{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,11]],"date-time":"2026-03-11T16:39:32Z","timestamp":1773247172742,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":12,"publisher":"ACM","license":[{"start":{"date-parts":[[2025,1,20]],"date-time":"2025-01-20T00:00:00Z","timestamp":1737331200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"The Hong Kong Jockey Club Charities Trust"},{"name":"Research Grants Council of Hong Kong SAR","award":["CUHK14211324"],"award-info":[{"award-number":["CUHK14211324"]}]},{"name":"Department of Science and Technology of Guangdong Province","award":["2021B1101270003"],"award-info":[{"award-number":["2021B1101270003"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2025,1,20]]},"DOI":"10.1145\/3658617.3703133","type":"proceedings-article","created":{"date-parts":[[2025,3,4]],"date-time":"2025-03-04T14:32:21Z","timestamp":1741098741000},"page":"279-284","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":2,"title":["Fast Routing Algorithm for Mask Stitching Region of Ultra Large Wafer Scale Integration"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2972-8770","authenticated-orcid":false,"given":"Zhen","family":"Zhuang","sequence":"first","affiliation":[{"name":"Chinese Univ. of Hong Kong, Shatin, Hong Kong"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5174-8762","authenticated-orcid":false,"given":"Quan","family":"Chen","sequence":"additional","affiliation":[{"name":"Southern Univ. of Science and Tech., Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2674-4118","authenticated-orcid":false,"given":"Hao","family":"Yu","sequence":"additional","affiliation":[{"name":"Southern Univ. of Science and Tech., Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7348-5625","authenticated-orcid":false,"given":"Tsung-Yi","family":"Ho","sequence":"additional","affiliation":[{"name":"Chinese Univ. of Hong Kong, Shatin, Hong Kong"}]}],"member":"320","published-online":{"date-parts":[[2025,3,4]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"crossref","unstructured":"I. Lee S. Nam S. Kim S. Shin Y. Kim S.-K. Seo H. J. Yu and D.-W. Kim \"Extremely Large 3.5D Heterogeneous Integration for the Next-Generation Packaging Technology \" in Proceedings of IEEE Electronic Components and Technology Conference (ECTC) pp. 893--898 2023.","DOI":"10.1109\/ECTC51909.2023.00154"},{"key":"e_1_3_2_1_2_1","first-page":"510","volume-title":"Proceedings of IEEE Electronic Components and Technology Conference (ECTC)","author":"Hou S. Y.","year":"2023","unstructured":"S. Y. Hou, C. H. Lee, T.-D. Wang, H. C. Hou, and H.-P. Hu, \"Supercarrier Redistribution Layers to Realize Ultra Large 2.5 D Wafer Scale Packaging by CoWoS,\" in Proceedings of IEEE Electronic Components and Technology Conference (ECTC), pp. 510--514, 2023."},{"key":"e_1_3_2_1_3_1","unstructured":"TSMC CoWoS. https:\/\/3dfabric.tsmc.com\/english\/dedicated-Foundry\/technology\/cowos.htm."},{"key":"e_1_3_2_1_4_1","author":"Broadcom TSMC","year":"2020","unstructured":"TSMC and Broadcom Enhance the CoWoS Platform with World's First 2X Reticle Size Interposer. News. 2020. https:\/\/pr.tsmc.com\/english\/news\/2026.","journal-title":"Interposer. News."},{"key":"e_1_3_2_1_5_1","first-page":"1022","volume-title":"CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package,\" in Proceedings of IEEE Electronic Components and Technology Conference (ECTC)","author":"Hu Y.-C.","year":"2023","unstructured":"Y.-C. Hu, Y.-M. Liang, H.-P. Hu, C.-Y. Tan, C.-T. Shen, C.-H. Lee, and S. Y. Hou, \"CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package,\" in Proceedings of IEEE Electronic Components and Technology Conference (ECTC), pp. 1022--1026, 2023."},{"key":"e_1_3_2_1_6_1","first-page":"101","volume-title":"Wafer Level System Integration of the Fifth Generation CoWoS\u00ae-S with High Performance Si Interposer at 2500 mm2,\" in Proceedings of IEEE Electronic Components and Technology Conference (ECTC)","author":"Huang P. K.","year":"2021","unstructured":"P. K. Huang, C. Y. Lu, W. H. Wei, C. Chiu, K. C. Ting, C. Hu, C.H. Tsai, S. Y. Hou, W. C. Chiou, C. T. Wang, and D. Yu, \"Wafer Level System Integration of the Fifth Generation CoWoS\u00ae-S with High Performance Si Interposer at 2500 mm2,\" in Proceedings of IEEE Electronic Components and Technology Conference (ECTC), pp. 101--104, 2021."},{"key":"e_1_3_2_1_7_1","first-page":"1998","volume-title":"Proceedings of IEEE Electronic Components and Technology Conference (ECTC)","author":"Nam S.","year":"2021","unstructured":"S. Nam, Y. Kim, A. Jang, I. Hwang, S. Park, S.-C. Lee, and D.-W. Kim, \"The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability,\" in Proceedings of IEEE Electronic Components and Technology Conference (ECTC), pp. 1998--2002, 2021."},{"issue":"10","key":"e_1_3_2_1_8_1","first-page":"4071","volume":"64","author":"Hou S. Y.","year":"2017","unstructured":"S. Y. Hou, W. C. Chen, C. Hu, C. Chiu, K. C. Ting, T. S. Lin, W. H. Wei, W. C. Chiou, V. J. C. Lin, V. C. Y. Chang, C. T. Wang, C. H. Wu, and D. Yu, \"Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology,\" in IEEE Transactions on Electron Devices, vol. 64, no. 10, pp. 4071--4077, 2017.","journal-title":"\"Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology,\" in IEEE Transactions on Electron Devices"},{"key":"e_1_3_2_1_9_1","doi-asserted-by":"crossref","unstructured":"M. Gnan D. S. Macintyre M. Sorel R. M. De La Rue and S. Thoms \"Enhanced Stitching for the Fabrication of Photonic Structures by Electron Beam Lithography \" in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing Measurement and Phenomena vol. 25 no. 6 pp. 2034--2037 2007.","DOI":"10.1116\/1.2800325"},{"key":"e_1_3_2_1_10_1","first-page":"331","volume-title":"Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC)","author":"Chiang C.-H.","year":"2020","unstructured":"C.-H. Chiang, F.-Y. Chuang, and Y.-W. Chang, \"Unified Redistribution Layer Routing for 2.5D IC Packages,\" in Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 331--337, 2020."},{"key":"e_1_3_2_1_11_1","first-page":"1","volume-title":"Proceedings of ACM\/IEEE Design Automation Conference (DAC)","author":"Wen H.-T.","year":"2020","unstructured":"H.-T. Wen, Y.-J. Cai, Y. Hsu, and Y.-W. Chang, \"Via-based Redistribution Layer Routing for InFO Packages with Irregular Pad Structures,\" in Proceedings of ACM\/IEEE Design Automation Conference (DAC), pp. 1--6, 2020."},{"key":"e_1_3_2_1_12_1","first-page":"1147","volume-title":"Proceedings of ACM\/IEEE Design Automation Conference (DAC)","author":"Cai Y.-J.","year":"2021","unstructured":"Y.-J. Cai, Y. Hsu, and Y.-W. Chang, \"Simultaneous Pre- and Free-assignment Routing for Multiple Redistribution Layers with Irregular Vias,\" in Proceedings of ACM\/IEEE Design Automation Conference (DAC), pp. 1147--1152, 2021."}],"event":{"name":"ASPDAC '25: 30th Asia and South Pacific Design Automation Conference","location":"Tokyo Japan","acronym":"ASPDAC '25","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEICE","IPSJ","IEEE CAS","IEEE CEDA"]},"container-title":["Proceedings of the 30th Asia and South Pacific Design Automation Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3658617.3703133","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3658617.3703133","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:17:53Z","timestamp":1750295873000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3658617.3703133"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1,20]]},"references-count":12,"alternative-id":["10.1145\/3658617.3703133","10.1145\/3658617"],"URL":"https:\/\/doi.org\/10.1145\/3658617.3703133","relation":{},"subject":[],"published":{"date-parts":[[2025,1,20]]},"assertion":[{"value":"2025-03-04","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}