P. DeWitt. 2011. Introduction to Heat Transfer. Wiley, US. https:\/\/books.google.com.tw\/books?id=YBaNaLurTD4C"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/2939672.2939785"},{"key":"e_1_3_2_1_3_1","volume-title":"Thermal and IR Drop Analysis Using Convolutional Encoder-Decoder Networks. In 2021 26th Asia and South Pacific Design Automation Conference (ASP-DAC). IEEE","author":"Chhabria Vidya A.","unstructured":"Vidya A. Chhabria, Vipul Ahuja, Ashwath Prabhu, Nikhil Patil, Palkesh Jain, and Sachin S. Sapatnekar. 2021. Thermal and IR Drop Analysis Using Convolutional Encoder-Decoder Networks. In 2021 26th Asia and South Pacific Design Automation Conference (ASP-DAC). IEEE, Tokyo, Japan, 690--696."},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1145\/3240765.3240823"},{"key":"e_1_3_2_1_5_1","volume-title":"RedHawk-SC-Electrothermal User Manual","author":"Ansys Inc. 2024.","unstructured":"Ansys Inc. 2024. RedHawk-SC-Electrothermal User Manual. San Jose, CA, USA."},{"key":"e_1_3_2_1_6_1","volume-title":"Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning. In 2020 IEEE\/ACM International Conference On Computer Aided Design (ICCAD). IEEE","author":"Jin Wentian","unstructured":"Wentian Jin, Sheriff Sadiqbatcha, Jinwei Zhang, and Sheldon X.-D. Tan. 2020. Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning. In 2020 IEEE\/ACM International Conference On Computer Aided Design (ICCAD). IEEE, San Diego, CA, USA, 1--9."},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165027"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC57175.2023.10154977"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-DAT54769.2022.9768082"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/ITC51656.2023.00037"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247998"},{"key":"e_1_3_2_1_12_1","unstructured":"Ann Mutschler. 2018. New Thermal Issues Emerge. Semiconductor Engineering."},{"key":"e_1_3_2_1_13_1","unstructured":"Carl Peach and Yi Zhang. 2019. Protecting AI Chips from Thermal Challenges during ATE Test. Evaluation Engineering Magazine."},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/MLCAD55463.2022.9900086"},{"key":"e_1_3_2_1_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2013.127"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1145\/3309544","article-title":"A survey of chip-level thermal simulators","volume":"52","author":"Sultan Hameedah","year":"2019","unstructured":"Hameedah Sultan, Anjali Chauhan, and Smruti R Sarangi. 2019. A survey of chip-level thermal simulators. ACM Computing Surveys (CSUR) 52, 2 (2019), 1--35.","journal-title":"ACM Computing Surveys (CSUR)"}],"event":{"name":"ASPDAC '25: 30th Asia and South Pacific Design Automation Conference","location":"Tokyo Japan","acronym":"ASPDAC '25","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEICE","IPSJ","IEEE CAS","IEEE CEDA"]},"container-title":["Proceedings of the 30th Asia and South Pacific Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3658617.3697754","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3658617.3697754","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:17:50Z","timestamp":1750295870000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3658617.3697754"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1,20]]},"references-count":16,"alternative-id":["10.1145\/3658617.3697754","10.1145\/3658617"],"URL":"https:\/\/doi.org\/10.1145\/3658617.3697754","relation":{},"subject":[],"published":{"date-parts":[[2025,1,20]]},"assertion":[{"value":"2025-03-04","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}