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Archit. Code Optim."],"published-print":{"date-parts":[[2024,9,30]]},"abstract":"<jats:p>\n            For datacenter architects, it is the most important goal to minimize\n            <jats:italic>the datacenter\u2019s total cost of ownership for the target performance<\/jats:italic>\n            (i.e., TCO\/performance). As the major component of a datacenter is a server farm, the most effective way of reducing TCO\/performance is to improve the server\u2019s performance and power efficiency. To achieve the goal, we claim that it is highly promising to reduce each server\u2019s temperature to its most cost-effective point (or temperature scaling).\n          <\/jats:p>\n          <jats:p>\n            In this article, we propose\n            <jats:italic>CoolDC<\/jats:italic>\n            , a novel and immediately applicable low-temperature cooling method to minimize the datacenter\u2019s TCO. The key idea is to find and apply the most cost-effective sub-freezing temperature to target servers and workloads. For that purpose, we first apply the immersion cooling method to the entire servers to maintain a stable low temperature with little extra cooling and maintenance costs. Second, we define the TCO-optimal temperature for datacenter operation (e.g., 248K~273K (-25\u2103~0\u2103)) by carefully estimating all the costs and benefits at low temperatures. Finally, we propose CoolDC, our immersion-cooling datacenter architecture to run every workload at its own TCO-optimal temperature. By incorporating our low-temperature workload-aware temperature scaling, CoolDC achieves 12.7% and 13.4% lower TCO\/performance than the conventional air-cooled and immersion-cooled datacenters, respectively, without any modification to existing computers.\n          <\/jats:p>","DOI":"10.1145\/3664925","type":"journal-article","created":{"date-parts":[[2024,5,14]],"date-time":"2024-05-14T11:34:15Z","timestamp":1715686455000},"page":"1-27","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["CoolDC: A Cost-Effective Immersion-Cooled Datacenter with Workload-Aware Temperature Scaling"],"prefix":"10.1145","volume":"21","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4503-0823","authenticated-orcid":false,"given":"Dongmoon","family":"Min","sequence":"first","affiliation":[{"name":"Electrical and Computer Engineering, Seoul National University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3104-7437","authenticated-orcid":false,"given":"Ilkwon","family":"Byun","sequence":"additional","affiliation":[{"name":"Electrical and Computer Engineering, Seoul National University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7178-7117","authenticated-orcid":false,"given":"Gyu-Hyeon","family":"Lee","sequence":"additional","affiliation":[{"name":"Electrical and Computer Engineering, Seoul National University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2193-5748","authenticated-orcid":false,"given":"Jangwoo","family":"Kim","sequence":"additional","affiliation":[{"name":"Electrical and Computer Engineering, Seoul National University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2024,9,14]]},"reference":[{"key":"e_1_3_1_2_2","unstructured":"Adorama. 2024. 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